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null | the present invention is a method of compacting eps by bringing the eps in contact with a liquid composed of at least one component with solving power in respect of polystyrene and at least one component without solving power in respect of polystyrene . the following definitions apply to the invention : the phrase &# 34 ; component with solving power in respect of a polymer &# 34 ; means that a component has solving power if , in the liquid state , it weakens the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence and as a final consequence a one - phase system arises with fluid or semi - fluid properties , in which the molecules are , more or less , homogeneously distributed over the entire system volume . things to be considered include the temperature range in which the method is applied . in the examples &# 34 ; a component with solving power in respect of polystyrene &# 34 ; is simply referred to as &# 34 ; a solver &# 34 ;. the solver of polystyrene may be ( i ) an aromatic hydrocarbon constituted of 1 , 2 , 3 or 4 benzene rings with or without substitution in a nucleus or side chain thereof and homologues thereof ; ( ii ) an aromatic compound with keto -, ether - or ester structure ; ( iii ) a heterocyclic compound with one or more oxygen atoms in the ring ; ( iv ) an acyclic compound ; ( v ) an aliphatic ketone , ether or ester ;( vi ) an aliphatic unsaturated compound or ( vii ) a halogenated hydrocarbon . the phrase &# 34 ; component without solving power in respect of a polymer &# 34 ; means that component has no solving power if , in the liquid state , it is not capable of weakening the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence . what remains after prolonged time is a 2 - phase system comprised of an inactive liquid phase and an unaltered solid phase that may be somewhat swollen at the most due to the imbibition of liquid molecules in the polymer matrix . in the examples &# 34 ; a component without solving power in respect to polystyrene &# 34 ; is simply referred to as &# 34 ; a non - solver &# 34 ;. the non - solver of polystyrene may be ( i ) water , ( ii ) an aliphatic saturated monohydric alcohol or ( iii ) an aliphatic saturated hydrocarbon . it is the embodiment of the invention that by a convenient choice of the composing components and their mutual ratios the liquid obtains the following properties . eps , contacted with it , shrivels up but does not solve , on the contrary , what arises is a 2 - phase system characterized by the existence of a polymer phase that is very strongly reduced in volume which phase exits in a semifluid pasty or doughy state and that does not take up more liquid than necessary for the existence of said phase and by the existence of a polymer free liquid phase that , more or less , keeps the full power of absorbing freshly added eps in an unaltered fast rate . this is in contradistinction to real solvents in which the rate of take - up is fast in the beginning but which rate slows down gradually as the polymer concentration of the solution increases . there is a triangular interaction between polymer , solver component ( s ) and non - solver component ( s ). the solver molecules , on one hand , exhibit strong interaction with the polymer molecules , on the other hand , they show interactions with the non - solver molecules . the non - solver molecules , however , avoid interaction with the polymer molecules . the stable situation is not the homogeneous molecular distribution over the entire system volume but a limitation of the triangular interactions to a part of the system &# 39 ; s volume that is as small as possible and that , therefore , has maximum polymer concentration . in this situation the solver molecules are able to abolish the matrix structure of the polymer enabling said polymer to pass into the liquid state , but the presence of the non - solver molecules prevents a homogeneous distribution over the entire system volume . the properties of the semifluid polymer phase are adjustable by variation of the ratios of the composing components . at maximum percentage of a solver component the polymer phase has the lowest viscosity and to some extent exhibits sticky properties . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a maximum related to the chosen system . at maximum percentage of a non - solver component the polymer phase has the highest viscosity but no tendency to stickiness . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a minimum related to the chosen system . it is always possible to find a working range within those limits in which the polymer phase is optimal in respect of compacting rate , pumpability and tendency for the equipment to become filthy . the position of working range and limits are dependent on the temperature at which the method is carried out . in general , at higher temperatures there is a shift towards a higher share of non - solver component ( s ). 1 . the asorbtion of eps proceeds in an unaltered fast rate from the first up to the last addition . 2 . a location for compacting can always be disposed of the compact polymer phase at its maximum concentration without the need for total consumption of the liquid first . 3 . a tank - vehicle can , by pushing aside of phases , with the use of only one tank compartment withdraw the polymer phase and add back the make - up of compacting liquid at the same time and vice versa . 4 . a compacting unit is preferably provided with a sieve on which the eps is dumped . the compacted polymer phase sinks through the mesh while the coarse contaminations remain on top of the sieve without degenerating to a sticky mass . 5 . the polymer concentration being at a maximum ensures that in the connected processing the amount of liquid to be recovered is at a minimum . 6 . the stickiness of the compacted mass being at a minimum is advantageous in the performing of the method , the connected transport and the further processing of the said mass . 7 . the compacted polymer phase has good pumpability and can be withdrawn from solid contaminations by filtering . 8 . blowing agents , whenever present , can be solved in the polymer phase and thus be kept out of the environment . 9 . the invention makes possible a wide choice of the composing components , depending upon the market situation in respect of availability of components , the scale of performing the compacting method , the level of fire risk , operative environmental and safety requirements and the kind of the further processing of the compacted mass . 10 . the compacted mass is suitable for physical processing to ps as well as for chemical processing to styrene monomer and other chemical materials . 11 . by a suitable choice of the composing components of the liquid phase , these components can be recovered simply and nearly completely in the processing as stated above . the purpose of the invention shall be illustrated in the following examples , and it will be clear that the scope of the invention includes more than what is made explicit in the examples . to 100 gr methylethylketone , eps is added . at first the eps is absorbed by the liquid at a very fast rate , but , as the concentration of eps in the solution rises the rate of absorbtion slows down progressively . in the end the process stops at 50 - 55 gr eps absorbed . the highly viscous fluid mass exhibits very sticky properties . yet from the first addition of eps there is the origin of only one homogeneous phase in which the viscosity increases as more eps is added . comparable effects appear when use is made of , e . g ., styrene , toluene , ethylacetate , methylisobutylketone , 1 , 1 , 1 - trichloroethane , etc . concerns the effect of a liquid comprised of one solver and one non - solver . acetone , as it is sold in technical quality , contains about 0 . 3 % water . in this case there is the question of a system comprised of acetone being a solver and water being a non - solver . to 100 gr acetone of technical quality , eps is added . the eps is absorbed at a very fast rate , but , at present no homogeneous solution is obtained . a 2 - phase system is produced including in one phase , a compact semifluid polymer phase which is highly viscous but nevertheless has good fluid properties and a second polymer - free liquid phase that is capable for absorbing eps undiminished as fast as before . since part of the liquid is needed to bring about the fluid polymer phase , the available polymer - free liquid diminishes as the addition of eps continues . as soon as all the liquid is used up , a paste is obtained that contains 85 to 90 gr ps . this amount of ps has not been approached by whatever pure solvent system . the influence of water as a non - solver is extremely strong in this system as will be demonstrated in a later example . concerns the effect of other liquid systems , also again comprised of only one solver and one non - solver . 1 . to 90 gr methylethylketone , 10 gr water is added . eps is added to the thus obtained liquid . also in this case eps is absorbed in the liquid at a fast rate and a 2 - phase system is obtained comprised of a semifluid polymer phase and a polymer - free liquid phase , completely analogous with example 2 . the total amount of eps added , 80 to 85 gr , is comparable to the amount as with example 2 . 2 . liquid comprised of 25 % methanol ( non - solver ) and 75 % methylethylketone ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 3 . liquid comprised of 25 % methanol ( non - solver ) and 75 % ethylacetate ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 4 . liquid comprised of 85 % dioxane ( solver ) and 15 % water ( non - solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . concerns liquid systems comprised of one solver and more than one non - solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated semifluid polymer phase and a polymer - free liquid phase to which eps can be added until all liquid is used up . 1 . liquid comprised of 20 % toluene ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons with boiling range 107 ° c . to 138 ° c . all of which are non - solvers ). 2 . liquid comprised of 20 % 1 , 1 , 1 - trichloroethane ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons , all of which are non - solvers ). 3 . concerned is an example that shows that a system component in the pure state that does not necessarily have to be a liquid . to 80 gr refined spirit ( mixture of non - solvers ) is added 20 gr naphthalene ( solver ) that has been solved in the refined spirit by heating to 50 ° c . after cooling to ambient temperature the liquid behaves according to the invention . 4 . liquid comprised of 85 % refined spirit ( non - solvers ) and styrene ( solver ). concerned are liquid systems that are composed of one non - solver and more than one solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated polymer phase and a polymer - free liquid phase to which eps can be added continuously until all liquid has been used up . 1 . liquid comprised of 50 % isopropanol ( non - solver ), 20 % toluene ( solver ) and 30 % acetone ( solver ). 2 . liquid comprised of 10 % water ( non - solver ), 30 % styrene ( solver ) and 60 % acetone ( solver ). this example clearly shows how the extremely strong influence of water to the solving power of acetone , as will be shown in example 7 , can be forced back by the addition of a second solver with very high affinity towards ps . 100 gr of this liquid absorbs some 70 to 75 gr eps . concerned are systems comprised of more than one non - solver and more than one solver . all systems are characterized in that 2 - phase systems are obtained according to the invention . 1 . liquid comprised of 50 % refined spirit ( non - solvers ), 30 % acetone ( solver ) and 20 % toluene ( solver ). 2 . liquid comprised of 80 % refined spirit ( non - solvers ) and 20 % shellsol a ( a mixture of hydrocarbons that includes 98 % aromatics and which aromatics all belong to the solvers ). shellsol a has a boiling range of 166 ° c . to 185 ° c . liquid comprised of 40 % shellsol a ( 98 % aromatics , all solvers ) and 60 % white spirit d ( comprised of high boiling aliphatic hydrocarbons , all non - solvers ). white spirit d has a boiling range from 162 ° c . to 197 ° c . concerns the extreme influence of water ( non - solver ) in respect of acetone ( solver ) to the compacting power of this system . 1 . technical acetone contains 0 . 3 % water . this system has been examined in example 2 and it behaves completely according the invention . 2 . acetone whose water content is raised to 1 . 5 %. this system behaves completely according to the invention , hardly slower and 100 gr liquid absorbs some 80 to 85 gr eps . 3 . acetone whose water content is raised to 5 %. this system still behaves according to the invention but its activity has been diminished to a large extent . its activity is very slow and the obtained semifluid polymer phase has the consistency of dough that is hardly pumpable . 4 . acetone whose water content is raised to 15 %. this system behaves completely inactive . 5 . an example , at last , in which the water content of technical acetone has been lowered to less than 0 . 1 % by drying over silica gel . in this case a borderline case has been obtained in which a 2 - phase system still appears but the polymer phase has relatively low viscosity now and it also exhibits strong adhesive properties . the polymer phase is relatively transparent as compared to all other systems . concerns the influence of ratios and temperature in respect of certain systems that are completely composed of hydrocarbons . 1 . shellsol a ( mainly solvers ) and white spirit d ( totally non - solvers ), at which only the ratio is examined . in all cases 100 gr liquid absorbs some 90 gr eps . 35 % solvers and 65 % non - solvers . the process proceeds relatively slowly and the obtained polymer phase exists as a hardly pumpable dough that does not stick . 40 % solvers and 60 % non - solvers . the process proceeds faster and the polymer phase is more pumpable but still exhibits some tendency of stickiness . 45 % solvers and 65 % non - solvers . the system is optimal with respect of compacting rate , pumpability of polymer phase and acceptability of stickiness . 50 % solvers and 50 % non - solvers . the system behaves no longer in accordance with the invention . a homogeneous 1 - phase system is obtained with strong adhesive properties . 20 % styrene in refined spirit . the process is extremely fast and the obtained polymer phase has a relatively low viscosity . 10 % styrene in refined spirit . the process proceeds more slowly and the obtained polymer phase is highly viscous . 5 % styrene in refined spirit . the process is very slow and the obtained polymer phase has the consistency of a tough dough . 5 % styrene but the liquid is heated to 50 ° c . the process is as fast as in the case of 10 % styrene and the obtained polymer phase has a viscosity comparable to that case . a . 20 % naphthalene and 50 ° c . : very fast with polymer phase of very low viscosity and highly adhesive . b . same as a . but at ambient temperature : less fast and strong , yet good pumpable dough with less stickiness . c . 10 % naphthalene and 50 ° c . : very fast and better quality paste as with a . d . same as c . but at ambient temperature : slow process and tough dough . e . 5 % naphthalene and 50 ° c . : fast process and sturdy paste with low stickiness . f . same as e . but at ambient temperature : very slow process and very tough dough , less useful system to perform the method . in this case a variant of the method is concerned in which a liquid according to the invention and comprised of hydrocarbons is emulgated in water . to a liquid according to the invention , comprised of 20 gr shellsol a and 80 gr refined spirit , 20 gr oleic acid is added . while stirring , this mixture is added to 300 gr water in which sufficient spirit of ammonia is present to build a stable yet non - foaming emulsion . the thus obtained emulsion is more fire - safe than the use of pure hydrocarbon mixtures and also absorbs eps in that a milky - white homogeneous emulsion is obtained comprised of a countless number of microscopic systems that act according to the invention . the milky - white emulsion can be charged with eps to saturation and nevertheless remains of low viscosity . after charge , the emulsion is broken by neutralizing the system with diluted hydrochloric acid . after a first coalescence that leads to a separation in a water phase and an organic phase , the latter again shows a phenomenon of coacervation in that the highly concentrated polymer phase separates from the polymer - free organic phase . this organic phase does not absorb any additional eps and again can be emulgated with water containing ammonia . apparently the oleic acid molecules with the saturated aliphatics have created a phase that is widely disposed of aromatics . when the aromatic content of this phase is adjusted , the emulsion again behaves in accordance with the invention . concerned is the transport of paste and compacting liquid in one and the same tank component . in general the polymer phases obtained according the invention have higher densities than the compacting liquid itself , causing the semifluid polymer phase to collect at the bottom of a tank compartment . this fact offers the opportunity to use only one tank compartment to transport both compacting liquid and polymer phase . a transport vessel , total volume 30 ltrs , is filled with 15 ltrs compacting liquid . next a collecting tank , having a storage of paste on its bottom , is connected to this vessel and well in such a way that both bottoms are communicating . the transport vessel is provided with a so called &# 34 ; floating inlet &# 34 ; that enables the compacting liquid to be transferred by pumping to the collecting tank in that the level of the suction inlet is automatically adapted to the liquid level in the transport vessel . then the paste in the collecting tank is transferred by pumping to the transport vessel while at the same time a fresh supply of compacting liquid is transferred from transport vessel to collecting tank in an amount that compensates for the liquid withdrawn with the paste . 20 kg of the polymer paste obtained in example 4 , sub 1 is sucked in by a screw pump and pressed through a filtering unit . next the mass is transferred to a vacuum chamber by a conveyor screw during which passage the temperature of the mass is raised to over the melting temperature of ps , in order to degas the mass . the sucked off gases are condensed to recover the liquid . next the degassed polymer is withdrawn from the degassing chamber by an extrusion screw and processed to granules for injection molding via pressing through a strandforming die . concerns the processing of the obtained compacted mass to monomer styrene and other chemical materials . to 400 gr technical acetone , 0 . 5 % water being present in it , is added 360 gr eps , being the maximum amount the liquid can absorb . 760 gr paste is obtained . from this , 570 gr is submitted to pyrolysis , from which 550 gr pyrolysis oil is obtained . by separation of this oil in a distillation column is obtained : 0 . 53 mass % acetone , fit for reuse in accordance with the invention , 10 mass % other distillates with boiling points up to 155 ° c . and the thus obtained monomer styrene can be polymerized to clear ps conveniently . | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 4908d47438fac7a307c999a5d406e59ac30cd1aee85218064f5a1143f68e64a5 | 0.217773 | 0.002548 | 0.06543 | 0.000668 | 0.164063 | 0.014526 |
null | the present invention is a method of compacting eps by bringing the eps in contact with a liquid composed of at least one component with solving power in respect of polystyrene and at least one component without solving power in respect of polystyrene . the following definitions apply to the invention : the phrase &# 34 ; component with solving power in respect of a polymer &# 34 ; means that a component has solving power if , in the liquid state , it weakens the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence and as a final consequence a one - phase system arises with fluid or semi - fluid properties , in which the molecules are , more or less , homogeneously distributed over the entire system volume . things to be considered include the temperature range in which the method is applied . in the examples &# 34 ; a component with solving power in respect of polystyrene &# 34 ; is simply referred to as &# 34 ; a solver &# 34 ;. the solver of polystyrene may be ( i ) an aromatic hydrocarbon constituted of 1 , 2 , 3 or 4 benzene rings with or without substitution in a nucleus or side chain thereof and homologues thereof ; ( ii ) an aromatic compound with keto -, ether - or ester structure ; ( iii ) a heterocyclic compound with one or more oxygen atoms in the ring ; ( iv ) an acyclic compound ; ( v ) an aliphatic ketone , ether or ester ;( vi ) an aliphatic unsaturated compound or ( vii ) a halogenated hydrocarbon . the phrase &# 34 ; component without solving power in respect of a polymer &# 34 ; means that component has no solving power if , in the liquid state , it is not capable of weakening the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence . what remains after prolonged time is a 2 - phase system comprised of an inactive liquid phase and an unaltered solid phase that may be somewhat swollen at the most due to the imbibition of liquid molecules in the polymer matrix . in the examples &# 34 ; a component without solving power in respect to polystyrene &# 34 ; is simply referred to as &# 34 ; a non - solver &# 34 ;. the non - solver of polystyrene may be ( i ) water , ( ii ) an aliphatic saturated monohydric alcohol or ( iii ) an aliphatic saturated hydrocarbon . it is the embodiment of the invention that by a convenient choice of the composing components and their mutual ratios the liquid obtains the following properties . eps , contacted with it , shrivels up but does not solve , on the contrary , what arises is a 2 - phase system characterized by the existence of a polymer phase that is very strongly reduced in volume which phase exits in a semifluid pasty or doughy state and that does not take up more liquid than necessary for the existence of said phase and by the existence of a polymer free liquid phase that , more or less , keeps the full power of absorbing freshly added eps in an unaltered fast rate . this is in contradistinction to real solvents in which the rate of take - up is fast in the beginning but which rate slows down gradually as the polymer concentration of the solution increases . there is a triangular interaction between polymer , solver component ( s ) and non - solver component ( s ). the solver molecules , on one hand , exhibit strong interaction with the polymer molecules , on the other hand , they show interactions with the non - solver molecules . the non - solver molecules , however , avoid interaction with the polymer molecules . the stable situation is not the homogeneous molecular distribution over the entire system volume but a limitation of the triangular interactions to a part of the system &# 39 ; s volume that is as small as possible and that , therefore , has maximum polymer concentration . in this situation the solver molecules are able to abolish the matrix structure of the polymer enabling said polymer to pass into the liquid state , but the presence of the non - solver molecules prevents a homogeneous distribution over the entire system volume . the properties of the semifluid polymer phase are adjustable by variation of the ratios of the composing components . at maximum percentage of a solver component the polymer phase has the lowest viscosity and to some extent exhibits sticky properties . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a maximum related to the chosen system . at maximum percentage of a non - solver component the polymer phase has the highest viscosity but no tendency to stickiness . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a minimum related to the chosen system . it is always possible to find a working range within those limits in which the polymer phase is optimal in respect of compacting rate , pumpability and tendency for the equipment to become filthy . the position of working range and limits are dependent on the temperature at which the method is carried out . in general , at higher temperatures there is a shift towards a higher share of non - solver component ( s ). 1 . the asorbtion of eps proceeds in an unaltered fast rate from the first up to the last addition . 2 . a location for compacting can always be disposed of the compact polymer phase at its maximum concentration without the need for total consumption of the liquid first . 3 . a tank - vehicle can , by pushing aside of phases , with the use of only one tank compartment withdraw the polymer phase and add back the make - up of compacting liquid at the same time and vice versa . 4 . a compacting unit is preferably provided with a sieve on which the eps is dumped . the compacted polymer phase sinks through the mesh while the coarse contaminations remain on top of the sieve without degenerating to a sticky mass . 5 . the polymer concentration being at a maximum ensures that in the connected processing the amount of liquid to be recovered is at a minimum . 6 . the stickiness of the compacted mass being at a minimum is advantageous in the performing of the method , the connected transport and the further processing of the said mass . 7 . the compacted polymer phase has good pumpability and can be withdrawn from solid contaminations by filtering . 8 . blowing agents , whenever present , can be solved in the polymer phase and thus be kept out of the environment . 9 . the invention makes possible a wide choice of the composing components , depending upon the market situation in respect of availability of components , the scale of performing the compacting method , the level of fire risk , operative environmental and safety requirements and the kind of the further processing of the compacted mass . 10 . the compacted mass is suitable for physical processing to ps as well as for chemical processing to styrene monomer and other chemical materials . 11 . by a suitable choice of the composing components of the liquid phase , these components can be recovered simply and nearly completely in the processing as stated above . the purpose of the invention shall be illustrated in the following examples , and it will be clear that the scope of the invention includes more than what is made explicit in the examples . to 100 gr methylethylketone , eps is added . at first the eps is absorbed by the liquid at a very fast rate , but , as the concentration of eps in the solution rises the rate of absorbtion slows down progressively . in the end the process stops at 50 - 55 gr eps absorbed . the highly viscous fluid mass exhibits very sticky properties . yet from the first addition of eps there is the origin of only one homogeneous phase in which the viscosity increases as more eps is added . comparable effects appear when use is made of , e . g ., styrene , toluene , ethylacetate , methylisobutylketone , 1 , 1 , 1 - trichloroethane , etc . concerns the effect of a liquid comprised of one solver and one non - solver . acetone , as it is sold in technical quality , contains about 0 . 3 % water . in this case there is the question of a system comprised of acetone being a solver and water being a non - solver . to 100 gr acetone of technical quality , eps is added . the eps is absorbed at a very fast rate , but , at present no homogeneous solution is obtained . a 2 - phase system is produced including in one phase , a compact semifluid polymer phase which is highly viscous but nevertheless has good fluid properties and a second polymer - free liquid phase that is capable for absorbing eps undiminished as fast as before . since part of the liquid is needed to bring about the fluid polymer phase , the available polymer - free liquid diminishes as the addition of eps continues . as soon as all the liquid is used up , a paste is obtained that contains 85 to 90 gr ps . this amount of ps has not been approached by whatever pure solvent system . the influence of water as a non - solver is extremely strong in this system as will be demonstrated in a later example . concerns the effect of other liquid systems , also again comprised of only one solver and one non - solver . 1 . to 90 gr methylethylketone , 10 gr water is added . eps is added to the thus obtained liquid . also in this case eps is absorbed in the liquid at a fast rate and a 2 - phase system is obtained comprised of a semifluid polymer phase and a polymer - free liquid phase , completely analogous with example 2 . the total amount of eps added , 80 to 85 gr , is comparable to the amount as with example 2 . 2 . liquid comprised of 25 % methanol ( non - solver ) and 75 % methylethylketone ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 3 . liquid comprised of 25 % methanol ( non - solver ) and 75 % ethylacetate ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 4 . liquid comprised of 85 % dioxane ( solver ) and 15 % water ( non - solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . concerns liquid systems comprised of one solver and more than one non - solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated semifluid polymer phase and a polymer - free liquid phase to which eps can be added until all liquid is used up . 1 . liquid comprised of 20 % toluene ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons with boiling range 107 ° c . to 138 ° c . all of which are non - solvers ). 2 . liquid comprised of 20 % 1 , 1 , 1 - trichloroethane ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons , all of which are non - solvers ). 3 . concerned is an example that shows that a system component in the pure state that does not necessarily have to be a liquid . to 80 gr refined spirit ( mixture of non - solvers ) is added 20 gr naphthalene ( solver ) that has been solved in the refined spirit by heating to 50 ° c . after cooling to ambient temperature the liquid behaves according to the invention . 4 . liquid comprised of 85 % refined spirit ( non - solvers ) and styrene ( solver ). concerned are liquid systems that are composed of one non - solver and more than one solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated polymer phase and a polymer - free liquid phase to which eps can be added continuously until all liquid has been used up . 1 . liquid comprised of 50 % isopropanol ( non - solver ), 20 % toluene ( solver ) and 30 % acetone ( solver ). 2 . liquid comprised of 10 % water ( non - solver ), 30 % styrene ( solver ) and 60 % acetone ( solver ). this example clearly shows how the extremely strong influence of water to the solving power of acetone , as will be shown in example 7 , can be forced back by the addition of a second solver with very high affinity towards ps . 100 gr of this liquid absorbs some 70 to 75 gr eps . concerned are systems comprised of more than one non - solver and more than one solver . all systems are characterized in that 2 - phase systems are obtained according to the invention . 1 . liquid comprised of 50 % refined spirit ( non - solvers ), 30 % acetone ( solver ) and 20 % toluene ( solver ). 2 . liquid comprised of 80 % refined spirit ( non - solvers ) and 20 % shellsol a ( a mixture of hydrocarbons that includes 98 % aromatics and which aromatics all belong to the solvers ). shellsol a has a boiling range of 166 ° c . to 185 ° c . liquid comprised of 40 % shellsol a ( 98 % aromatics , all solvers ) and 60 % white spirit d ( comprised of high boiling aliphatic hydrocarbons , all non - solvers ). white spirit d has a boiling range from 162 ° c . to 197 ° c . concerns the extreme influence of water ( non - solver ) in respect of acetone ( solver ) to the compacting power of this system . 1 . technical acetone contains 0 . 3 % water . this system has been examined in example 2 and it behaves completely according the invention . 2 . acetone whose water content is raised to 1 . 5 %. this system behaves completely according to the invention , hardly slower and 100 gr liquid absorbs some 80 to 85 gr eps . 3 . acetone whose water content is raised to 5 %. this system still behaves according to the invention but its activity has been diminished to a large extent . its activity is very slow and the obtained semifluid polymer phase has the consistency of dough that is hardly pumpable . 4 . acetone whose water content is raised to 15 %. this system behaves completely inactive . 5 . an example , at last , in which the water content of technical acetone has been lowered to less than 0 . 1 % by drying over silica gel . in this case a borderline case has been obtained in which a 2 - phase system still appears but the polymer phase has relatively low viscosity now and it also exhibits strong adhesive properties . the polymer phase is relatively transparent as compared to all other systems . concerns the influence of ratios and temperature in respect of certain systems that are completely composed of hydrocarbons . 1 . shellsol a ( mainly solvers ) and white spirit d ( totally non - solvers ), at which only the ratio is examined . in all cases 100 gr liquid absorbs some 90 gr eps . 35 % solvers and 65 % non - solvers . the process proceeds relatively slowly and the obtained polymer phase exists as a hardly pumpable dough that does not stick . 40 % solvers and 60 % non - solvers . the process proceeds faster and the polymer phase is more pumpable but still exhibits some tendency of stickiness . 45 % solvers and 65 % non - solvers . the system is optimal with respect of compacting rate , pumpability of polymer phase and acceptability of stickiness . 50 % solvers and 50 % non - solvers . the system behaves no longer in accordance with the invention . a homogeneous 1 - phase system is obtained with strong adhesive properties . 20 % styrene in refined spirit . the process is extremely fast and the obtained polymer phase has a relatively low viscosity . 10 % styrene in refined spirit . the process proceeds more slowly and the obtained polymer phase is highly viscous . 5 % styrene in refined spirit . the process is very slow and the obtained polymer phase has the consistency of a tough dough . 5 % styrene but the liquid is heated to 50 ° c . the process is as fast as in the case of 10 % styrene and the obtained polymer phase has a viscosity comparable to that case . a . 20 % naphthalene and 50 ° c . : very fast with polymer phase of very low viscosity and highly adhesive . b . same as a . but at ambient temperature : less fast and strong , yet good pumpable dough with less stickiness . c . 10 % naphthalene and 50 ° c . : very fast and better quality paste as with a . d . same as c . but at ambient temperature : slow process and tough dough . e . 5 % naphthalene and 50 ° c . : fast process and sturdy paste with low stickiness . f . same as e . but at ambient temperature : very slow process and very tough dough , less useful system to perform the method . in this case a variant of the method is concerned in which a liquid according to the invention and comprised of hydrocarbons is emulgated in water . to a liquid according to the invention , comprised of 20 gr shellsol a and 80 gr refined spirit , 20 gr oleic acid is added . while stirring , this mixture is added to 300 gr water in which sufficient spirit of ammonia is present to build a stable yet non - foaming emulsion . the thus obtained emulsion is more fire - safe than the use of pure hydrocarbon mixtures and also absorbs eps in that a milky - white homogeneous emulsion is obtained comprised of a countless number of microscopic systems that act according to the invention . the milky - white emulsion can be charged with eps to saturation and nevertheless remains of low viscosity . after charge , the emulsion is broken by neutralizing the system with diluted hydrochloric acid . after a first coalescence that leads to a separation in a water phase and an organic phase , the latter again shows a phenomenon of coacervation in that the highly concentrated polymer phase separates from the polymer - free organic phase . this organic phase does not absorb any additional eps and again can be emulgated with water containing ammonia . apparently the oleic acid molecules with the saturated aliphatics have created a phase that is widely disposed of aromatics . when the aromatic content of this phase is adjusted , the emulsion again behaves in accordance with the invention . concerned is the transport of paste and compacting liquid in one and the same tank component . in general the polymer phases obtained according the invention have higher densities than the compacting liquid itself , causing the semifluid polymer phase to collect at the bottom of a tank compartment . this fact offers the opportunity to use only one tank compartment to transport both compacting liquid and polymer phase . a transport vessel , total volume 30 ltrs , is filled with 15 ltrs compacting liquid . next a collecting tank , having a storage of paste on its bottom , is connected to this vessel and well in such a way that both bottoms are communicating . the transport vessel is provided with a so called &# 34 ; floating inlet &# 34 ; that enables the compacting liquid to be transferred by pumping to the collecting tank in that the level of the suction inlet is automatically adapted to the liquid level in the transport vessel . then the paste in the collecting tank is transferred by pumping to the transport vessel while at the same time a fresh supply of compacting liquid is transferred from transport vessel to collecting tank in an amount that compensates for the liquid withdrawn with the paste . 20 kg of the polymer paste obtained in example 4 , sub 1 is sucked in by a screw pump and pressed through a filtering unit . next the mass is transferred to a vacuum chamber by a conveyor screw during which passage the temperature of the mass is raised to over the melting temperature of ps , in order to degas the mass . the sucked off gases are condensed to recover the liquid . next the degassed polymer is withdrawn from the degassing chamber by an extrusion screw and processed to granules for injection molding via pressing through a strandforming die . concerns the processing of the obtained compacted mass to monomer styrene and other chemical materials . to 400 gr technical acetone , 0 . 5 % water being present in it , is added 360 gr eps , being the maximum amount the liquid can absorb . 760 gr paste is obtained . from this , 570 gr is submitted to pyrolysis , from which 550 gr pyrolysis oil is obtained . by separation of this oil in a distillation column is obtained : 0 . 53 mass % acetone , fit for reuse in accordance with the invention , 10 mass % other distillates with boiling points up to 155 ° c . and the thus obtained monomer styrene can be polymerized to clear ps conveniently . | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | Should this patent be classified under 'Physics'? | 0.25 | 4908d47438fac7a307c999a5d406e59ac30cd1aee85218064f5a1143f68e64a5 | 0.148438 | 0.039063 | 0.052734 | 0.003601 | 0.167969 | 0.022583 |
null | the present invention is a method of compacting eps by bringing the eps in contact with a liquid composed of at least one component with solving power in respect of polystyrene and at least one component without solving power in respect of polystyrene . the following definitions apply to the invention : the phrase &# 34 ; component with solving power in respect of a polymer &# 34 ; means that a component has solving power if , in the liquid state , it weakens the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence and as a final consequence a one - phase system arises with fluid or semi - fluid properties , in which the molecules are , more or less , homogeneously distributed over the entire system volume . things to be considered include the temperature range in which the method is applied . in the examples &# 34 ; a component with solving power in respect of polystyrene &# 34 ; is simply referred to as &# 34 ; a solver &# 34 ;. the solver of polystyrene may be ( i ) an aromatic hydrocarbon constituted of 1 , 2 , 3 or 4 benzene rings with or without substitution in a nucleus or side chain thereof and homologues thereof ; ( ii ) an aromatic compound with keto -, ether - or ester structure ; ( iii ) a heterocyclic compound with one or more oxygen atoms in the ring ; ( iv ) an acyclic compound ; ( v ) an aliphatic ketone , ether or ester ;( vi ) an aliphatic unsaturated compound or ( vii ) a halogenated hydrocarbon . the phrase &# 34 ; component without solving power in respect of a polymer &# 34 ; means that component has no solving power if , in the liquid state , it is not capable of weakening the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence . what remains after prolonged time is a 2 - phase system comprised of an inactive liquid phase and an unaltered solid phase that may be somewhat swollen at the most due to the imbibition of liquid molecules in the polymer matrix . in the examples &# 34 ; a component without solving power in respect to polystyrene &# 34 ; is simply referred to as &# 34 ; a non - solver &# 34 ;. the non - solver of polystyrene may be ( i ) water , ( ii ) an aliphatic saturated monohydric alcohol or ( iii ) an aliphatic saturated hydrocarbon . it is the embodiment of the invention that by a convenient choice of the composing components and their mutual ratios the liquid obtains the following properties . eps , contacted with it , shrivels up but does not solve , on the contrary , what arises is a 2 - phase system characterized by the existence of a polymer phase that is very strongly reduced in volume which phase exits in a semifluid pasty or doughy state and that does not take up more liquid than necessary for the existence of said phase and by the existence of a polymer free liquid phase that , more or less , keeps the full power of absorbing freshly added eps in an unaltered fast rate . this is in contradistinction to real solvents in which the rate of take - up is fast in the beginning but which rate slows down gradually as the polymer concentration of the solution increases . there is a triangular interaction between polymer , solver component ( s ) and non - solver component ( s ). the solver molecules , on one hand , exhibit strong interaction with the polymer molecules , on the other hand , they show interactions with the non - solver molecules . the non - solver molecules , however , avoid interaction with the polymer molecules . the stable situation is not the homogeneous molecular distribution over the entire system volume but a limitation of the triangular interactions to a part of the system &# 39 ; s volume that is as small as possible and that , therefore , has maximum polymer concentration . in this situation the solver molecules are able to abolish the matrix structure of the polymer enabling said polymer to pass into the liquid state , but the presence of the non - solver molecules prevents a homogeneous distribution over the entire system volume . the properties of the semifluid polymer phase are adjustable by variation of the ratios of the composing components . at maximum percentage of a solver component the polymer phase has the lowest viscosity and to some extent exhibits sticky properties . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a maximum related to the chosen system . at maximum percentage of a non - solver component the polymer phase has the highest viscosity but no tendency to stickiness . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a minimum related to the chosen system . it is always possible to find a working range within those limits in which the polymer phase is optimal in respect of compacting rate , pumpability and tendency for the equipment to become filthy . the position of working range and limits are dependent on the temperature at which the method is carried out . in general , at higher temperatures there is a shift towards a higher share of non - solver component ( s ). 1 . the asorbtion of eps proceeds in an unaltered fast rate from the first up to the last addition . 2 . a location for compacting can always be disposed of the compact polymer phase at its maximum concentration without the need for total consumption of the liquid first . 3 . a tank - vehicle can , by pushing aside of phases , with the use of only one tank compartment withdraw the polymer phase and add back the make - up of compacting liquid at the same time and vice versa . 4 . a compacting unit is preferably provided with a sieve on which the eps is dumped . the compacted polymer phase sinks through the mesh while the coarse contaminations remain on top of the sieve without degenerating to a sticky mass . 5 . the polymer concentration being at a maximum ensures that in the connected processing the amount of liquid to be recovered is at a minimum . 6 . the stickiness of the compacted mass being at a minimum is advantageous in the performing of the method , the connected transport and the further processing of the said mass . 7 . the compacted polymer phase has good pumpability and can be withdrawn from solid contaminations by filtering . 8 . blowing agents , whenever present , can be solved in the polymer phase and thus be kept out of the environment . 9 . the invention makes possible a wide choice of the composing components , depending upon the market situation in respect of availability of components , the scale of performing the compacting method , the level of fire risk , operative environmental and safety requirements and the kind of the further processing of the compacted mass . 10 . the compacted mass is suitable for physical processing to ps as well as for chemical processing to styrene monomer and other chemical materials . 11 . by a suitable choice of the composing components of the liquid phase , these components can be recovered simply and nearly completely in the processing as stated above . the purpose of the invention shall be illustrated in the following examples , and it will be clear that the scope of the invention includes more than what is made explicit in the examples . to 100 gr methylethylketone , eps is added . at first the eps is absorbed by the liquid at a very fast rate , but , as the concentration of eps in the solution rises the rate of absorbtion slows down progressively . in the end the process stops at 50 - 55 gr eps absorbed . the highly viscous fluid mass exhibits very sticky properties . yet from the first addition of eps there is the origin of only one homogeneous phase in which the viscosity increases as more eps is added . comparable effects appear when use is made of , e . g ., styrene , toluene , ethylacetate , methylisobutylketone , 1 , 1 , 1 - trichloroethane , etc . concerns the effect of a liquid comprised of one solver and one non - solver . acetone , as it is sold in technical quality , contains about 0 . 3 % water . in this case there is the question of a system comprised of acetone being a solver and water being a non - solver . to 100 gr acetone of technical quality , eps is added . the eps is absorbed at a very fast rate , but , at present no homogeneous solution is obtained . a 2 - phase system is produced including in one phase , a compact semifluid polymer phase which is highly viscous but nevertheless has good fluid properties and a second polymer - free liquid phase that is capable for absorbing eps undiminished as fast as before . since part of the liquid is needed to bring about the fluid polymer phase , the available polymer - free liquid diminishes as the addition of eps continues . as soon as all the liquid is used up , a paste is obtained that contains 85 to 90 gr ps . this amount of ps has not been approached by whatever pure solvent system . the influence of water as a non - solver is extremely strong in this system as will be demonstrated in a later example . concerns the effect of other liquid systems , also again comprised of only one solver and one non - solver . 1 . to 90 gr methylethylketone , 10 gr water is added . eps is added to the thus obtained liquid . also in this case eps is absorbed in the liquid at a fast rate and a 2 - phase system is obtained comprised of a semifluid polymer phase and a polymer - free liquid phase , completely analogous with example 2 . the total amount of eps added , 80 to 85 gr , is comparable to the amount as with example 2 . 2 . liquid comprised of 25 % methanol ( non - solver ) and 75 % methylethylketone ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 3 . liquid comprised of 25 % methanol ( non - solver ) and 75 % ethylacetate ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 4 . liquid comprised of 85 % dioxane ( solver ) and 15 % water ( non - solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . concerns liquid systems comprised of one solver and more than one non - solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated semifluid polymer phase and a polymer - free liquid phase to which eps can be added until all liquid is used up . 1 . liquid comprised of 20 % toluene ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons with boiling range 107 ° c . to 138 ° c . all of which are non - solvers ). 2 . liquid comprised of 20 % 1 , 1 , 1 - trichloroethane ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons , all of which are non - solvers ). 3 . concerned is an example that shows that a system component in the pure state that does not necessarily have to be a liquid . to 80 gr refined spirit ( mixture of non - solvers ) is added 20 gr naphthalene ( solver ) that has been solved in the refined spirit by heating to 50 ° c . after cooling to ambient temperature the liquid behaves according to the invention . 4 . liquid comprised of 85 % refined spirit ( non - solvers ) and styrene ( solver ). concerned are liquid systems that are composed of one non - solver and more than one solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated polymer phase and a polymer - free liquid phase to which eps can be added continuously until all liquid has been used up . 1 . liquid comprised of 50 % isopropanol ( non - solver ), 20 % toluene ( solver ) and 30 % acetone ( solver ). 2 . liquid comprised of 10 % water ( non - solver ), 30 % styrene ( solver ) and 60 % acetone ( solver ). this example clearly shows how the extremely strong influence of water to the solving power of acetone , as will be shown in example 7 , can be forced back by the addition of a second solver with very high affinity towards ps . 100 gr of this liquid absorbs some 70 to 75 gr eps . concerned are systems comprised of more than one non - solver and more than one solver . all systems are characterized in that 2 - phase systems are obtained according to the invention . 1 . liquid comprised of 50 % refined spirit ( non - solvers ), 30 % acetone ( solver ) and 20 % toluene ( solver ). 2 . liquid comprised of 80 % refined spirit ( non - solvers ) and 20 % shellsol a ( a mixture of hydrocarbons that includes 98 % aromatics and which aromatics all belong to the solvers ). shellsol a has a boiling range of 166 ° c . to 185 ° c . liquid comprised of 40 % shellsol a ( 98 % aromatics , all solvers ) and 60 % white spirit d ( comprised of high boiling aliphatic hydrocarbons , all non - solvers ). white spirit d has a boiling range from 162 ° c . to 197 ° c . concerns the extreme influence of water ( non - solver ) in respect of acetone ( solver ) to the compacting power of this system . 1 . technical acetone contains 0 . 3 % water . this system has been examined in example 2 and it behaves completely according the invention . 2 . acetone whose water content is raised to 1 . 5 %. this system behaves completely according to the invention , hardly slower and 100 gr liquid absorbs some 80 to 85 gr eps . 3 . acetone whose water content is raised to 5 %. this system still behaves according to the invention but its activity has been diminished to a large extent . its activity is very slow and the obtained semifluid polymer phase has the consistency of dough that is hardly pumpable . 4 . acetone whose water content is raised to 15 %. this system behaves completely inactive . 5 . an example , at last , in which the water content of technical acetone has been lowered to less than 0 . 1 % by drying over silica gel . in this case a borderline case has been obtained in which a 2 - phase system still appears but the polymer phase has relatively low viscosity now and it also exhibits strong adhesive properties . the polymer phase is relatively transparent as compared to all other systems . concerns the influence of ratios and temperature in respect of certain systems that are completely composed of hydrocarbons . 1 . shellsol a ( mainly solvers ) and white spirit d ( totally non - solvers ), at which only the ratio is examined . in all cases 100 gr liquid absorbs some 90 gr eps . 35 % solvers and 65 % non - solvers . the process proceeds relatively slowly and the obtained polymer phase exists as a hardly pumpable dough that does not stick . 40 % solvers and 60 % non - solvers . the process proceeds faster and the polymer phase is more pumpable but still exhibits some tendency of stickiness . 45 % solvers and 65 % non - solvers . the system is optimal with respect of compacting rate , pumpability of polymer phase and acceptability of stickiness . 50 % solvers and 50 % non - solvers . the system behaves no longer in accordance with the invention . a homogeneous 1 - phase system is obtained with strong adhesive properties . 20 % styrene in refined spirit . the process is extremely fast and the obtained polymer phase has a relatively low viscosity . 10 % styrene in refined spirit . the process proceeds more slowly and the obtained polymer phase is highly viscous . 5 % styrene in refined spirit . the process is very slow and the obtained polymer phase has the consistency of a tough dough . 5 % styrene but the liquid is heated to 50 ° c . the process is as fast as in the case of 10 % styrene and the obtained polymer phase has a viscosity comparable to that case . a . 20 % naphthalene and 50 ° c . : very fast with polymer phase of very low viscosity and highly adhesive . b . same as a . but at ambient temperature : less fast and strong , yet good pumpable dough with less stickiness . c . 10 % naphthalene and 50 ° c . : very fast and better quality paste as with a . d . same as c . but at ambient temperature : slow process and tough dough . e . 5 % naphthalene and 50 ° c . : fast process and sturdy paste with low stickiness . f . same as e . but at ambient temperature : very slow process and very tough dough , less useful system to perform the method . in this case a variant of the method is concerned in which a liquid according to the invention and comprised of hydrocarbons is emulgated in water . to a liquid according to the invention , comprised of 20 gr shellsol a and 80 gr refined spirit , 20 gr oleic acid is added . while stirring , this mixture is added to 300 gr water in which sufficient spirit of ammonia is present to build a stable yet non - foaming emulsion . the thus obtained emulsion is more fire - safe than the use of pure hydrocarbon mixtures and also absorbs eps in that a milky - white homogeneous emulsion is obtained comprised of a countless number of microscopic systems that act according to the invention . the milky - white emulsion can be charged with eps to saturation and nevertheless remains of low viscosity . after charge , the emulsion is broken by neutralizing the system with diluted hydrochloric acid . after a first coalescence that leads to a separation in a water phase and an organic phase , the latter again shows a phenomenon of coacervation in that the highly concentrated polymer phase separates from the polymer - free organic phase . this organic phase does not absorb any additional eps and again can be emulgated with water containing ammonia . apparently the oleic acid molecules with the saturated aliphatics have created a phase that is widely disposed of aromatics . when the aromatic content of this phase is adjusted , the emulsion again behaves in accordance with the invention . concerned is the transport of paste and compacting liquid in one and the same tank component . in general the polymer phases obtained according the invention have higher densities than the compacting liquid itself , causing the semifluid polymer phase to collect at the bottom of a tank compartment . this fact offers the opportunity to use only one tank compartment to transport both compacting liquid and polymer phase . a transport vessel , total volume 30 ltrs , is filled with 15 ltrs compacting liquid . next a collecting tank , having a storage of paste on its bottom , is connected to this vessel and well in such a way that both bottoms are communicating . the transport vessel is provided with a so called &# 34 ; floating inlet &# 34 ; that enables the compacting liquid to be transferred by pumping to the collecting tank in that the level of the suction inlet is automatically adapted to the liquid level in the transport vessel . then the paste in the collecting tank is transferred by pumping to the transport vessel while at the same time a fresh supply of compacting liquid is transferred from transport vessel to collecting tank in an amount that compensates for the liquid withdrawn with the paste . 20 kg of the polymer paste obtained in example 4 , sub 1 is sucked in by a screw pump and pressed through a filtering unit . next the mass is transferred to a vacuum chamber by a conveyor screw during which passage the temperature of the mass is raised to over the melting temperature of ps , in order to degas the mass . the sucked off gases are condensed to recover the liquid . next the degassed polymer is withdrawn from the degassing chamber by an extrusion screw and processed to granules for injection molding via pressing through a strandforming die . concerns the processing of the obtained compacted mass to monomer styrene and other chemical materials . to 400 gr technical acetone , 0 . 5 % water being present in it , is added 360 gr eps , being the maximum amount the liquid can absorb . 760 gr paste is obtained . from this , 570 gr is submitted to pyrolysis , from which 550 gr pyrolysis oil is obtained . by separation of this oil in a distillation column is obtained : 0 . 53 mass % acetone , fit for reuse in accordance with the invention , 10 mass % other distillates with boiling points up to 155 ° c . and the thus obtained monomer styrene can be polymerized to clear ps conveniently . | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | Is this patent appropriately categorized as 'Electricity'? | 0.25 | 4908d47438fac7a307c999a5d406e59ac30cd1aee85218064f5a1143f68e64a5 | 0.211914 | 0.000296 | 0.06543 | 0.000066 | 0.169922 | 0.000216 |
null | the present invention is a method of compacting eps by bringing the eps in contact with a liquid composed of at least one component with solving power in respect of polystyrene and at least one component without solving power in respect of polystyrene . the following definitions apply to the invention : the phrase &# 34 ; component with solving power in respect of a polymer &# 34 ; means that a component has solving power if , in the liquid state , it weakens the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence and as a final consequence a one - phase system arises with fluid or semi - fluid properties , in which the molecules are , more or less , homogeneously distributed over the entire system volume . things to be considered include the temperature range in which the method is applied . in the examples &# 34 ; a component with solving power in respect of polystyrene &# 34 ; is simply referred to as &# 34 ; a solver &# 34 ;. the solver of polystyrene may be ( i ) an aromatic hydrocarbon constituted of 1 , 2 , 3 or 4 benzene rings with or without substitution in a nucleus or side chain thereof and homologues thereof ; ( ii ) an aromatic compound with keto -, ether - or ester structure ; ( iii ) a heterocyclic compound with one or more oxygen atoms in the ring ; ( iv ) an acyclic compound ; ( v ) an aliphatic ketone , ether or ester ;( vi ) an aliphatic unsaturated compound or ( vii ) a halogenated hydrocarbon . the phrase &# 34 ; component without solving power in respect of a polymer &# 34 ; means that component has no solving power if , in the liquid state , it is not capable of weakening the bonds between the molecules of a submerged polymer in such a way that these molecules lose their mutual coherence . what remains after prolonged time is a 2 - phase system comprised of an inactive liquid phase and an unaltered solid phase that may be somewhat swollen at the most due to the imbibition of liquid molecules in the polymer matrix . in the examples &# 34 ; a component without solving power in respect to polystyrene &# 34 ; is simply referred to as &# 34 ; a non - solver &# 34 ;. the non - solver of polystyrene may be ( i ) water , ( ii ) an aliphatic saturated monohydric alcohol or ( iii ) an aliphatic saturated hydrocarbon . it is the embodiment of the invention that by a convenient choice of the composing components and their mutual ratios the liquid obtains the following properties . eps , contacted with it , shrivels up but does not solve , on the contrary , what arises is a 2 - phase system characterized by the existence of a polymer phase that is very strongly reduced in volume which phase exits in a semifluid pasty or doughy state and that does not take up more liquid than necessary for the existence of said phase and by the existence of a polymer free liquid phase that , more or less , keeps the full power of absorbing freshly added eps in an unaltered fast rate . this is in contradistinction to real solvents in which the rate of take - up is fast in the beginning but which rate slows down gradually as the polymer concentration of the solution increases . there is a triangular interaction between polymer , solver component ( s ) and non - solver component ( s ). the solver molecules , on one hand , exhibit strong interaction with the polymer molecules , on the other hand , they show interactions with the non - solver molecules . the non - solver molecules , however , avoid interaction with the polymer molecules . the stable situation is not the homogeneous molecular distribution over the entire system volume but a limitation of the triangular interactions to a part of the system &# 39 ; s volume that is as small as possible and that , therefore , has maximum polymer concentration . in this situation the solver molecules are able to abolish the matrix structure of the polymer enabling said polymer to pass into the liquid state , but the presence of the non - solver molecules prevents a homogeneous distribution over the entire system volume . the properties of the semifluid polymer phase are adjustable by variation of the ratios of the composing components . at maximum percentage of a solver component the polymer phase has the lowest viscosity and to some extent exhibits sticky properties . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a maximum related to the chosen system . at maximum percentage of a non - solver component the polymer phase has the highest viscosity but no tendency to stickiness . the quantity of this percentage depends upon the choice of the components that compose the system . in this situation the compacting rate is at a minimum related to the chosen system . it is always possible to find a working range within those limits in which the polymer phase is optimal in respect of compacting rate , pumpability and tendency for the equipment to become filthy . the position of working range and limits are dependent on the temperature at which the method is carried out . in general , at higher temperatures there is a shift towards a higher share of non - solver component ( s ). 1 . the asorbtion of eps proceeds in an unaltered fast rate from the first up to the last addition . 2 . a location for compacting can always be disposed of the compact polymer phase at its maximum concentration without the need for total consumption of the liquid first . 3 . a tank - vehicle can , by pushing aside of phases , with the use of only one tank compartment withdraw the polymer phase and add back the make - up of compacting liquid at the same time and vice versa . 4 . a compacting unit is preferably provided with a sieve on which the eps is dumped . the compacted polymer phase sinks through the mesh while the coarse contaminations remain on top of the sieve without degenerating to a sticky mass . 5 . the polymer concentration being at a maximum ensures that in the connected processing the amount of liquid to be recovered is at a minimum . 6 . the stickiness of the compacted mass being at a minimum is advantageous in the performing of the method , the connected transport and the further processing of the said mass . 7 . the compacted polymer phase has good pumpability and can be withdrawn from solid contaminations by filtering . 8 . blowing agents , whenever present , can be solved in the polymer phase and thus be kept out of the environment . 9 . the invention makes possible a wide choice of the composing components , depending upon the market situation in respect of availability of components , the scale of performing the compacting method , the level of fire risk , operative environmental and safety requirements and the kind of the further processing of the compacted mass . 10 . the compacted mass is suitable for physical processing to ps as well as for chemical processing to styrene monomer and other chemical materials . 11 . by a suitable choice of the composing components of the liquid phase , these components can be recovered simply and nearly completely in the processing as stated above . the purpose of the invention shall be illustrated in the following examples , and it will be clear that the scope of the invention includes more than what is made explicit in the examples . to 100 gr methylethylketone , eps is added . at first the eps is absorbed by the liquid at a very fast rate , but , as the concentration of eps in the solution rises the rate of absorbtion slows down progressively . in the end the process stops at 50 - 55 gr eps absorbed . the highly viscous fluid mass exhibits very sticky properties . yet from the first addition of eps there is the origin of only one homogeneous phase in which the viscosity increases as more eps is added . comparable effects appear when use is made of , e . g ., styrene , toluene , ethylacetate , methylisobutylketone , 1 , 1 , 1 - trichloroethane , etc . concerns the effect of a liquid comprised of one solver and one non - solver . acetone , as it is sold in technical quality , contains about 0 . 3 % water . in this case there is the question of a system comprised of acetone being a solver and water being a non - solver . to 100 gr acetone of technical quality , eps is added . the eps is absorbed at a very fast rate , but , at present no homogeneous solution is obtained . a 2 - phase system is produced including in one phase , a compact semifluid polymer phase which is highly viscous but nevertheless has good fluid properties and a second polymer - free liquid phase that is capable for absorbing eps undiminished as fast as before . since part of the liquid is needed to bring about the fluid polymer phase , the available polymer - free liquid diminishes as the addition of eps continues . as soon as all the liquid is used up , a paste is obtained that contains 85 to 90 gr ps . this amount of ps has not been approached by whatever pure solvent system . the influence of water as a non - solver is extremely strong in this system as will be demonstrated in a later example . concerns the effect of other liquid systems , also again comprised of only one solver and one non - solver . 1 . to 90 gr methylethylketone , 10 gr water is added . eps is added to the thus obtained liquid . also in this case eps is absorbed in the liquid at a fast rate and a 2 - phase system is obtained comprised of a semifluid polymer phase and a polymer - free liquid phase , completely analogous with example 2 . the total amount of eps added , 80 to 85 gr , is comparable to the amount as with example 2 . 2 . liquid comprised of 25 % methanol ( non - solver ) and 75 % methylethylketone ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 3 . liquid comprised of 25 % methanol ( non - solver ) and 75 % ethylacetate ( solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . 4 . liquid comprised of 85 % dioxane ( solver ) and 15 % water ( non - solver ): a 2 - phase system is obtained having a semifluid polymer phase and a polymer - free liquid phase . concerns liquid systems comprised of one solver and more than one non - solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated semifluid polymer phase and a polymer - free liquid phase to which eps can be added until all liquid is used up . 1 . liquid comprised of 20 % toluene ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons with boiling range 107 ° c . to 138 ° c . all of which are non - solvers ). 2 . liquid comprised of 20 % 1 , 1 , 1 - trichloroethane ( solver ) and 80 % refined spirit ( mixture of saturated aliphatic hydrocarbons , all of which are non - solvers ). 3 . concerned is an example that shows that a system component in the pure state that does not necessarily have to be a liquid . to 80 gr refined spirit ( mixture of non - solvers ) is added 20 gr naphthalene ( solver ) that has been solved in the refined spirit by heating to 50 ° c . after cooling to ambient temperature the liquid behaves according to the invention . 4 . liquid comprised of 85 % refined spirit ( non - solvers ) and styrene ( solver ). concerned are liquid systems that are composed of one non - solver and more than one solver . in all cases a 2 - phase system is obtained characterized by a highly concentrated polymer phase and a polymer - free liquid phase to which eps can be added continuously until all liquid has been used up . 1 . liquid comprised of 50 % isopropanol ( non - solver ), 20 % toluene ( solver ) and 30 % acetone ( solver ). 2 . liquid comprised of 10 % water ( non - solver ), 30 % styrene ( solver ) and 60 % acetone ( solver ). this example clearly shows how the extremely strong influence of water to the solving power of acetone , as will be shown in example 7 , can be forced back by the addition of a second solver with very high affinity towards ps . 100 gr of this liquid absorbs some 70 to 75 gr eps . concerned are systems comprised of more than one non - solver and more than one solver . all systems are characterized in that 2 - phase systems are obtained according to the invention . 1 . liquid comprised of 50 % refined spirit ( non - solvers ), 30 % acetone ( solver ) and 20 % toluene ( solver ). 2 . liquid comprised of 80 % refined spirit ( non - solvers ) and 20 % shellsol a ( a mixture of hydrocarbons that includes 98 % aromatics and which aromatics all belong to the solvers ). shellsol a has a boiling range of 166 ° c . to 185 ° c . liquid comprised of 40 % shellsol a ( 98 % aromatics , all solvers ) and 60 % white spirit d ( comprised of high boiling aliphatic hydrocarbons , all non - solvers ). white spirit d has a boiling range from 162 ° c . to 197 ° c . concerns the extreme influence of water ( non - solver ) in respect of acetone ( solver ) to the compacting power of this system . 1 . technical acetone contains 0 . 3 % water . this system has been examined in example 2 and it behaves completely according the invention . 2 . acetone whose water content is raised to 1 . 5 %. this system behaves completely according to the invention , hardly slower and 100 gr liquid absorbs some 80 to 85 gr eps . 3 . acetone whose water content is raised to 5 %. this system still behaves according to the invention but its activity has been diminished to a large extent . its activity is very slow and the obtained semifluid polymer phase has the consistency of dough that is hardly pumpable . 4 . acetone whose water content is raised to 15 %. this system behaves completely inactive . 5 . an example , at last , in which the water content of technical acetone has been lowered to less than 0 . 1 % by drying over silica gel . in this case a borderline case has been obtained in which a 2 - phase system still appears but the polymer phase has relatively low viscosity now and it also exhibits strong adhesive properties . the polymer phase is relatively transparent as compared to all other systems . concerns the influence of ratios and temperature in respect of certain systems that are completely composed of hydrocarbons . 1 . shellsol a ( mainly solvers ) and white spirit d ( totally non - solvers ), at which only the ratio is examined . in all cases 100 gr liquid absorbs some 90 gr eps . 35 % solvers and 65 % non - solvers . the process proceeds relatively slowly and the obtained polymer phase exists as a hardly pumpable dough that does not stick . 40 % solvers and 60 % non - solvers . the process proceeds faster and the polymer phase is more pumpable but still exhibits some tendency of stickiness . 45 % solvers and 65 % non - solvers . the system is optimal with respect of compacting rate , pumpability of polymer phase and acceptability of stickiness . 50 % solvers and 50 % non - solvers . the system behaves no longer in accordance with the invention . a homogeneous 1 - phase system is obtained with strong adhesive properties . 20 % styrene in refined spirit . the process is extremely fast and the obtained polymer phase has a relatively low viscosity . 10 % styrene in refined spirit . the process proceeds more slowly and the obtained polymer phase is highly viscous . 5 % styrene in refined spirit . the process is very slow and the obtained polymer phase has the consistency of a tough dough . 5 % styrene but the liquid is heated to 50 ° c . the process is as fast as in the case of 10 % styrene and the obtained polymer phase has a viscosity comparable to that case . a . 20 % naphthalene and 50 ° c . : very fast with polymer phase of very low viscosity and highly adhesive . b . same as a . but at ambient temperature : less fast and strong , yet good pumpable dough with less stickiness . c . 10 % naphthalene and 50 ° c . : very fast and better quality paste as with a . d . same as c . but at ambient temperature : slow process and tough dough . e . 5 % naphthalene and 50 ° c . : fast process and sturdy paste with low stickiness . f . same as e . but at ambient temperature : very slow process and very tough dough , less useful system to perform the method . in this case a variant of the method is concerned in which a liquid according to the invention and comprised of hydrocarbons is emulgated in water . to a liquid according to the invention , comprised of 20 gr shellsol a and 80 gr refined spirit , 20 gr oleic acid is added . while stirring , this mixture is added to 300 gr water in which sufficient spirit of ammonia is present to build a stable yet non - foaming emulsion . the thus obtained emulsion is more fire - safe than the use of pure hydrocarbon mixtures and also absorbs eps in that a milky - white homogeneous emulsion is obtained comprised of a countless number of microscopic systems that act according to the invention . the milky - white emulsion can be charged with eps to saturation and nevertheless remains of low viscosity . after charge , the emulsion is broken by neutralizing the system with diluted hydrochloric acid . after a first coalescence that leads to a separation in a water phase and an organic phase , the latter again shows a phenomenon of coacervation in that the highly concentrated polymer phase separates from the polymer - free organic phase . this organic phase does not absorb any additional eps and again can be emulgated with water containing ammonia . apparently the oleic acid molecules with the saturated aliphatics have created a phase that is widely disposed of aromatics . when the aromatic content of this phase is adjusted , the emulsion again behaves in accordance with the invention . concerned is the transport of paste and compacting liquid in one and the same tank component . in general the polymer phases obtained according the invention have higher densities than the compacting liquid itself , causing the semifluid polymer phase to collect at the bottom of a tank compartment . this fact offers the opportunity to use only one tank compartment to transport both compacting liquid and polymer phase . a transport vessel , total volume 30 ltrs , is filled with 15 ltrs compacting liquid . next a collecting tank , having a storage of paste on its bottom , is connected to this vessel and well in such a way that both bottoms are communicating . the transport vessel is provided with a so called &# 34 ; floating inlet &# 34 ; that enables the compacting liquid to be transferred by pumping to the collecting tank in that the level of the suction inlet is automatically adapted to the liquid level in the transport vessel . then the paste in the collecting tank is transferred by pumping to the transport vessel while at the same time a fresh supply of compacting liquid is transferred from transport vessel to collecting tank in an amount that compensates for the liquid withdrawn with the paste . 20 kg of the polymer paste obtained in example 4 , sub 1 is sucked in by a screw pump and pressed through a filtering unit . next the mass is transferred to a vacuum chamber by a conveyor screw during which passage the temperature of the mass is raised to over the melting temperature of ps , in order to degas the mass . the sucked off gases are condensed to recover the liquid . next the degassed polymer is withdrawn from the degassing chamber by an extrusion screw and processed to granules for injection molding via pressing through a strandforming die . concerns the processing of the obtained compacted mass to monomer styrene and other chemical materials . to 400 gr technical acetone , 0 . 5 % water being present in it , is added 360 gr eps , being the maximum amount the liquid can absorb . 760 gr paste is obtained . from this , 570 gr is submitted to pyrolysis , from which 550 gr pyrolysis oil is obtained . by separation of this oil in a distillation column is obtained : 0 . 53 mass % acetone , fit for reuse in accordance with the invention , 10 mass % other distillates with boiling points up to 155 ° c . and the thus obtained monomer styrene can be polymerized to clear ps conveniently . | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | Is this patent appropriately categorized as 'General tagging of new or cross-sectional technology'? | 0.25 | 4908d47438fac7a307c999a5d406e59ac30cd1aee85218064f5a1143f68e64a5 | 0.152344 | 0.18457 | 0.052734 | 0.523438 | 0.167969 | 0.208008 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Should this patent be classified under 'Physics'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.006897 | 0.001549 | 0.000169 | 0.000008 | 0.001984 | 0.001648 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Does the content of this patent fall under the category of 'Physics'? | Is 'Performing Operations; Transporting' the correct technical category for the patent? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.004211 | 0.009399 | 0.000123 | 0.012817 | 0.009155 | 0.017944 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Should this patent be classified under 'Physics'? | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.006897 | 0.00383 | 0.000169 | 0.000103 | 0.001984 | 0.001595 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Does the content of this patent fall under the category of 'Physics'? | Is this patent appropriately categorized as 'Textiles; Paper'? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.004211 | 0.001411 | 0.000123 | 0.000002 | 0.009155 | 0.001701 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Should this patent be classified under 'Physics'? | Should this patent be classified under 'Fixed Constructions'? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.006897 | 0.004913 | 0.000169 | 0.00103 | 0.001984 | 0.001984 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Does the content of this patent fall under the category of 'Physics'? | Is 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting' the correct technical category for the patent? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.004211 | 0.002045 | 0.000123 | 0.000404 | 0.009155 | 0.008301 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Should this patent be classified under 'Physics'? | Is this patent appropriately categorized as 'Electricity'? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.006897 | 0.585938 | 0.000169 | 0.132813 | 0.001984 | 0.031128 |
null | fig1 is a plan view of a perforated label assembly 10 in accordance with one embodiment of the present invention . the label assembly 10 includes a backing 1000 and two label members 100 . each label member 100 is configured and dimensioned to be applied to a portion of an electrical apparatus ( as depicted in fig2 - 4 ). each label member 100 includes a primary label portion 110 and severable label portion 120 . each label member 100 also includes an alignment strip 200 including alignment strip portions 201 which are delineated from the label 100 via perforation 220 , and from each other via secondary perforation 230 . the alignment strip 200 depicted in fig1 is configured in an “ l ” shaped configuration which corresponds with structuring structural features of the surface to which the label 100 will be applied , as described below . it will be understood that the alignment strip 200 may comprise a variety of dimensions and configurations . each alignment strip portion 201 includes a tabbed end 210 which protrudes beyond the boundary of the label member 100 . as such , the tabbed end 210 facilitates removal of the alignment strip portion 201 by providing a surface which is easily graspable by a user , once the label member 100 is applied to the desired surface . as such , the label member 100 is configured to be removed from the backing 1000 as a single member . fig2 depicts a detail of the area of fig1 indicated as 2 . therein , further details of the perforation 220 may be seen . accordingly , the perforation 220 comprises a plurality of apertures 223 and webs 222 disposed along the perforation 220 . as such , when it is desired to remove the alignment strip portion 201 , the perforation 220 facilitates an orderly removal by concentrating stresses at each web 222 , thereby allowing the alignment strip channel 201 to be torn substantially along the perforation 220 . fig3 is a section view taken along line 3 - 3 of fig2 . therein , it can be seen that the apertures 223 extend through the thickness of the alignment strip portion 201 . it will be appreciated that in alternative embodiments the apertures 223 may only extend partially through the alignment strip portion 201 and in yet further embodiments the apertures 223 may extend into the backing 1000 , depending at least in part upon manufacturing processes used . it may also be seen that an adhesive coating 130 is applied to the label 100 , which is then disposed onto the backing 1000 at an interface 1010 . in at least one embodiment , the aperture size , aperture depth , web size , adhesive composition , and backing composition are cooperatively selected such that a force placed on the web 222 during removal of the label 100 from the backing 1000 is less than a force required to tear the webs 222 . stated another way , at least some of the above referenced characteristics are selected such that a failure stress of the webs 223 is larger than the actual stress experienced by the webs 223 during removal of the label 100 from the backing 1000 . one way to accomplish such a relation may be to optimize the perforations 220 , such as optimizing the dimensional relationships between apertures 223 and webs 222 . alternatively , one method might focus on reducing an adhesion strength between the adhesive layer 120 and backing 1000 at the interface 1010 . however , it will be appreciated that other dimensional and compositional relationships may also accomplish the goals of the present invention . in an additional embodiment , the adhesion strength between the adhesive coating 130 and the electrical apparatus is larger than the adhesion strength at the interface 1010 . indeed , the adhesion strength between the adhesive coating 130 and the electrical apparatus may be larger than the perforation strength such that , after application of the label member 100 to the electrical apparatus , the alignment strip 200 may be removed by simply peeling it away from the electrical apparatus , tearing the perforation 220 , and leaving the desired primary label portion 110 and severable label portion 120 of the label member 100 adhered to the electrical apparatus . fig4 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 . as can be seen , the label member 100 has been removed from the backing 1000 ( depicted in fig1 ) and affixed to the electrical apparatus 2010 as a single member , with alignment strip 200 connected to the primary label portion 110 and severable label portion 120 . fig5 is a plan view of one embodiment of a label member 100 of the present invention affixed to an electrical apparatus 2010 and having an alignment strip portion 201 removed . in at least one embodiment , the alignment strip portion 201 may be removed by grasping the tabbed portion 210 and pulling , thereby separating the alignment strip portion 201 from the label member 100 at the perforations 220 . additionally , as the depicted alignment strip is “ l ” shaped , a secondary perforation 230 may be disposed at an angled or radiused portion 231 therof so as to avoid unintentional tearing of the alignment strip portion 201 as it is removed . one feature of the present invention is the provision of an alignment spacing 300 due to removal of the alignment strip 200 . as can be seen , the electrical apparatus 2000 includes a primary portion 2010 and a secondary portion 2020 , which interconnect via an interface 2030 . the alignment strip 200 is correspondingly disposed and dimensioned to overlie the interface 2030 and provide a desired positioning of the primary label portion 110 and severable label portion 120 relative to the interface . as such , once the alignment strip 200 is removed , an alignment spacing 300 is provided such that the label member 100 does not interfere with operation or separation of the electrical apparatus 2000 . fig6 is a plan view of one embodiment of a label member 100 affixed to an electrical apparatus 2000 and having alignment strip portions removed . as such , no portion of the label member 100 occupies the alignment spacing 300 , and the severable portion 2020 of the electrical apparatus 2000 may be severed and / or replaced without interference from the label member 100 of the present invention . additionally , the primary label portion 110 and severable label portion 120 maintain a predetermined distance relative to both the interface 2030 and the outer boundary of the electrical apparatus 2000 . such an orientation is facilitated by the single - member application of the label member 100 , as opposed to individually applying the primary label portion 110 and severable label portion 120 . as such , a precise and aesthetically pleasing arrangement of the label member 100 may be achieved via a substantially centered disposition of the single - member label member 100 on the electrical apparatus 2000 , as well as a provision of a predetermined alignment spacing 300 of a predetermined distance , created from removal of the alignment strip 200 . fig7 and 8 depict alternative embodiments of the present invention comprising different dimensional relationships relative to each other , as well as the embodiment depicted in fig1 . as such , the present invention may be easily adapted to fit a variety of electrical apparatus . for example , where the label 100 of fig1 comprises a substantially rounded square shape of approximately 2 . 5 inches on a side , the label 100 ′ of fig7 may comprise a dimension of 2 . 125 inches on a side , and the label 100 ″ of fig8 may comprise a dimension of 1 . 75 inches on a side . it will be appreciated that the dimensions of the alignment strip 200 , 200 ′, 200 ″, such as width and length , may be accordingly adjusted to maintain a proportional relationship to the label 100 , 100 ′, 100 ″ size and / or corresponding placement relative to an interface of the electrical apparatus . since many modifications , variations and changes in detail can be made to the described preferred embodiment of the invention , it is intended that all matters in the foregoing description and shown in the accompanying drawings be interpreted as illustrative and not in a limiting sense . thus , the scope of the invention should be determined by the appended claims and their legal equivalents . | Does the content of this patent fall under the category of 'Physics'? | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | 0.25 | 43ff8f14cf20067c253e5235b9aa61796b79f5cf93b159cb2c46c90ca6ea0926 | 0.004211 | 0.03064 | 0.000123 | 0.007355 | 0.009155 | 0.015442 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.098145 | 0.003937 | 0.027588 | 0.000033 | 0.121094 | 0.004761 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is 'Chemistry; Metallurgy' the correct technical category for the patent? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.086426 | 0.010681 | 0.077148 | 0.005066 | 0.109863 | 0.014038 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is 'Textiles; Paper' the correct technical category for the patent? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.086426 | 0.000368 | 0.077148 | 0.000043 | 0.109863 | 0.005554 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Fixed Constructions'? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.039551 | 0.066406 | 0.074707 | 0.049561 | 0.05835 | 0.025513 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Should this patent be classified under 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.033203 | 0.000191 | 0.012024 | 0.000045 | 0.056641 | 0.001808 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Physics'? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.086426 | 0.035156 | 0.077148 | 0.009399 | 0.109863 | 0.040771 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Should this patent be classified under 'Performing Operations; Transporting'? | Is 'Electricity' the correct technical category for the patent? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.040771 | 0.00008 | 0.074707 | 0.00014 | 0.05835 | 0.000246 |
null | in fig1 there is shown a pickup truck box 10 having a floor 20 , a front wall 22 , a left or driver &# 39 ; s sidewall 24 , and a right or passenger &# 39 ; s sidewall 26 . pickup truck box 10 is also formed with wheel wells 28 and 30 , as is conventionally known in the art . as shown in fig2 pickup truck box 10 is comprised of three separately molded pieces or sections , including a central section 32 which defines most of the area of floor 20 and front wall 22 ( typically 60 - 100 % of the width of floor 20 and front wall 22 ); a left or driver &# 39 ; s side section 34 defining left sidewall 24 , a left wheel well 28 , a portion 36 of floor 20 and a portion 38 of front wall 22 ; and a right or passenger &# 39 ; s side section 40 defining right sidewall 26 , a right wheel well 30 , portion 42 of floor 20 and portion 44 of front wall 22 . sections 32 , 34 and 40 are separately molded from a plastic material , preferably from a plastic composite material . the term “ molded ” as used herein refers to generally any technique by which a plastic or composite having a plastic matrix is formed into a solid component having a desired shape , and encompasses various processes for converting a fluid or flowable material into a solid . examples of well known molding techniques that may be used for forming sections 32 , 34 and 40 of pickup truck bed 10 include extrusion , sheet thermoforming , injection molding , compression molding , transfer molding , and combinations of these . the term “ plastic ” as used herein refers to polymers , especially synthetic polymers , that may be combined with other ingredients such as fillers , colorants , reinforcing agents , plasticizers , antioxidants , etc . and which can be shaped or molded into solid components . plastics that can be used in forming pickup truck bed 10 include those containing thermoplastic polymers , those containing thermoset polymers , and those containing a combination of both thermoplastic polymers and thermoset polymers . the term “ composite ” as used herein refers to a mechanical combination of two or more materials that are solid in the finished state , are mutually insoluble , and differ in chemical nature . more particularly , the composites that are useful in this invention are reinforced plastics , especially fiber reinforced plastics . an advantage of this invention is that sections 32 , 34 and 40 may be made of different plastic materials , and may be formed using different molding techniques . for example , section 32 , which will typically bear most of any load exerted by cargo hauled in box 10 can be made of a plastic material having a higher strength and better load bearing properties than the material used to form side sections 34 and 40 . also , because the load bearing requirements for sections 34 and 40 are less than the load bearing requirements of section 32 , sections 34 and 40 can be made , for example , by an injection molding process , whereas panel 32 can be made by a compression molding process from sheet molding compounds or by structural reaction injection molding ( srim ), i . e ., processes that ensure better material homogeneity . thus , the invention allows greater flexibility in the selection of materials and processes , enabling fabrication of a pickup truck box having different mechanical and / or chemical properties in the different sections of the box . this allows fabrication of a plastic pickup truck box having high strength properties in selected regions where needed , while allowing lower cost materials and / or processes to be used in other regions of the box . another advantage of the ability to fabricate sections 32 , 34 and 40 from different plastic materials , is that sections 34 and 40 can be molded , such as by injection molding , with various functional features , such as with integral storage bins , anchor means , etc . further , the individual sections 32 , 34 and 40 can be stacked in a nested arrangement having excellent packing efficiency . this can reduce shipping costs from the point at which the box sections are molded to the point at which the truck box is assembled and mounted on a pickup truck . although sections 32 , 34 and 40 may be formed from a variety of different types of plastic materials , side sections 34 and 40 are preferably fabricated from nonreinforced or , more preferably , fiber filler or particulate reinforced polypropylene , polybutylene terephthalate , polyester , vinyl ester , polyurethane , polycarbonate / acrylonitrile - butadiene - styrene , or polycarbonate / polyester resins . preferred glass fiber reinforced polyurethane srim plastics have a flex modulus at 70 ° f . of from about 8 , 000 mpa to about 12 , 000 mpa , a flex strength at 70 ° f . of from about 196 mpa to about 250 mpa , a tensile strength at 70 ° f . of from about 100 to about 300 mpa ( e . g ., 200 mpa ), an impact strength ( notched izod at 70 ° f .) of about 19 . 2 foot - pound / inch ( 1 , 018 j / m ), a specific gravity of from about 1 . 4 to about 1 . 6 , and a glass fiber content of from about 42 % to about 48 % by weight . preferred long glass fiber reinforced polypropylene plastics have a fiber content of from about 30 % to about 50 % by weight , a specific gravity of from about 1 . 0 to about 1 . 3 , an impact strength ( notched izod at 23 ° c .) of from about 50 to about 85 kj / m 2 , a flex modulus of from about 6 , 300 to about 7 , 200 mpa , a tensile strength at break of from about 100 to about 130 mpa , and an ash content of from about 30 % to about 40 %. preferred materials for fabricating the central section 32 include polyurethane srim compositions and vinyl ester sheet molding compound ( smc ). desirably , conductive fillers and antioxidants are added in effective amounts . other additives may be included in effective amounts as desired when appropriate . examples of particular materials useful for fabricating side sections 34 and 40 include glass fiber reinforced epoxy terminated vinyl ester resins such as derakane ® vinyl ester resin ( available from dow chemical company ), glass fiber reinforced polycarbonate / acrylonitrile - butadiene - styrene blends , and glass fiber reinforced polycarbonate / polyester engineered thermoplastics sold by ge plastics as ge xenoy ® synthetic resins . the plastics used for fabricating sections 32 , 34 and 40 will typically contain a reinforcing fiber , typically glass fibers . however , other reinforcing fibers , such as carbon fibers , polyolefin fibers , polyester fibers ( e . g ., pet ), aromatic polyamide fibers ( e . g ., kevlar ® fibers ), etc ., may be used . also , instead of reinforcing fibers , or in combination with reinforcing fibers , other reinforcing fillers , such as ceramic , metallic , mica , etc ., may be used . in addition to reinforcing fibers , and / or reinforcing fillers , the plastics used to make the sections ( e . g ., 32 , 34 and 40 ) of the pickup truck box may include effective amounts of other additives such as ultraviolet light stabilizers and flame - retardants . sections 32 , 34 and 40 are joined together with a structural adhesive . the adhesive used to join the sections of box 10 together are selected so that adhesive failure at the interface between the individually molded sections of the box and the adhesive will not occur . it is also preferred that the adhesive have sufficient mechanical properties so that cohesive failure of the adhesive does not occur . in other words , the preferred failure mode is in the pickup truck sections ( e . g ., 32 , 34 and 40 ), not cohesive failure in the adhesive or adhesive failure at the interface between the adhesive and the sections of the pickup truck box . selection of an adhesive or combination of adhesives for bonding the sections of the truck box together is dependent on a variety of factors . adhesives should be selected to ensure a uniform bond line that resists weathering and is durable enough to withstand shear and tensile forces associated with normal movement of a typical pickup truck box . examples of suitable adhesives include betaseal ® 1870 adhesive available from essex specialty products inc ., auburn hills , michigan ( with or without a primer ), and betamate ® 73100 / 730xx also available from essex specialty products . betaseal ® 1870 adhesive is a one component , fast curing , high viscosity , high modulus polyurethane adhesive that can provide a high body stiffness in srim polyurethane substrate to srim polyurethane substrate adhesive applications . betaseal ® 1870 adhesive is resistant to extended outdoor weathering conditions without losing its adhesion and physical characteristics . betaseal ® 1870 adhesive may be used in combination with essex ® u - 413 ( u435 - 32 ) urethane adhesive pinchweld primer , which is a solvent wash for the substrate surface . betamate ® 73100 / 730xx ( e . g ., 73100 / 73002 , 73005 , 73010 and 73015 ) adhesives are structural polyurethane adhesives designed for bonding pre - painted metal to eliminate the need for mechanical fasteners . however , these adhesives are useful for bonding various thermoplastic materials and forming cross - linked polymers that are stronger than many of the bonded substrates . lap shear testing of a srim polyurethane substrate bonded to another srim polyurethane substrate with betaseal ® 1870 adhesive showed that the average break strength was 828 . 6 psi , with the mode of failure being cohesive ( not adhesive ) failure of the cured adhesive . lap shear testing of a srim polyurethane substrate to an epoxy resin coated metal substrate using betaseal ® 1870 showed an average break strength of 919 . 2 psi , with the failure mode being cohesive ( not adhesive ) failure of the cured adhesive . in general , it is desirable that the cured adhesive have a young &# 39 ; s modulus of from about 5 , 000 to about 15 , 000 psi , a tensile strength of from about 500 to about 3 , 000 psi , a shear strength of from about 500 to about 2 , 000 psi , a poissons ratio of from about 0 . 45 to about 0 . 50 , a shear modulus of from about 95 to about 600 mpa , and an elongation at failure of from about 50 % to about 300 %. the plurality of sections forming the pickup truck box of this invention can be joined together with adhesive beads ( e . g ., adhesive beads 54 , 55 and 56 of fig3 or 60 of fig4 ) that are deposited between overlapping edges of these sections . the size of the adhesive bead is dependent upon the adhesive being used , the configuration of the joint , and the material used for fabricating the sections of the pickup truck box . typically , the adhesive beads will be from about 1 millimeter to about 20 millimeters wide and from about 10 millimeters to about 40 millimeters high , and extends along the entire length of the seam . temporary mechanical fasteners may be used to hold sections of the pickup truck box together until the adhesive bead or beads joining the sections together have cured . also , snap - fit fasteners 85 integrally molded into the sections of the pickup truck box can be used to temporarily or permanently hold the sections of the pickup truck box together to compensate for any warping or inconsistency in the spatial relation of the sections being bonded together . such snap - fit fasteners may also ensure that there is a distinct uniform fit associated with each pickup truck box , and may reduce or eliminate human error associated with assembly of the pickup truck box . permanent fasteners 90 such as metal screws or rivets , or plastic pins , cones , wedges or tabs , may be used to supplement the adhesive bond and / or hold the sections of the pickup truck box together until the adhesive bead or adhesive beads have cured . the sections of the box ( e . g ., 32 , 34 and 40 ) are preferably joined together at overlapping portions of the molded sections , as adhesive butt joints generally will not provide sufficient strength when the box is subjected to high flexural loads . the joints are preferably designed to provide at least two different adhesively bonded non - parallel interfaces , and to prevent moisture from becoming trapped at the joints . preferably , the overlapping portions comprise nesting inverted channels or corrugations ( fig3 and 4 ). in fig3 sections 32 and 34 are provided with overlapping , nesting corrugations 50 , 52 , and adhesive beads 54 , 55 and 56 are deposited on each of three different non - parallel planes , whereby regardless of the type of tensile or flexural load imposed on the box , at least one of the planes is under a shear load . it is desirable that a spacer be provided , either in the adhesive or on at least one of the panels ( e . g ., 32 and 34 ), to maintain a gap having a fixed dimension ( e . g ., about 1 mm ) between the overlapping areas where the molded sections are adhesively joined together . this insures that an adequately thick layer of structural adhesive will remain between the overlapping layers when they are pressed together . for example , as shown in fig3 section 34 can be molded with standoffs 58 , 59 that maintain a uniform gap between sections 34 and 32 . in an alternative embodiment shown in fig4 an adhesive 60 may be applied in a plurality of beads in such quantity that the gap between section 32 and 34 is completely filled when the sections are pressed together . as shown in fig3 a desired gap is maintained by a plurality of spacer beads 62 uniformly dispersed in adhesive 60 . spacer beads 62 can , for example , be glass beads having a diameter corresponding to the desired gap ( e . g ., about 1 mm ). in an alternative preferred embodiment , a tongue in groove joint is utilized ( fig5 ), wherein a groove 70 is molded into section 34 . more specifically , section 34 includes at its lower edges a groove 70 defined by spaced apart upright walls 72 and 73 into which is inserted an upwardly protruding tongue 76 of section 32 , with an adhesive 80 disposed in regions between tongue 76 and walls 72 and 73 . the spacing between walls 72 and 73 is sufficient to accommodate edge 76 , and leave sufficient space between edge 76 and walls 72 and 73 to accommodate a layer of adhesive which is about 1 mm thick . although the illustrated embodiment shows a three piece construction in which sections 32 , 34 and 40 are adhesively joined , the advantages of this invention may be achieved with four , five , six , or generally any number of separately molded pieces that are adhesively joined together . the various sections of the pickup truck box can be molded with metal inserts if desired to provide attachment points , structural reinforcement , etc . also , the sections ( e . g ., 32 , 34 and 40 ) can be molded with long glass fiber pultruded stringers , such as to provide structural reinforcement . the above description is considered that of the preferred embodiments only . modifications of the invention will occur to those skilled in the art and to those who make or use the invention . therefore , it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention , which is defined by the following claims as interpreted according to the principles of patent law , including the doctrine of equivalents . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | 0.25 | 774378e7c0ff9e83ee7e58850ce5b531c1114f0f07d5668afc70b28de8f75dce | 0.033203 | 0.087402 | 0.012024 | 0.014038 | 0.056641 | 0.038574 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Does the content of this patent fall under the category of 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.004913 | 0.005219 | 0.001869 | 0.000169 | 0.03064 | 0.011353 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Is 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.003082 | 0.08252 | 0.00193 | 0.00383 | 0.022949 | 0.115723 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Does the content of this patent fall under the category of 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.004913 | 0.125 | 0.001869 | 0.057373 | 0.029785 | 0.064453 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Is 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting' the correct technical category for the patent? | Is this patent appropriately categorized as 'Textiles; Paper'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.003082 | 0.002319 | 0.00193 | 0.00008 | 0.022949 | 0.010681 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Should this patent be classified under 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Does the content of this patent fall under the category of 'Fixed Constructions'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.001366 | 0.04541 | 0.000912 | 0.048828 | 0.019165 | 0.136719 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Should this patent be classified under 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Does the content of this patent fall under the category of 'Physics'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.001366 | 0.064453 | 0.000912 | 0.005371 | 0.017456 | 0.091309 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Should this patent be classified under 'Electricity'? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.004456 | 0.014038 | 0.002884 | 0.000572 | 0.033203 | 0.002121 |
null | the present disclosure will be described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the disclosure are shown . as those skilled in the art would realize , the described embodiments may be modified in various different ways , all without departing from the spirit or scope of the present disclosure . the drawings and description are to be regarded as illustrative in nature and not restrictive . like reference numerals designate like elements throughout the specification . further , since sizes and thicknesses of constituent members shown in the accompanying drawings are arbitrarily given for better understanding and ease of description , the present disclosure is not limited thereto . in the drawings , the thickness of layers , films , panels , regions , etc ., may be exaggerated for clarity . in the drawings , for better understanding and ease of description , the thicknesses of some layers and areas are exaggerated . in addition , unless explicitly described to the contrary , the word “ comprise ” and variations such as “ comprises ” or “ comprising ” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements . further , in the specification , the phrase “ on a plane ” means viewing the object portion from the top , the phase “ on a rear ” means viewing the objection from the bottom , and the phrase “ on a cross - section ” means viewing a cross - section of which the object portion is vertically cut from the side . a catalyzed particulate filter according to an exemplary embodiment of the present disclosure may be applied to various devices obtaining energy by burning a fossil fuel and exhausting a gas generated in a process thereof into the atmosphere , as well as a vehicle . in the present specification , the catalyzed particulate filter is applied to a vehicle , however it is not necessary that the catalyzed particulate filter must be applied to a vehicle . an engine to generate power is mounted to the vehicle . the engine converts chemical energy into mechanical energy by combusting a mixture in which the fuel and air are mixed . the engine is connected to an intake manifold to inflow the air to inside a combustion chamber and is connected to an exhaust manifold such that the exhaust gas generated in a combustion process is collected in the exhaust manifold and is exhausted to the outside of the vehicle . an injector is mounted in the combustion chamber or the intake manifold to inject the fuel to the inside of the combustion chamber or the intake manifold . the exhaust gas generated in the engine is exhausted outside of the vehicle through an exhaust device . the exhaust device may include an exhaust pipe and an exhaust gas recirculation ( egr ) device . the exhaust pipe is connected to the exhaust manifold to exhaust the exhaust gas outside the vehicle . the exhaust gas recirculation device is mounted on the exhaust pipe such that the exhaust gas exhausted from the engine passes through the exhaust gas recirculation device . also , the exhaust gas recirculation device is connected to the intake manifold such that a part of the exhaust gas is mixed with the air to control a combustion temperature . the combustion temperature may be controlled by on / off - controlling an egr valve ( not shown ) provided at the exhaust gas recirculation device . that is , by on / off - controlling the egr valve , the amount of the exhaust gas supplied to the intake manifold is controlled . in the exhaust device , a particulate filter mounted at the exhaust pipe for collecting the particulate matter included in the exhaust gas may be further included . the particulate filter may be a catalyzed particulate filter according to an exemplary embodiment of the present disclosure to purify various materials as well as the particulate matter included in the exhaust gas . next , the catalyzed particulate filter according to an exemplary embodiment of the present disclosure will be described in detail with reference to accompanying drawings . first , the catalyzed particulate filter according to the first exemplary embodiment of the present disclosure will be described with reference to fig1 to fig3 . fig1 is a perspective view of a catalyzed particulate filter according to a first exemplary embodiment of the present disclosure , fig2 is a cross - sectional view of the catalyzed particulate filter of fig1 , and fig3 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig1 . as shown in fig1 to fig3 , the catalyzed particulate filter 1 according to the first exemplary embodiment of the present disclosure may include at least one inflow channel 10 and at least one outflow channel 20 in a housing . a plurality of inflow channels 10 and outflow channels 20 are divided by a wall 30 . also , a supporting member 40 may be disposed inside at least one outflow channel 20 . the inflow channel 10 and the outflow channel 20 may be all collectively referred to as cell . also , the shape of the housing is a cylinder shape and the shape of the cell may be quadrangle , however the shape of the housing and the shape of the cell are not limited to such a shape and may be formed of various shapes . referring to fig2 and fig3 , the inflow channel 10 extends along a flow of the exhaust gas . a front of the inflow channel 10 is opened such that the exhaust gas inflows inside the particulate filter 1 through the inflow channel 10 . a rear of the inflow channel 10 is blocked by a first plug 12 . accordingly , the exhaust gas inside the particulate filter 1 may be not released outside the particulate filter 1 through the inflow channel 10 . the outflow channel 20 may extend along the flow of the exhaust gas and may be disposed to be parallel to the inflow channel 10 . in an embodiment , at least one inflow channel 10 is positioned near the outflow channel 20 . for example , if the shape of the cell is quadrangle , the wall 30 enclosing the outflow channel 20 has four surfaces . at least one surface among four surfaces of the wall 30 enclosing the outflow channel 20 may be positioned between the outflow channel 20 and the inflow channel 10 neighboring thereto . if the shape of the cell is quadrangle , the outflow channel 20 is enclosed by four neighboring inflow channels 10 , and the inflow channel 10 is enclosed by four neighboring outflow channels 20 , however it is not limited thereto . the front of the outflow channel 20 is blocked by the second plug 22 such that the exhaust gas may not inflow inside the particulate filter 1 through the outflow channel 20 . the rear of the outflow channel 20 is opened such that the exhaust gas inside the particulate filter 1 may be outflowed outside the particulate filter 1 through the outflow channel 20 . the wall 30 is disposed between the inflow channel 10 and the outflow channel 20 neighboring to each other , thereby defining a boundary . the wall 30 may be a porous wall 30 in which at least one micropore is formed . the porous wall 30 fluid - communicates the inflow channel 10 and the outflow channel 20 neighboring each other . accordingly , the exhaust gas inflowing to the inflow channel 10 may be moved to the outflow channel 20 thorough the porous wall 30 . in an embodiment , the porous wall 30 does not pass the particulate matter included in the exhaust gas . when the exhaust gas moves from the inflow channel 10 to the outflow channel 20 through the porous wall 30 , the particulate matter included in the exhaust gas is filtered by the porous wall 30 . the porous wall 30 may be manufactured from aluminum titanate , codieriteor silicon carbide , etc . a catalyst 50 may be coated to the porous wall 30 . however , such a catalyst 50 coating arrangement is not limited thereto . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the wall 30 . also , the catalyst 50 of two or more kinds may be coated to the wall 30 . for example , the three - way catalyst may be coated on the inner wall of the inflow channel 10 , and the selective reduction catalyst may be coated on the inner wall of the outflow channel 20 . the supporting member 40 may be disposed inside the outflow channel 20 . the supporting member 40 may be a plurality of structures for absorbing the catalyst as a ball shape , and the structures of the ball shape may fill at least part of an inside of the outflow channel 20 . the supporting member 40 according to a present exemplary embodiment is the structure of an oval shape as one example , however various other structure shapes may be provided and / or employed . the supporting member 40 according to the first exemplary embodiment of the present disclosure may include at least one of the porous ball and the catalyst supporting ball . for example , the supporting member 40 may be the ceramic ball , and further may be an alumina ball including al 2 o 3 . the catalyst 50 may be coated to the supporting member 40 . that is , depending on a design intention , various catalysts 50 such as a three - way catalyst , an oxidation catalytic , a hydrocarbon trap catalyst , a selective catalytic reduction ( scr ) catalyst , etc . may be coated to the supporting member 40 . also , the catalyst 50 of two or more kinds , or constituent materials , may be coated to the supporting member 40 . for example , the three - way catalyst and the selective reduction catalyst may be sequentially coated to the supporting member 40 . furthermore , the three - way catalyst may be coated to the part of the supporting member 40 and the selective reduction catalyst may be coated at the remaining part . the kind of the catalyst 50 coated to the supporting member 40 may be the same as or different from the kind of the catalyst 50 coated to the wall 30 . when the supporting member 40 is the porous material , the catalyst 50 is coated to the surface of the supporting member 40 and the inner pore of the supporting member 40 . alternatively , when the supporting member 40 is the non - porous material , the catalyst 50 may be coated to the surface of the supporting member 40 . further , the amount of the catalyst 50 coated to the supporting member 40 may be more than the amount of the catalyst 50 coated to the wall 30 . the wall 30 executes the function of a filter such that the catalyst 50 may be thinly coated to the wall 30 , however the supporting member 40 does not execute the function of the filter such that the catalyst 50 may be thickly coated to the supporting member 40 . the supporting member 40 coated with the catalyst 50 may be formed by together coating a catalyst slurry and an junction member to the supporting member 40 including at least one among the porous ball or the catalyst supporting ball . also , a drying process and a baking process may be sequentially executed to fix the supporting member 40 inside the outflow channel 20 after inserting the supporting member 40 inside the outflow channel 20 . in such a case , the drying process may be executed at 100 - 140 ° c . for 1 - 3 hours , and the baking process may be executed at 400 - 600 ° c . for 1 - 3 hours . as described above , the particulate filter 1 according to the first exemplary embodiment of the present disclosure may include the supporting member 40 filled inside the outflow channel 20 such that the amount of the coated catalyst 50 may increase . here , the amount of the catalyst 50 means the amount of the catalyst coated per unit length or unit area . also , the supporting member 40 may only be formed in the outflow channel 20 that is the channel in the outlet direction , but may not be formed in the inflow channel 10 such that an increasing of back pressure may be minimized . next , the particulate filter according to the second exemplary embodiment of the present disclosure will be described with reference to fig4 and fig5 . fig4 is a cross - sectional view of a catalyzed particulate filter according to a second exemplary embodiment of the present disclosure , and fig5 is a rear view partially showing an inflow channel and an outflow channel of the catalyzed particulate filter of fig4 . the catalyzed particulate filter according to the second exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described first exemplary embodiment except for the structure of the supporting member such that an overlapping description is omitted . referring to fig4 and fig5 , the supporting member 40 of the particulate filter 1 according to the second exemplary embodiment of the present disclosure may be at least one of metal foam , metal fiber , wire mesh , ceramic foam , and ceramic fiber as the porous structure . here , the material of the metal foam , the metal fiber , and the wire mesh may include at least one of aluminum ( al ), copper ( cu ), nickel ( ni ), manganese ( mn ), magnesium ( mg ), iron ( fe ) and titanium ( ti ). also , the material of the ceramic foam and the ceramic fiber may include at least one among silicon ( si ), carbon ( c ) and nitrogen ( n ). like the first exemplary embodiment , the catalyst 50 may be coated to the surface of the supporting member 40 , and the amount of the coated catalyst 50 may increase through the supporting member 40 . also , the supporting member 40 is formed to the outflow channel 20 that is the channel of the outlet direction , but is not formed in the inflow channel 10 such that an increasing of the back pressure may be minimized . next , a particulate filter according a third exemplary embodiment of the present disclosure will be described with reference to fig6 . fig6 is a cross - sectional view of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure is the same as the catalyzed particulate filter according to the above - described second exemplary embodiment except for the supporting member such that the overlapping description is omitted . referring to fig6 , the catalyzed particulate filter according to the third exemplary embodiment of the present disclosure may include the catalyst 50 formed while filling at least part of an inside of the outflow channel 20 . here , the catalyst 50 may be formed of at least one of the catalyst foam and the catalyst fiber . that is , without the supporting member 40 of the catalyst 50 , the catalyst 50 is itself formed of the foam , the fiber and / or the mesh shape . the method forming the catalyst 50 inside the outflow channel 20 of the catalyzed particulate filter according to the third exemplary embodiment will be described with reference to fig7 to fig9 . fig7 to fig9 are views sequentially showing a manufacturing process of a catalyzed particulate filter according to a third exemplary embodiment of the present disclosure . fig7 to fig9 only show the outflow channel 20 of the particulate filter 1 , for convenience . first , as shown in fig7 , the cell of the particulate filter 1 including the outflow channel 20 formed by being enclosed by the wall 30 coated with the catalyst 50 in four directions is manufactured . also , as shown in fig8 , a foam template 45 of the size corresponding to the size of the internal space of the outflow channel 20 is manufactured . in this case , because the foam template 45 must be removed through the drying and baking processes after executing the function of fixing the catalyst that will be described later , the foam template 45 may be formed of at least one of carbon , polymer and a styrofoam . next , referring to fig9 , after inserting the foam template 45 inside the outflow channel 20 of the particulate filter 1 , the catalyst slurry is packed inside the outflow channel 20 to be uniformly coated to the foam template 45 . next , by removing the foam template 45 through the drying and baking processes and hardening the catalyst 50 , the catalyst 50 that was coated to the foam template 45 may be formed of a catalyst foam shape that is similar to the original shape of the foam template 45 , thereby completing the particulate filter according to the third exemplary embodiment shown in fig6 . as described above , in the catalyzed particulate filter according to an exemplary embodiment of the present disclosure , as the supporting member is formed inside at least one outflow channel and the catalyst is coated to the supporting member , the catalyst loading amount may increase while minimizing the increasing of back pressure . also , since the catalyst loading amount and the contact area ( time ) of the fluid and the catalyst may increase while maintaining the thickness of the wall , filter performance and catalyst performance may be sufficiently obtained . while this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments , it is to be understood that the disclosure is not limited to the disclosed embodiments , but , on the contrary , is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims . | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | 0.25 | 01c4cc16d2d3cb725fbea0efc5775d5c4bf0cf2568c64bebbc66844b7b4d02a0 | 0.004456 | 0.066406 | 0.002884 | 0.208984 | 0.033203 | 0.059326 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Is this patent appropriately categorized as 'Human Necessities'? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.012024 | 0.003281 | 0.000109 | 0.02124 | 0.005219 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Should this patent be classified under 'Electricity'? | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.033203 | 0.014954 | 0.002808 | 0.004761 | 0.004761 | 0.020386 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Is 'Chemistry; Metallurgy' the correct technical category for the patent? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.062988 | 0.003281 | 0.015869 | 0.02124 | 0.036133 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Should this patent be classified under 'Textiles; Paper'? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.001205 | 0.003281 | 0.000029 | 0.02124 | 0.006897 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Is 'Fixed Constructions' the correct technical category for the patent? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.012817 | 0.003281 | 0.010681 | 0.02124 | 0.02002 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Does the content of this patent fall under the category of 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.069336 | 0.039063 | 0.003281 | 0.000999 | 0.02124 | 0.042725 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Should this patent be classified under 'Physics'? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.079102 | 0.002975 | 0.129883 | 0.02063 | 0.098145 |
null | a method for preparing a semiconductor wafer and a solid state imaging device according to the present invention will hereinafter be described with reference to the accompanying drawings . first , a process for preparing a semiconductor substrate or wafer according to an embodiment of the present invention will be explained referring to fig3 . first of all , a silicon ingot 10 is obtained through the crystal growth process using the cz method . the silicon ingot 10 has , for example , a diameter of 6 inches , a crystal orientation & lt ; 100 & gt ;, and also has phosphor doped therein . a specific resistance or resistivity ( design value ) of the silicon ingot 10 is in a range from 8 to 12 ωcm , its oxygen concentration oi satisfies [ oi ]≈ 1 . 5 × 10 18 atoms / cm 3 , and its carbon concentration cs satisfies [ cs ] & lt ; 1 × 10 16 atoms / cm 3 . after pulling up the ingot 10 , it is subjected to a polishing work so as to have a cylindrical configuration in order to determine its diameter as the ingot 10 , subjected to a crystal face orientating and forming an orientation flat . then , in a slicing process 1 , the silicon ingot 10 is sliced by a slicing blade 11 with an inner periphery blade in a known manner to obtain a silicon wafer 10a . in the next beveling process 2 , a grinding wheel 12 is pushed against the silicon wafer 10a to chamfer it . in a lapping process 3 , next , in order to remove a damage of the silicon wafer 10a or its irregular thickness during slicing the wafer 10a the silicon wafer 10a is subjected to a lapping work . the lapping work is carried out by mechanically lapping a plurality of such wafers 10a positioned on a carrier 13 by using , e . g ., no . 1200 al 2 o 3 . then , in an etching process 4 , the wafers 10a are subjected to the etching process to remove damaged portions caused by the lapping process and so on . this etching process is performed by isotropic etching . the etching process is carried out by using an etching solution 14 of a mixture of hf , hno 3 and ch 3 cooh so that the wafers are etched away by a thickness in a range from 10 to 5 μm at one side . subsequently , the silicon wafers 10a are cleaned with use of aqueous solution of nh 4 oh and h 2 o 2 . after this cleaning process , the silicon wafers 10a are subjected to the annealing process in a gas ambient containing hydrogen according to the present invention . that is , the silicon wafers 10a are disposed within a quartz tube 15 , h 2 gas 16 is supplied into the tube , and then the wafers are subjected to the annealing process in a gas ambient of 100 % of h 2 gas 16 supplied thereto , for example , at a temperature of 1050 ° c . for 30 minutes . a specific resistance of the wafer , which variations have been large due to the generation of thermal donors prior to the annealing process , becomes stably within a range from 8 to 11 ωcm after the annealing process . thus , it will be appreciated that the annealing process can provide a thermal donor killer effect . next , in a polishing process 6 , the surfaces of the silicon wafers 10a are polished by injecting an abrasive material 17 through primary and secondary polishing processes by an amount of about 8 μm to obtain their mirror finished surfaces . in this figure , reference numeral 18 denotes a plate , and 19 a cloth . thereafter , in a mirror surface cleaning process 7 , the wafers are subjected to a final cleaning work to obtain final semiconductor substrates , i . e ., final silicon wafers 10h . the higher the temperature is and the longer the treatment time is , the annealing process using the hydrogen gas affects up to the more inner part of the wafer 10a . as a consequence , the annealing conditions and polishing conditions must be determined taking such influences into consideration . with respect to each of the silicon wafer thus prepared according to the present embodiment and a silicon wafer prepared according to the prior art thermal donor killer annealing process ( that is , the wafers are subjected to an annealing operation in an n 2 gas ambience at 1050 ° c . for 30 minutes ), a thermally oxidized film ( sio 2 film ) of 25 nm thick is formed thereon at 1000 ° c ., an al gate electrode is formed on the oxidized film to thereby form a mos diode , and then the resultant wafers or diodes are subjected to measurements of their gate breakdown voltage . the measurement results are shown in fig4 . in this case , when a gate area of the wafer is set at 0 . 45 cm 2 and a breakdown current is at 5 μa , ones of the wafers having a breakdown electric field of higher than 8 mv / cm were evaluated as good products . it will be seen from fig4 that the gate oxidation film or sio 2 film according to the present embodiment has a remarkably improved breakdown voltage . according to the aforesaid embodiment , fine oxygen precipitates and point defect clusters can be removed by subjecting the silicon wafer 10a after the etching process 4 to an annealing process in an h 2 gas ambience at 1050 ° c . for 30 minutes . at the same time , the thermal donors can be removed through the above annealing process . as a result , there can be prepared a semiconductor wafer which is free of thermal donors , fine oxygen precipitates and point defects . the annealing temperature can be set at such a value higher than 500 ° c . that allows decomposition or removal of such defects , and preferably the annealing temperature is in a range from 900 ° to 1250 ° c . while the wafers have been treated in an ambient containing 100 % of h 2 gas in the foregoing embodiment , the present invention is not limited to the specific example and the treatment may be carried out in a gas ambience containing a mixture gas such as a forming gas ( n 2 + h 2 ) or the like . in this connection , the higher the hydrogen concentration is , the greater the effect is . further , although the hydrogen annealing process according to the present invention may be carried out between the slicing process 1 and the cleaning process 7 after polishing , most preferably the hydrogen annealing process may be performed after the etching step 4 where the damaged portions caused by the lapping process and impurities have been removed through this etching process , and before the final polishing process 6 . this is because lots of surface impurities exist on the wafer prior to the etching process , and so , if the annealing process is performed before the etching process , the impurities tend to be diffused into the interior of the wafer through the annealing process . in contrast , if the annealing process is performed after the polishing process , the surface of the wafer possibly becomes highly rough due to the annealing . while explanation has been made as to the preparing method of the silicon wafers in the above - mentioned embodiment , the present invention may be applied also to preparing methods of other semiconductor wafers . it has been confirmed that the hydrogen gas can usually work well as the molecular state of the hydrogen annealing process , but the atom or plasma state of hydrogen may also exhibit good effect . semiconductor wafers usable in the present invention include ones obtained by the czochralski ( cz ) method , magnetic - field - applied czochralski ( mcz ) method or floating zone ( fz ) method or the like . a method for preparing a solid state imaging device according to another embodiment of the present invention will be described with reference to fig5 a to 5f . this embodiment corresponds to a case where the present invention is applied to the preparation of a solid state imaging device constituting the ccd type solid state imaging element shown in fig1 . the present embodiment is arranged so that , immediately before forming a gate insulating film for charge transfer , a sensor insulating film to be formed in a photo receptor portion or both the insulating films , a semiconductor wafer is subjected to the annealing process in an ambient containing hydrogen at a temperature higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . as a consequence , such defects as fine defects in the vicinity of the surface of the wafer and secondary crystalline defects can be suppressed in generation , whereby white defects thereof can be reduced and its gate breakdown voltage can be improved . as shown in fig5 a , first , a well region 22 of a second conductivity type or a first p - type is formed on a silicon substrate ( wafer ) 21 of a first conductivity type , for example , an n - type , and then an n - type impurity and a p - type impurity are selectively introduced by the ion implantation technique within the first p - type well region 22 , thereby forming an n - type transfer channel region 24 , a p - type channel stop region 25 and a second p - type well region 27 which constitutes a vertical register . as shown in fig5 b , then , a resultant wafer thus obtained is subjected to the annealing process in a gas ambience containing 100 % of h 2 gas , for example , at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 c , a resultant wafer is subjected to the oxidizing process at 1000 ° c . to form thereon an sio 2 film 29 of about 30 nm thick . then , as shown in fig5 d , an si 3 n 4 film 30 and an sio 2 film 31 are sequentially formed on the entire surface of the sio 2 film 29 , and then the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 at the portion where a photo sensor 28 is to be formed are selectively etched away . in this respect , a gate insulating film 32 is formed by the n - type transfer channel region 24 , a region to be formed as a read gate portion 37 , the sio 2 film 29 , si 3 n 4 film 30 and sio 2 film 31 on the p - type channel stop region 25 . thereafter , a transfer electrode 33 of a polycrystalline silicon layer is formed on the gate insulating film 32 , to thereby form a vertical register 38 which is formed of the n - type transfer channel region 24 , the gate insulating film 32 and the transfer electrode 33 . thereafter , a region corresponding to the photo sensor 28 is subjected to the ion implantation process to form an n - type impurity diffusion region 23 . though not illustrated , of course , even in the case of processing a horizontal register , the wafer is subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes prior to the formation of the gate insulating film thereof . as shown in fig5 e , a resultant wafer is again subjected to the annealing process in the 100 %- h 2 gas ambient at 1000 ° c . for 30 minutes . subsequently , as shown in fig5 f , a sio 2 film 39 of about 30 nm thick as a sensor insulating film is formed on a part of the wafer corresponding to the photo sensor 28 . at the same time , the sio 2 film 39 is also formed even on the surface of the transfer electrode 33 made of polycrystalline silicon . thereafter , though not shown in fig5 f , a p - type positive - charge accumulation region 26 is formed on the surface of the n - type impurity diffusion region 23 of the photo sensor 28 , an interlayer insulating film 34 made of psg or the like is formed on the entire surface of the wafer including the transfer electrode 33 , and then an al light shielding film 35 is formed to obtain such the ccd type solid state imaging device 40 as shown in fig2 . in accordance with the present embodiment , immediately prior to the formation of the insulating films , that is , immediately prior to the formation of the sio 2 film 29 serving as the gate insulating film and immediately prior to the formation of the sio 2 film 39 serving as the sensor insulating film , the wafer is subjected to the annealing process in the h 2 gas ambient at 1000 ° c . for 30 minutes . therefore , fine oxygen precipitates present in the surface of the silicon substrate , secondary defects , si x o y clusters and the like can be removed . as a result , in the photo sensor 28 , a leak current flowing through the pn junction forming the photo receptor portion can be reduced , and a dark current can be decreased , and hence white defects as the defects on the screen of the imaging device can be reduced . in the gate insulating film , further , defects in the sio 2 film 29 and in the interface between the sio 2 film 29 and the silicon substrate , and further in the active region under the sio 2 film 29 can be reduced , whereby the breakdown voltage of the gate insulating film can be improved and a transfer failure can be improved . although the wafer has been treated in the 100 %- h 2 gas ambient in the foregoing embodiment , the present invention is not limited to the specific example , and a gas ambience containing a mixture gas ( n 2 + h 2 ) as a forming gas may be employed like the prior art shown in fig3 . the temperature and time period of the annealing process are arbitrarily determined dependent on the amount and distribution of defects , the hydrogen diffusion length or the like , and on the structure of the imaging devices . the annealing temperature may be set at a value higher than 500 ° c . and desirably in a range between 700 ° c . and 1250 ° c . the insulating film may comprise only the sio 2 film formed by using the chemical vapor deposition ( cvd ) technique or the thermal oxidation technique or may comprise a composite film formed by at least the sio 2 film and the si 3 n 4 film . the present invention can attain much remarkable effect when employing the former insulating film than the latter . according to the aforesaid embodiment , the annealing process has been carried out in the ambient containing hydrogen immediately prior to the formation of the gate and sensor insulating films 32 and 39 . however , the annealing process may also be effected in the hydrogen - contained ambient only immediately prior to the formation of the gate insulating film 32 or only immediately prior to the formation of the sensor insulating film 29 . in this case , enhancement in the breakdown voltage of the gate insulating film , improvement in the transfer deterioration and reduction in white defects as ones on the screen of the imaging device can be realized advantageously . in accordance with the present invention , there can be prepared a good quality of semiconductor substrate which , through an annealing process in a hydrogen - contained ambient in the course of preparing the semiconductor substrate , can be made free of not only thermal donors ( si x o y clusters ) present immediately after pulling up of its crystal but also defects such as fine oxygen precipitates and point defect clusters or the like , which removal would be impossible in the prior art . in a process for preparing a solid state imaging device in accordance with the present invention , an annealing process is carried out in such an ambient as to contains hydrogen immediately prior to the formation of the insulating film , whereby there can be prepared a reliable solid state imaging device which can eliminate fine oxygen precipitates present in the surface of a semiconductor substrate and secondary defects or the like , which removal would be impossible in the prior art , can reduce white defects appearing on the screen of the imaging device and can remove a transfer failure . having described the preferred embodiments of the invention with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications thereof could be effected therein by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims . | Does the content of this patent fall under the category of 'Electricity'? | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | 0.25 | 6c576cbb56cae2cc38753608ef76e3c10f9e7e587032ed656a41c651d97e664c | 0.067383 | 0.070801 | 0.002975 | 0.051758 | 0.02124 | 0.084961 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | Is 'Human Necessities' the correct technical category for the patent? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.062988 | 0.001984 | 0.121582 | 0.000051 | 0.139648 | 0.001099 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Should this patent be classified under 'General tagging of new or cross-sectional technology'? | Is 'Performing Operations; Transporting' the correct technical category for the patent? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.098145 | 0.001755 | 0.212891 | 0.000687 | 0.143555 | 0.00383 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Is this patent appropriately categorized as 'General tagging of new or cross-sectional technology'? | Should this patent be classified under 'Chemistry; Metallurgy'? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.129883 | 0.394531 | 0.261719 | 0.296875 | 0.170898 | 0.152344 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | Is 'Textiles; Paper' the correct technical category for the patent? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.075684 | 0.000553 | 0.053467 | 0.000012 | 0.166992 | 0.001595 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | Is 'Fixed Constructions' the correct technical category for the patent? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.061768 | 0.020386 | 0.121582 | 0.004333 | 0.139648 | 0.017456 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.061768 | 0.005554 | 0.121582 | 0.000191 | 0.139648 | 0.004456 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | Should this patent be classified under 'Physics'? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.062988 | 0.008057 | 0.121582 | 0.000668 | 0.139648 | 0.00592 |
null | the preferred embodiments of the present invention relate to the use of a mineral additive to manufacture and improve the properties of a cementitious slurry . more preferably , one or both of the following mineral components are added to the slurry : i ) fly ash having a predominant particle size of up to about 10 microns , and ii ) aluminous material having a predominant particle size of up to about 150 microns . the fly ash in the mineral additive refers to fly ash with a predominant particle size of up to about 10 microns . as will be clear to persons skilled in the art , fly ash is a solid powder having a chemical composition similar to or the same as the composition of material that is produced during the combustion of powdered coal . the composition typically comprises about 25 to 60 % silica , about 10 to 30 % al 2 o 3 , about 5 to 25 % fe 2 o 3 , up to about 20 % cao and up to about 5 % mgo . fly ash particles are typically spherical and range in diameter from about 1 to 100 microns . it is the smaller size fraction of fly ash particles with a predominant size below about 10 microns that has surprising water reduction properties . the fly ash preferably makes up about 30 - 100 % based on weight of cement . preferably , the fly ash is between about 40 and 90 % and most preferably about 50 to 70 % based on weight of cement . larger size fly ash particles have been known in the past to provide a water reduction effect . smaller size particles , however , have always been considered unsuitable for water reduction for a few reasons . firstly , it is expected in the art that the smaller the particle size , the more reactive the particle . fly ash is a reactive pozzalan and accordingly , smaller size fraction fly ash was considered inappropriately reactive to act as a water reducer . in addition , due to the high specific surface area of the smaller size fraction fly ash , it was expected that this material would in fact increase water demand . the applicants have surprisingly found that the opposite is in fact the case . the smaller size fraction fly ash boosts the water reducing properties of conventional water reduction agents by a substantial extent . the aluminous material in the mineral additive preferably has a predominant particle size less than about 150 microns . the reference to “ aluminous material ” should not be taken literally but refers to alumina type materials including hydrated , partially hydrated and unhydrated alumina . preferably , the alumina content of aluminous material based on the weight of cement is between about 5 and 30 %, preferably about 10 to 25 % and most preferably about 15 to 20 %. if a blend of hydrated alumina and fly ash is used in the mineral additive , the ratio of hydrated alumina : fly ash is preferably between about 1 : 1 to 1 : 10 . the term “ hydraulic or cementitious binder ” as used herein , means all inorganic materials which comprise compounds of calcium , aluminum , silicon , oxygen , and / or sulfur which exhibit “ hydraulic activity ” that is , which set solid and harden in the presence of water . cements of this type include common portland cements , fast setting or extra fast setting , sulphate resisting cements , modified cements , alumina cements , high alumina cements , calcium aluminate cements and cements which contain secondary components such as fly ash , slag and the like . the amount of cement present in the composition of the preferred embodiments of the present invention has a lower limit of about 10 weight percent based on the total dry ingredients , preferably about 15 weight percent , more preferably about 20 weight percent , the upper limit of the amount of the cement is about 50 weight percent , preferably about 40 weight percent , more preferably about 30 weight percent . the cementitious composition may optionally but preferably include at least one filler material , e . g . graded and ungraded aggregate such as washed river gravel , crushed igneous rock or limestone , lightweight aggregate , crushed hard - burnt clay bricks or air - cooled blast furnace slag , sand , calcium carbonate , silica flour , vermiculite , perlite , gypsum , etc . the amount of filler present in the cementitious composition preferably has a lower limit of about 5 weight percent based on the total dry ingredients , preferably about 10 weight percent , more preferably about 15 weight percent ; the upper limit being about 30 weight percent , preferably about 25 weight percent , more preferably about 20 weight percent . the cementitious composition may optionally contain other additives including : cement plasticising agents such as melamine sulphonate - formaldehyde condensates , naphthalene sulphonate - formaldehyde condensates , naphthalene sulphonates , calcium lignosulphonates , sodium lignosulphonates , saccharose , sodium gluconate , sulphonic acids , carbohydrates , amino carboxylic acids , polyhydroxy carboxylic acids , sulphonated melamine , and the like . the amount of conventional plasticiser used in the dry cement composition will vary , depending on the fluidising ability of the particular cement plasticiser selected . generally , the amount of cement plasticiser is preferably in the range of about 0 . 3 to about 3 wt %, and more preferably about 0 . 5 to about 2 wt %, based on the weight of the dry cement composition . preferred plasticisers include melment . f - 10 , a melamine - formaldehyde - sodium bisulphite polymer dispersant , marketed by skw - trostberg in the form of a fine white powder . another suitable plasticiser is neosyn , a condensed sodium salt of sulphonated naphthalene formaldehyde , available from hodgson chemicals . thickener may also be used in the cementitious composition including one or more of the polysaccharide rheology modifiers which can be further subdivided into cellulose based materials and derivatives thereof , starch based materials and derivatives thereof , and other polysaccharides . suitable cellulose based rheology - modifying agents include , for example , methylhydroxyethylcellulose , hydroxymethylethylcellulose , carboxymethylcellulose , methylcellulose , ethylcellulose , hydroxyethylcellulose , hydroxyethylpropylcellulose , etc . the entire range of suitable rheology modifiers will not be listed here , nevertheless , many other cellulose materials have the same or similar properties as these and are equivalent . suitable starch based materials include , for example , amylopectin , amylose , sea - gel , starch acetates , starch hydroxyethyl ethers , ionic starches , long - chain alkylstarches , dextrins , amine starches , phosphate starches , and dialdehyde starches . other natural polysaccharide based rheology - modifying agents include , for example , alginic acid , phycocolloids , agar , gum arabic , guar gum , welan gum , locust bean gum , gum karaya , and gum tragacanth . the thickener addition rate in the cementitious composition may range between 0 . 0001 and 0 . 5 % based on the weight of the dry cement composition . latex addition of at least one latex selected from the group consisting of : an acrylic latex , a styrene latex , and a butadiene latex is also preferred . this component improves adherence , elasticity , stability and impermeability of the cementitious compositions containing it , and also favours formation of flexible films . the latex may be used in solid amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally incorporate as a substitute to the latex emulsion a proportion of a powdered vinyl polymer or other equivalent polymeric material , to enhance the adhesion ; resilience and flexural strength ; and abrasion resistance of the composition . the powdered vinyl polymer is preferably polyvinyl acetate or a copolymer of vinyl acetate with another monomer , such as ethylene . a preferred vinyl acetate resin is vinnapas ll5044 thermoplastic resin powder , containing a vinyl acetate - ethylene copolymer , available from wacker . the powdered vinyl polymer may be used in amounts of about 0 . 5 to about 20 wt %, based on the weight of the dry cement composition . preferably , it is present in an amount of about 1 to about 15 wt %, and more preferably about 10 wt %, based on the weight of the dry cement composition . the cementitious composition may optionally contain about 0 - 40 wt % of other fillers / additives such as mineral oxides , hydroxides and clays , metal oxides and hydroxides , fire retardants such as magnesite , thickeners , silica fume or amorphous silica , colorants , pigments , water sealing agents , water reducing agents , setting rate modifiers , hardeners , filtering aids , plasticisers , dispersants , foaming agents or flocculating agents , water - proofing agents , density modifiers or other processing aids so that the present invention may be more clearly understood it will now be described by way of example only with reference to the following embodiments . effect of water reducer and small size fraction fly ash addition on % water reduction in a cement : fly ash mixture three mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the mixes are shown in table 1 below . it can be seen that the addition of 1 % water reducer by weight in cement resulted in 36 % reduction in mix water . this level of water reduction is , according to literature , about the limit of what can be achieved at such high water reducer dose . using higher doses would result in excessively delayed setting time and reduction in the compressive strength in cementitious mixes . when part of the large size fraction fly ash was substituted with smaller size fraction ( predominant particle size less that 10 microns ) in mix 3 , further water reduction was achieved , bringing total water reduction to 41 %. this result is quite surprising , as the finer fly ash was expected to in fact increase the water demand in the mix due to its high surface area . although the water reducing effect of fly ash in cementitious mixes is well documented in literature , the plasticity enhancing effect of the smaller size fraction in an already plasticised cement : fly ash mixture is considered surprising given the universal rule that finer material exhibit larger surface area , leading to an increase in the water demand , needed as mechanical water coating the finer particles . example 1 demonstrates a means of enhancing the water reduction effect in plasticised mixes using a mineral additive with a specified size range , namely the small size fraction fly ash , without resorting to overdosing with water reducer . the result is a more durable mix with higher strength and reduced shrinkage . water reduction in plasticised mixes substituting large size fraction fly ash for smaller size fraction fly ash two mixes ( total weight of solids = 1000 gm each ) were mixed with water to achieve a mix viscosity in the range of 6 - 10 poise . the details of the two mixes are shown in table 2 below . it can be seen that mix 1 which was comprised of cement , fly ash and cenospheres ( ceramic hollow spheres ) required 400 ml of water to achieve the required viscosity ( in the presence of 1 % addition of melment f15 water reducer ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting part of the larger fly ash particles with a smaller size fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. two mixes ( total weight of solids = 1000 gm ) were mixed with water to achieve a mix viscosity of 4 - 3 seconds cup drainage time . the details of the two mixes are shown in table 3 below . it can be seen that mix 1 which was comprised of cement , fly ash and silica required 400 ml of water to achieve the required viscosity ( in the presence of 1 % water reducer addition ). the % solids in this case is 71 . 4 %. mix 2 , however , required only 325 ml of water to achieve a similar flowability . such water reduction ( around 20 %) was enabled by substituting the silica with ultra fine fraction ( minus 10 microns in size , average size = 4 microns ). the % solids in this case was increased to 75 . 5 %. water reduction in plasticised mixes incorporating combination of hydrated alumina and fly ash in table 4 , the water requirements for two mixes containing 1 . 0 % addition ( by weight of cement ) of a water reducer , ie sulphonated naphthalene formaldehyde , are compared . it can be seen that the addition of 2000 gm of hydrated alumina in mix 2 ( in substitution of calcium carbonate ), resulted in a significant reduction in the water demand , ie from 16500 to 12500 ml , for the same viscosity level . this level of water reduction ( around 25 % in an already heavily plasticised mix ) is quite unexpected . it is also contrary to conventional water reduction trends presented in cement chemistry literature which suggest that the amount of water reduction ranges generally between 15 % to 35 %, and that ( beyond a particular dosage ) further water reduction is not possible ( concrete admixtures handbook by , ramachandran , 2 nd edition , page 447 ). from the examples outlined above it can be seen that using a mineral additive comprising small size fraction fly ash and / or aluminous materials provide water reduction in non - plasticised cementitious mixes or additional / enhanced water reduction in plasticised cementitious mixes containing a conventional water reducing agent . such significant increase in water reduction between 20 % and 40 % will enable production of high performance cementitious mixes ( lower shrinkage , higher strength , more durable ), without the disadvantages of overdosing with conventional organic water reducers , ie delayed setting time , strength reduction , excessive aeration . etc . it will be understood that the modifications or variations can be made to the aforementioned embodiments without departing from the spirit or scope of the present invention . in particular , it will be appreciated that the formulations , coatings , additives , methods and composite products of the present invention are suitable or may be adapted for use in conjunction with the methods and apparatus as described in the various priority documents . | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | Is this patent appropriately categorized as 'Electricity'? | 0.25 | 895f73f3c788bd6267665dfa61efa5b7d80e9494f653d9c4f37f53a8d0c649b8 | 0.077148 | 0.000345 | 0.053467 | 0.000008 | 0.166992 | 0.000051 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.091309 | 0.003601 | 0.044678 | 0.000035 | 0.099609 | 0.004608 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.099609 | 0.006897 | 0.060059 | 0.000912 | 0.121094 | 0.004211 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Textiles; Paper'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.088867 | 0.000668 | 0.046143 | 0.000008 | 0.099609 | 0.021973 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Fixed Constructions'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.091309 | 0.026733 | 0.037842 | 0.043945 | 0.114258 | 0.18457 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.099609 | 0.027588 | 0.060059 | 0.001328 | 0.121094 | 0.054199 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is this patent appropriately categorized as 'Physics'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.099609 | 0.267578 | 0.060059 | 0.382813 | 0.121094 | 0.164063 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Electricity'? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.091309 | 0.066406 | 0.046143 | 0.001457 | 0.099609 | 0.000969 |
null | fig1 shows a generic rather thin airfoil or fluid dynamic foil ( fdf ) 43 and its air or fluid flow lines 31 that is operating at angle of attack ∝ 50 . this type airfoil is what is most commonly used today as the shape of aircraft wings , helicopter rotary wings , wind turbine rotor blades , hydrofoils , etc . by measurements of the length of the chord line 44 and maximum deviation from the chord line of the mean camber line 45 it can be established that the maximum deviation of the camber line as a percentage of chord line is about two percent in this example . this percentage is given as the first digit in the four digit naca designation of airfoil shapes . for general background information , when a four digit naca designation is given , it is defined as : 1 ) first digit = maximum camber in percent of chord , 2 ) second digit = location of position of maximum camber in percent of chord as measured from the leading edge of the airfoil , and 3 ) last two digits = maximum thickness of the airfoil in percent of chord . the fig1 airfoil therefore would have a designation of naca 2414 . the figures presented in this application normally show airfoils or fdf &# 39 ; s horizontally oriented . it is to be realized that it is within the spirit and scope of the invention that they may be oriented vertically or at any other angle including a rotation of 180 degrees from the orientation of the figures as presented . fig2 presents a prior art fat or high camber fdf 51 that would offer substantially higher c l &# 39 ; s than the slim airfoil given in fig1 except that , due to its high amount of camber and hence fat shape , would experience separation of the fluid flow over its aft end as is indicated by turbulent fluid flow lines 36 . due to its very high degree of camber and hence its fat shape this particular example has a maximum camber as percent of chord of about 15 . as such it would not even fit into the nasa four digit designation . assuming it a slimming down to a maximum camber as percent of chord designation of a single digit of nine , the designation would be : naca 9346 . as can be seen we are dealing with a whole different set of dimensions here compared to the fig1 thin airfoil . fig3 shows a way to do boundary layer control ( blc ) and to avoid the turbulent flow separation seen in the fig2 high camber fdf . this was done in prior art tests by aspirating or sucking in fluid through blc bleed opening 41 proximal where turbulence and flow separation would normally begin . fig4 shows another way to avoid the turbulent separation drag . in this prior art case test case it is accomplished by expelling fluid through blc discharge opening 49 disposed proximal where the turbulent separation would normally begin . what the prior art examples given in fig3 and 4 do is reduce or eliminate the drag values associated with turbulent separation flow patterns . the fig3 and 4 coefficient of lift ( c l ) has been measured in the 4 - 4 . 5 area which is about 2 . 5 times greater than the c l of 1 . 6 or so experienced by the more accepted thin airfoil presented in fig1 . a main reason that the fat high camber airfoils have not seen acceptance is because of the weight , cost , and complexity of the blowers and their powering means required to do the air or fluid pumping . referring back to the discussion of fig2 , it is considered that a preferred maximum camber as percent of chord of at least seven is called for in the case of the instant invention fdf 42 with a value of at least nine more normal and a value of eleven or higher giving best results . fig5 presents a basic variant of the instant invention whereby a rotary element 30 is placed as a forward portion of the shape of the high camber airfoil or fdf 42 . the high camber fdf &# 39 ; s aft portion 52 makes up the rest of the fdf 42 . in this instance the rotary element 30 accelerates fluid by means of the coanda effect over the upper surface of the fdf 42 as it rotates as indicated by rotational arrow 32 . this acceleration of oncoming fluid means that a higher velocity and lower static pressure results over the upper surface of this high camber fdf 42 as is well defined by bernoulli &# 39 ; s equations . the simple and low cost approach suggested here gives even higher efficiencies , due to higher velocities and related lower static pressures , than the high camber fat or high camber fdf shapes of fig2 - 4 . it is expected that an overall efficiency gain of 25 - 30 percent can be realized compared to the prior art of fig2 - 4 which would mean a c l of 5 - 6 may be realized . that c l is 3 to 4 times that of the present day state of the art thin airfoils . it should be possible that this can be accomplished without blc ; however , provision to do blc simply and at low cost , ideally in the preferred embodiment of the instant invention by using energy supplied by the rotary element 30 , is presented in following figures and their discussions . fig6 presents a way to control ∝ of the fdf 42 by simply rotating an aft portion 52 of the fdf 42 in relation to the rotating element 32 as is shown by rotation arrow 46 . in this case it is rotated down to give an increased ∝. fig7 shows rotation of aft portion 52 of fdf 42 upward which gives in a negative ∝. fig8 is a topside plan view of a preferred embodiment of the instant invention in the shape of a tapered wing 53 . a rotary element 30 drive motor 34 , fdf aft portion 52 drive motor 35 , portion of attached body 48 , and optional turbine drive means 38 are shown . note that the fluid discharge openings or exits 41 are in the form of longitudinally oriented slots in this wing 53 . slots are normally preferred over round openings since they spread the fluid flow that reduces turbulence over the wing more evenly . slots may be staggered , angled , or oriented in other ways . fig9 is a cross - section , as taken through plane 9 - 9 of fig8 that shows , in addition to the rotary element 30 as part of the fdf 42 , a way to accomplish blc by expelling fluid to the upper surface of the fdf 42 . note that fluid used for blc is preferably pumped or energized here by the rotary element 30 to insure simplicity of the concept . the fluid being pumped by the rotary element 30 is restrained by labyrinth seal 33 , or other flow restricting means , so that its majority is directed to passageway 39 to fluid exit 41 . it is also possible to supply blc fluid pumping means as separate items , not shown here , than use of the rotary element 30 and that is considered within the spirit and scope of the invention . it is important to note the fluid flow arrows 31 forward of the rotary element 30 . these show the fluid approaching the rotary element 30 to be induced to turn upward rather than divided more evenly top and bottom as was seen in the high camber prior art airfoils of fig2 , and 4 . this feature not only increases flow over the top of the fdf 42 but also increases the velocity of the fluid where it first encounters the forward end of the fdf 42 . what this means is that there is a lower static pressure at the forward end of the fdf 42 and hence a lower overall drag component compared to the prior art high camber airfoils of fig2 , and 4 . fig1 presents a cross - section , as taken through plane 10 - 10 of fig8 , that shows how the rotary element 30 can be integrated structurally with the full fdf 42 . this is done by way of ball bearings 37 here , however ; other ways of providing separate movement of the rotary element 30 from the fdf &# 39 ; s aft body 52 such as fluid bearings , sleeve bearings , etc . that , while not shown , are considered within the scope and spirit of the invention . fig1 is a cross - section , as taken through plane 11 - 11 of fig8 , that shows a means to power the rotation of the fdf &# 39 ; s aft portion 52 around the rotary element 30 . this is done here by means of a rack and pinion gear 55 with said gear &# 39 ; s rotation arrow 47 also shown . other means of rotating the fdf &# 39 ; s aft portion 52 such as hydraulic actuators , or the like , while not shown , are considered within the scope and spirit of the invention . fig1 presents a cross - section , as taken through plane 12 - 12 of fig8 , that illustrates a way to drive the rotary element 30 by means of an optional fluid turbine 38 . that fluid turbine 38 , while shown at the extreme or outward end of the fdf 42 in fig8 , may be positioned anywhere along the length of the fdf . it would be best located where shown when the instant invention fdf 42 is used in a rotary wing application such as is the case of the rotary wing of a helicopter or wind turbine blade . the reason for this is that the extreme of such rotary wings are traveling at the highest velocity and hence have the most fluid dynamic energy available to drive them . fig1 shows a cross - section as taken though the same plane of the high camber fdf 42 as 9 - 9 of fig8 but in this instance fluid is aspirated into the fdf 42 to accomplish blc . note that a labyrinth seal 33 is positioned further forward here to allow the rotary element 30 to work on low pressure incoming fluid rather than building up pressure as in the version shown in fig1 . fig1 shows the outline of a rotary element 30 as would be used in a tapered fdf wing that was presented in fig8 . the smaller diameter areas 56 are bearing seats in this version . fig1 presents another variation of the instant invention where the complete fdf 42 including its rotary element rotates about their attachment structure 48 in unison . this is presented since , while not as elegant as that presented in fig8 where only the fdf &# 39 ; s aft portion is used for trim control , it would be an inherently structurally stronger design than the instant invention fdf presented in the earlier figures . either the means to control ∝ presented in fig8 or fig1 can be employed and either is considered within the spirit and scope of the instant invention . fig1 is a cross - section , as taken though plane 16 - 16 of fig1 , that shows how trim can be accomplished by use of flaps 40 . fig1 shows a rotary element 30 as might be used in straight fdf wing version of the instant invention as was presented in fig1 . while the invention has been described in connection with a preferred and several alternative embodiments , it will be understood that there is no intention to thereby limit the invention . on the contrary , there is intended to be covered all alternatives , modifications , and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims , which are the sole definition of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | 0.25 | a996e62cad9eb514bc40d4b1b8062d8be61b37f026bc2f4affede9668c12934c | 0.091309 | 0.133789 | 0.046143 | 0.154297 | 0.099609 | 0.137695 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Does the content of this patent fall under the category of 'Electricity'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.024048 | 0.029297 | 0.000912 | 0.001282 | 0.008606 | 0.061035 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Is this patent appropriately categorized as 'Electricity'? | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.018311 | 0.037354 | 0.000755 | 0.014038 | 0.003479 | 0.040283 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Should this patent be classified under 'Electricity'? | Should this patent be classified under 'Chemistry; Metallurgy'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.009705 | 0.043945 | 0.000179 | 0.002396 | 0.001328 | 0.014954 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Is 'Electricity' the correct technical category for the patent? | Is 'Textiles; Paper' the correct technical category for the patent? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.008301 | 0.00592 | 0.000999 | 0.000066 | 0.002258 | 0.031738 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Should this patent be classified under 'Electricity'? | Is this patent appropriately categorized as 'Fixed Constructions'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.009399 | 0.086426 | 0.000179 | 0.077148 | 0.001328 | 0.121094 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Is this patent appropriately categorized as 'Electricity'? | Is 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting' the correct technical category for the patent? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.018799 | 0.005554 | 0.000755 | 0.000755 | 0.003479 | 0.036865 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Should this patent be classified under 'Electricity'? | Is this patent appropriately categorized as 'Physics'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.009399 | 0.108398 | 0.000179 | 0.235352 | 0.001328 | 0.086426 |
null | fig1 shows an embodiment in accordance with the invention of gan edge emitting laser structure 100 . substrate 105 is typically al 2 o 3 or sic with gan buffer layer 110 separating substrate 105 from n - gan layer 120 . refractory metal elog masks 130 is a layer that overlies n - gan layer 120 . refractory metal elog masks 130 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . elog layers , n - gan layer 138 , n - algan lower cladding layer 140 , ingan separate confinement heterostructure layer 150 , ingan multiple quantum wells 160 , algan electron blocking layer 170 which prevents electron leakage , ingan separate confinement heterostructure layer 180 , p - type algan upper cladding layer 190 and p - type gan layer 195 overlie refractory metal elog mask 130 . n - metal contact 134 contacts refractory metal layer 130 to provide efficient current injection into active region 199 of gan edge emitting ridge waveguide laser structure 100 . p - metal contact 136 is positioned over p - type gan layer 195 . typically gan edge emitting laser structure 100 is made by taking substrate 105 , typically al 2 o 3 or sic and depositing gan buffer layer 110 over it to a typical thickness of about 30 nm . then planar n - type gan layer 120 is deposited over gan buffer layer 110 as shown in fig2 a . refractory metal elog mask 130 is deposited by sputtering or evaporation and patterned by chemically assisted ion beam etching ( caibe ) or reactive ion - etching ( rie ) over n - gan layer 120 . then elog growth is started using refractory metal elog mask 130 for growing n - gan layer 138 to a typical thickness of about 1 to about 2 μm ; n - algan lower cladding layer 140 has a typical thickness of about 1 μm ; active region 199 which comprises ingan separate confinement heterostructure layer 150 has a typical thickness of about 0 . 1 μm , ingan multiple quantum wells 160 , algan electron blocking layer 170 has a typical thickness of about 20 nm , and ingan separate confinement heterostructure layer 180 has a typical thickness of about 0 . 1 μm ( see fig1 ); p - type algan upper cladding layer 190 has a typical thickness of about 0 . 5 μm and p - type gan layer 195 has a typical thickness of about 0 . 1 μm . fig2 d shows etching typically by caibe or rie to make the typical wave guide structure by etching through p - type gan layer 195 and into p - type algan upper cladding layer 190 . a second etch by caibe or rie down to refractory metal layer 130 is performed as shown in fig2 e to provide a contact area for n - metal contact 134 . finally , n - metal contact 134 and p - metal contact 136 are deposited and annealed . fig3 shows an embodiment in accordance with the invention of gan vcsel laser structure 300 having elog n - and p - refractory metal masks with a lower dbr elog mask . substrate 305 is typically al 2 o 3 or sic with gan buffer layer 310 having a typical thickness of about 30 nm and separating substrate 305 from n - gan layer 315 with a typical thickness of about 1 μm to about 2 μm . lower dielectric distributed bragg reflector ( dbr ) 318 overlies gan buffer layer 310 . elog n - gan layer 320 with a typical thickness of about 3 μm overlies lower dielectric dbr 318 and n - refractory metal elog mask 330 is a layer that overlies elog n - gan layer 320 . n - refractory metal elog mask 330 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . care must be taken to place n - refractory metal elog mask 330 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . n - refractory metal elog mask 330 typically has a thickness of about 50 nm or less . elog layer n - gan 340 with a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - algan layer 346 having a typical thickness of about 20 nm and p - gan layer 350 with a typical thickness of about 1 μm to about 2 μm overlie refractory metal elog mask 330 . p - refractory metal elog mask 321 is a layer that overlies p - gan layer 350 . care must be taken to place p - refractory metal elog mask 321 at a null of the standing wave set up between lower dielectric dbr 318 and upper dielectric dbr 319 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . p - doped refractory metal elog mask 321 may be made from ti , pt , w , re mo , cr , ni , pd or other suitable refractory metal . p - gan layer 360 with a typical thickness of about 1 μm to about 5 μm overlies p - doped refractory metal elog mask 321 and upper dielectric dbr 319 . n - metal contact 334 contacts n - refractory metal layer 330 and p - metal contact 336 contacts p - refractory metal layer 321 to provide efficient current injection into vcsel structure 300 . typically , gan vcsel structure 300 is made by taking substrate 305 , typically al 2 o 3 or sic and depositing gan buffer layer 310 to a typical thickness of about 30 nm over it . then planar n - type gan layer 315 is deposited to a thickness of about 1 μm to about 2 μm over gan buffer layer 310 as shown in fig4 a . lower dielectric dbr 318 is then deposited and patterned as shown in fig4 b . lower dielectric dbr 318 serves as an elog mask for elog of n - gan layer 320 having a typical thickness of about 3 μm and is shown in fig4 c . then n - refractory metal elog mask 330 is deposited and patterned as shown in fig4 d . with reference to fig4 e , n - refractory metal elog mask 330 is then used to elog grow n - type gan layer 340 having a typical thickness of about 1 μm to about 2 μm , ingan multiple quantum well active region 345 , p - type algan layer 346 with a typical thickness of about 20 nm and p - type gan layer 350 with a typical thickness of about 1 μm to about 2 μm . after growing p - doped gan layer 350 , p - refractory metal elog mask 321 is deposited on p - doped gan layer 350 and patterned as shown in fig4 f . elog of p - doped gan layer 360 is then performed to a typical thickness of about 1 μm to about 5 μm using p - refractory metal elog mask 321 as shown in fig4 g . upper dbr 319 is then deposited on p - doped gan layer 360 and etched as shown in fig4 h . finally , as shown in fig4 i , etches are performed down to refractory metal layers 321 and 330 where n - electrode 334 and p - electrode 335 are deposited , respectively . fig5 shows an embodiment in accordance with the invention of gan vcsel laser structure 500 having an elog p - refractory metal mask and using a lower dbr deposited on an n - gan layer after removal of the substrate by laser liftoff or other suitable technique . n - type gan layer 520 with a typical thickness of about 4 μm has n - contacts 534 attached on the bottom surface along with lower dbr 518 . ingan multiple quantum well active region 545 overlies n - type gan layer and is topped by algan layer 546 having a typical thickness of about 20 nm . p - type gan layer 547 having a typical thickness of about 0 . 2 μm to about 2 μm overlies algan layer 546 . p - refractory metal elog mask 535 is a layer that overlies p - type gan layer 547 and elog p - type gan layer 560 having a typical thickness of about 1 μm to about 4 μm overlies p - type gan layer 547 . care must be taken to place p - refractory metal elog mask 535 at a null of the standing wave set up between lower dielectric dbr 518 and upper dielectric dbr 519 . p - refractory metal elog mask 321 typically has a thickness of about 50 nm or less . upper dbr mirror 519 sits on elog p - type gan layer 560 and p - type electrodes 536 are attached to p - type refractory metal layer 535 . typically , gan vcsel structure 500 may be made by taking substrate 505 , typically al 2 o 3 or sic and depositing gan buffer layer 510 to a typical thickness of about 30 nm over it . planar growth is performed for n - type gan layer 520 having a typical thickness of about 4 μm , ingan multiple quantum well active region 545 , algan layer 546 having a typical thickness of about 20 nm and p - type gan layer 547 with a typical thickness of about 0 . 2 μm to 2 μm as shown in fig6 a . p - refractory metal elog mask 535 is deposited on p - type gan layer 547 and patterned as shown in fig6 b . then elog growth of p - gan layer 560 to a typical thickness of about 1 μm to about 4 μm is performed as shown in fig6 c . upper dbr 519 is deposited on p - gan layer 560 and patterned as shown in fig6 d . substrate 505 is subsequentally removed by laser liftoff leaving the vcsel structure shown in fig6 e . lower dbr 518 is deposited on the bottom of gan buffer layer 510 and patterned as shown in fig6 f . finally , an rie or caibe etch is performed through p - gan layer 560 down to p - refractory elog metal mask 535 to deposit p - type electrodes 536 and n - type electrodes 534 on the bottom of gan buffer layer 510 . | Is this patent appropriately categorized as 'Electricity'? | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | 0.25 | 844c05bc9254226a613677f2d9e427712f01e407e5c09188450c98257a8e5d10 | 0.018311 | 0.039551 | 0.000755 | 0.010315 | 0.003479 | 0.036133 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | Should this patent be classified under 'Human Necessities'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.094238 | 0.00885 | 0.037842 | 0.000458 | 0.136719 | 0.018799 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.06543 | 0.049561 | 0.040283 | 0.014526 | 0.140625 | 0.07373 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Textiles; Paper'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.03418 | 0.002716 | 0.011658 | 0.000123 | 0.072754 | 0.013245 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Should this patent be classified under 'Fixed Constructions'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.06543 | 0.048828 | 0.040283 | 0.039551 | 0.140625 | 0.062988 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | Should this patent be classified under 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.094238 | 0.005219 | 0.037842 | 0.002975 | 0.136719 | 0.031128 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Physics'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.080566 | 0.217773 | 0.077148 | 0.133789 | 0.117676 | 0.46875 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | Should this patent be classified under 'Electricity'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.094238 | 0.004913 | 0.037842 | 0.000458 | 0.136719 | 0.000572 |
null | fig1 shows an assembling apparatus of a resin frame in which a plurality of fusion welding devices 2 are mounted on a body 1 to assemble a frame 3 . each of the fusion welding devices 2 joins end portions in a longitudinal direction of two works at a determined angle by fusion welding , and provided at every corner of the frame 3 . in this embodiment , the fusion welding device 2 joins the end portions of the two works at 90 degree , and the frame 3 has a rectangular shape . the body 1 includes a laterally directed first body 1 a which is longer in a lateral direction ( a direction x ), a second body 1 b which is longer in a vertical direction ( a direction y ) and moves in the lateral direction along this first body 1 a , and a third body 1 c which is longer in the vertical direction and fixed to the first body 1 a . for example , a pair of first guide rails 4 are provided on the first body 1 a which is laterally longer , and the second body 1 b which is vertically longer is mounted on these first guide rails 4 so as to move in the lateral direction . a laterally directed first cylinder 5 is mounted across the second body 1 b and the first body 1 a , so that the second body 1 b can move in the lateral direction by extending and contracting the first cylinder 5 . the fusion welding device 2 includes a first fusion welding device 2 a which is attached to a lower part of the second body 1 b , a second fusion welding device 2 b which is attached to an upper part of the second body 1 b so as to move in the vertical direction , a third fusion welding device 2 c which is attached to a lower part of the third body 1 c , and a fourth fusion welding device 2 d which is attached to an upper part of the third body 1 c so as to move in the vertical direction . the first to fourth fusion welding devices 2 a to 2 d are respectively positioned in the four corner parts of the frame 3 in the rectangular shape . second guide rails 6 are respectively provided in the upper parts of the second and third bodies 1 b , 1 c in the vertical direction . the second and fourth fusion welding devices 2 b , 2 d are respectively mounted so as to move along the second guide rails 6 . vertically directed second cylinders 7 are mounted across the second and third bodies 1 b , 1 c and the second and fourth fusion welding devices 2 b , 2 d , so that the second and fourth fusion welding devices 2 b , 2 d can move in the vertical direction by extending and contracting the second cylinders 7 . when the second and fourth fusion welding devices 2 b , 2 d move , they come close to or move apart from the first and third fusion welding devices 2 b , 2 c . the first and second moving units are not limited to the cylinder , but may be a rack - and - pinion , or a feed screw and a nut . in this manner , by moving the second body 1 b in the lateral direction , the first and second fusion welding devices 2 a , 2 b move in the lateral direction , and it is possible to assemble the frames 3 having different sizes in the lateral direction . moreover , by moving the second and fourth fusion welding devices 2 b , 2 d with respect to the second body 1 b and the third body 1 c in the vertical direction , it is possible to assemble the frames 3 having different sizes in the vertical direction . further , by moving the second body 1 b in the lateral direction , and by moving the second and fourth fusion welding devices 2 b , 2 d in the vertical direction , it is possible to assemble the frames 3 having different sizes both in the lateral direction and in the vertical direction . as shown in fig2 a and 2b , end faces 8 a in the longitudinal direction of works 8 ( resin frame members which are components of the frame 3 ) to be joined by fusion welding with the fusion welding device 2 are inclined with respect to a right angle with the longitudinal direction . an angle of inclination θ 1 of the end faces 8 a of the works 8 is a half of a corner angleθ 2 of the frame 3 . for example , in case where the corner angle θ 2 of the frame 3 is 90 degree , as shown in fig2 a , the angle of inclination θ 1 is 45 degree . in case where the corner angle θ 2 is 60 degree , as shown in fig2 b , the angle of inclination θ 1 is 30 degree . then , the fusion welding device 2 ( 2 a , 2 b , 2 c , 2 d ) will be described referring to fig3 to 7 . the fusion welding device 2 includes a first holding unit 10 , a second holding unit 20 , and a heating unit 30 , as shown in fig3 . the first holding unit 10 and the second holding unit 20 can move along outer peripheral faces of the works 8 in the longitudinal directions thereof and hold the end portions of outer peripheral faces with almost no clearance . the first holding unit 10 and the second holding unit 20 respectively have contact faces 11 and 21 opposed to each other . expression “ with almost no clearance ” means both a case where the contact face is in contact with the outer peripheral face of the work 8 , and a case where the contact face is slightly apart from the outer peripheral face of the work 8 . for example , the first holding unit 10 and the second holding unit 20 have respective holding spaces 12 , 22 which have substantially the same shape as a cross sectional shape of the work 8 ( a sectional shape at a right angle with respect to the longitudinal direction ). these holding spaces 12 , 22 are open on end faces 13 , 23 at the opposite side to the contact faces 11 , 21 . specifically , as shown in fig4 a , the holding space 12 or 22 is formed by combining a recess 14 a , 24 a of a lower mold 14 , 24 and a recess 15 a , 25 a of an upper mold 15 , 25 . the outer peripheral face 8 b of the work 8 is held on an inner peripheral face of the holding space 12 , 22 with almost no clearance , but can move in the holding space 12 , 22 . as shown in fig4 b , by separating the upper mold 15 , 25 from the lower mold 14 , 24 , it is possible to set or remove the work 8 in or from the recess 14 a , 24 a in the lower mold 14 , 24 . the contact faces 11 , 21 of the first and second holding units 10 , 20 which are opposed to each other have the same angle as the angle of inclination of the end faces 8 a of the works 8 . when the works 8 are held by the first and second holding units 10 , 20 , the contact faces 11 , 21 and the end faces 8 a of the works 8 can be continued to be flush with each other . the first and second holding units 10 , 20 respectively move in parallel with each other between a first position where the contact faces 11 and 21 are in contact with each other , and second and third positions where the contact faces 11 , 21 are separated from each other . for example , the first and second holding units 10 , 20 are respectively moved by first and second parallel moving units 40 , 50 in parallel with each other . these movements by the first and second parallel moving units 40 , 50 are effected in a direction perpendicular to the longitudinal direction of the works 8 which are respectively held by the holding units . moreover , the first and second holding units 10 , 20 are respectively moved synchronously in a direction along their contact faces 11 and 21 . for example , the first and second holding units 10 , 20 are moved synchronously in the direction along their contact faces 11 and 21 by a synchronous moving unit 60 . in short , both the first and second holding units 10 , 20 are moved at the same time . the aforesaid heating unit 30 has a first heating face 31 which is contacted with the contact face 11 of the first holding unit 10 , and a second heating face 32 which is contacted with the contact face 21 of the second holding unit 20 . these first and second heating faces 31 , 32 are flat . the heating unit 30 is moved between a heating position which is located between the first and second holding units 10 and 20 ( between the contact faces 11 and 21 ), and a retreating position where it has retreated from the position between the first and second holding units 10 , 20 . for example , the heating unit 30 is moved by a moving unit 70 between the heating position and the retreating position . in other words , the heating position is a position where the first heating face 31 can be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 can be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . on the other hand , the retreating position is a position where the first heating face 31 cannot be contacted with the contact face 11 of the first holding unit 10 and the second heating face 32 cannot be contacted with the contact face 21 of the second holding unit 20 , when the heating unit 30 is disposed in the position . referring to fig5 and 6 , a specific embodiment of the aforesaid first and second parallel moving units 40 , 50 will be described . a first rail 41 and a second rail 51 are provided on a moving body 80 . then , a first guide 42 and a second guide 52 which are respectively provided on the first and second holding units 10 , 20 ( the lower molds 14 , 24 ) are slidably engaged with the first and second rails 41 , 51 so that the first and second holding units 10 , 20 can move in the directions perpendicular to the longitudinal directions of the works 8 which are held . for this reason , when the holding units move between the first position and the second and third positions , they can move to determined positions , even though the works 8 are movably held by the holding units . first and second electric motors 43 , 53 are mounted on the moving body 80 . then , feed screw rods 44 , 54 which are rotated by the first and second motors 43 , 53 are screwed with nuts 45 , 55 which are fitted to the first and second holding units 10 , 20 so as to rotate but not to move . when the first and second electric motors 43 , 53 are driven , the first and second holding units 10 , 20 are moved . in this manner , the first and second parallel moving units 40 , 50 are constructed . the first and second parallel moving units 40 , 50 are driven to move the first and second holding units 10 , 20 for the same distance , and controlled so that the first and second holding units 10 , 20 may be at symmetrical positions with respect to a corner part of the frame 3 . for example , the first electric motor 43 and the second electric motor 53 are synchronously controlled so that the first and second holding units 10 , 20 can move for the same distance . the first and second parallel moving units 40 , 50 are not limited to those as described above , but a cylinder or a rack - and - pinion may be employed as the parallel moving units . referring to fig7 , a specific embodiment of the synchronous moving unit 60 will be described . guides 61 provided on the moving body 80 are slidably engaged with rails 62 provided on a base member 81 . then , an electric motor 63 is mounted on the base member 81 , and a feed screw rod 64 rotated by the electric motor 63 is screwed with a nut 65 which is fitted to the moving body 80 so as to rotate but not to move . when the electric motor 63 is driven , the moving body 80 is moved with respect to the base member 81 . in this manner , the synchronous moving unit 60 is constructed . this movement by the synchronous moving unit 60 is called as synchronous movement , because the first and second holding units 10 , 20 are moved at the same time . in the above described structure , because it would be sufficient to drive and control the only one electric motor 63 , the structure is simple and can be easily controlled . the synchronous moving unit 60 is not limited to the structure as described above , but a cylinder or a rack - and - pinion may be employed for moving the moving body 80 . moreover , the first and second holding units 10 , 20 may be moved by separate moving units , provided that the separate moving units are synchronously driven . a specific embodiment of the moving unit 70 will be described . a rail 71 is mounted on the aforesaid moving body 80 , and a guide 72 engaged with this rail 71 is fitted to the heating unit 30 . a cylinder 74 is mounted on the moving body 80 by way of a bracket 73 , and a piston rod 75 of the cylinder 74 is coupled to the heating unit 30 . by extending and contracting the piston rod 75 of the cylinder 74 , the heating unit 30 moves between the heating position and the retreating position . in this manner , the moving unit 70 is constructed . as this moving unit 70 , a cylinder , and a rack - and - pinion may be employed . as shown in fig1 , the base member 81 of the first fusion welding device 2 a is attached to the lower part of the second body 1 b , and the base member 81 of the second fusion welding device 2 b is attached to the upper part of the second body 1 b so as to move in the vertical direction . the base member 81 of the third fusion welding device 2 c is attached to the lower part of the third body 1 c , and the base member 81 of the fourth fusion welding device 2 d is attached to the upper part of the third body 1 c so as to move in the vertical direction . then , the moving body 80 of the first fusion welding device 2 a and the moving body 80 of the fourth fusion welding device 2 d move in the respective directions opposed to each other . the moving body 80 of the second fusion welding device 2 b and the moving body 80 of the third fusion welding device 2 c move in the respective directions opposed to each other . specifically , the first and fourth fusion welding devices 2 a , 2 d are positioned in the two corner parts of the frame 3 which are opposed to each other on a diagonal line , while the second and third fusion welding devices 2 b , 2 c are positioned in the remaining two corner parts of the frame 3 which are opposed to each other on a diagonal line . then , operation of the fusion welding device 2 for joining the two works 8 to each other by fusion welding will be described . as shown in fig8 , the first and second holding units 10 , 20 are positioned in the third position where their contact faces 11 , 21 are remarkably separated , and the end portions of the works 8 are respectively held in the holding spaces 12 , 22 . in this state , the heating unit 30 is moved to the heating position , as shown by a phantom line in fig8 . as shown in fig9 , the first and second holding units 10 , 20 are moved , in parallel , to the second position where the contact faces 11 , 21 are separated , and the contact faces 11 , 21 are brought into contact with the first and second heating faces 31 , 32 of the heating unit 30 . in this state , the heating unit 30 is heated , and the moving body 80 is moved in a direction of an arrow mark a . with this movement , the first and second holding units 10 , 20 synchronously move in the direction along their contact faces 11 , 21 ( the direction of the arrow mark a ), and at the same time , the heating unit 30 also moves . accordingly , the works 8 move with respect to the first and second holding units 10 , 20 in their longitudinal directions opposed to each other , so as to project from the contact faces 11 , 21 . specifically , the end portion of the work 8 at an opposite side to the end portion which is held by one of the fusion welding devices 2 a to 2 d tends to move so as to project from the contact faces 11 , 21 of the first and second holding units 10 , 20 of the other fusion welding device 2 a to 2 d , whereby the end faces 8 a of the works 8 are strongly pressed to the first and second heating faces 31 , 32 of the heating unit 30 , and thus , the end portions of the works 8 are fused . in this manner , the end portions of the works 8 are pressed onto the heating unit 30 ( the first and second heating faces 31 , 32 ) in a state held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 , thereby to be fused . therefore , the end portions of the works 8 will not protrude outward , when they are fused , and fins will not occur . in this embodiment , the works 8 are hollow - shaped , and are fused in such a manner that their end portions enter into the hollow spaces . therefore , a region to be fused is elongated , and it is possible to enlarge the region to be joined by fusion welding . moreover , when the end portions of the works 8 are fused , as described above , the works 8 do not move in their longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to fuse the end portions of the works 8 at the same time in the respective corner parts . thereafter , the first and second holding units 10 , 20 are moved , in parallel , to the above described third position , and the heating unit 30 is moved to the retreating position . in this state , the first and second holding units 10 , 20 are moved to the first position where the contact faces 11 , 21 are in contact , as shown in fig1 , whereby the contact faces 11 and 12 are brought into contact with each other . in this state , the moving body 80 is further moved in the direction of the arrow mark a , in the same manner as described above , whereby the end faces 8 a of the works 8 are pressed to each other and joined together . as described above , the end faces 8 a of the works 8 are pressed to each other and joined by fusion welding , in a state where the end portions are held in the holding spaces 12 , 22 of the first and second holding units 10 , 20 . therefore , fins will not occur in the joined region . moreover , the works 8 are moved in the respective longitudinal directions in a state opposed to each other , when the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 , and when the end faces 8 a of the works 8 are in contact with each other , the works 8 do not move in the longitudinal directions in a state held in the holding spaces . therefore , in case of assembling the frame 3 , it is possible to join the respective corner parts at the same time . in the above described embodiment , the first and second holding units 10 , 20 and the heating unit 30 are mounted on the moving body 80 so that the heating unit 30 may move at the same time with the first and second holding units 10 , 20 , when the end portions of the works 8 are fused . however , the structure is not limited to the above described . in case where the first and second holding units 10 , 20 are moved by separate moving units as described above , it is possible to drive and control the moving unit 70 synchronously with the separate moving units or to move the heating unit 30 by an external force . in short , it would be sufficient that the heating unit 30 moves with the first and second holding units 10 , 20 , when the first and second holding units synchronously move . moreover , a manner of fusing the end portions of the works 8 is not limited to the above - described manner . for example , it is possible to fuse the end portions of the works 8 by butting the heating unit 30 against the end portions . then , operation for assembling a resin frame , employing the assembling apparatus of the resin frame as shown in fig1 will be described . the work 8 is described as a resin frame member 8 . as shown in fig1 , both end portions in a longitudinal direction of a first resin frame member 8 are set and held between the holding space 22 of the second holding unit 20 of the first fusion welding device 2 a and the holding space 12 of the first holding unit 10 of the second fusion welding device 2 b , as described above , and both end portions in a longitudinal direction of a second resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the first fusion welding device 2 a and the holding space 22 of the second holding unit 20 of the third fusion welding device 2 c . in the same manner , both end portions in a longitudinal direction of a third resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the third fusion welding device 2 c and the holding space 22 of the second holding unit 20 of the fourth fusion welding device 2 d , and both end portions in a longitudinal direction of a fourth resin frame member 8 are set and held between the holding space 12 of the first holding unit 10 of the forth fusion welding device 2 d and the holding space 22 of the second holding unit 20 of the second fusion welding device 2 b . in short , the first fusion welding device 2 a is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c , while the fourth fusion welding device 2 d is adjacent to the second fusion welding device 2 b and the third fusion welding device 2 c . both the end portions in the longitudinal direction of the resin frame member 8 are held between the holding spaces 12 and 22 of the first and second holding units 10 , 20 of the adjacent fusion welding devices . in this state , the first to fourth fusion welding devices 2 a to 2 d are operated at the same time , in the same manner as shown in fig8 to 11 , and the end portions of the resin frame members 8 are joined by fusion welding in the corner parts as shown in fig2 a and 2b . in other words , the first to fourth fusion welding devices 2 a to 2 d are moved , in a state where the contact faces 11 , 21 are in contact with each other , in such directions that distances of adjacent two of the first to fourth fusion welding devices 2 a to 2 d are reduced , so that the end portions of the frame members 8 are joined by fusion welding . in this case , the end faces 8 a of the four resin frame members 8 are pressed to each other in the respective corner parts , and hence , the end faces 8 a can be effectively joined by fusion welding . in the above described embodiment , the frame 3 in a rectangular shape is assembled . however , the frame 3 is not limited to the rectangular shape . it is possible to assemble the frame 3 of a desired shape , such as a triangular shape , a pentagonal shape . for example , as shown in fig1 , it is possible to assemble the frame 3 in a triangular shape by fusion welding , by providing the first , second and third fusion welding devices 2 a , 2 b , 2 c in the respective corner parts of the frame 3 in a triangular shape . in this case , the corner angle θ 2 is 60 degree , and so , the angle of inclination of the end faces 8 a of the works 8 is 30 degree . then , a second embodiment of the assembling apparatus of the resin frame will be described referring to fig1 . in the same manner as the aforesaid body 1 as shown in fig1 , the body 1 includes the first body 1 a , the second body 1 b , and the third body 1 c . the second body 1 b moves in a lateral direction with respect to the first body 1 a . the first and second fusion welding devices 2 a , 2 b are mounted on the second body 1 b , in the same manner as in the apparatus as shown in fig1 . the third and fourth fusion welding devices 2 c , 2 d are mounted on the third body 1 c , in the same manner as in the apparatus as shown in fig1 . the first to fourth fusion welding devices 2 a to 2 d have the same structure as the fusion welding device 2 as shown in fig3 , except that they are not provided with the synchronous moving unit 60 in the fusion welding device 2 as shown in fig3 . in short , each of the first to fourth fusion welding devices 2 a to 2 d includes the first and second holding units 10 , 20 , the heating unit 30 , the first and second parallel moving units 40 , 50 , and the moving unit 70 . these units are mounted on the first moving body 80 . in this embodiment , in the second and fourth fusion welding devices 2 b , 2 d , the moving body 80 is attached to the second guide rail 6 so as to move up and down , and the first and third fusion welding devices 2 a , 2 c are attached to the respective lower ends of the second and third bodies 1 b , 1 c . when the second body 1 b moves along the direction x so as to come close to or apart from the third body 1 c , the first fusion welding device 2 a moves close to or apart from the third fusion welding device 2 c . then , operation for assembling the frame 3 will be described . it is to be noted that the work 8 is described as the resin frame member 8 . in the same manner as described above , both the end portions in the longitudinal direction of the resin frame member 8 are set between the holding spaces 12 , 22 of the first and second holding units 10 , 20 of the fusion welding devices which are adjacent to each other , and held so as to move in the longitudinal direction . in the above described state , the first and second holding units 10 , 20 of the respective fusion welding devices 2 are positioned in the third position where they are separated , and the heating unit 30 is moved to the heating position . then , the first and second holding units 10 , 20 are moved to the second position , and the contact faces 11 , 21 are brought into contact with the heating unit 30 ( the first and second heating faces 31 , 32 ). in this state , the second body 1 b is moved in the lateral direction toward the third body 1 c , and the second and fourth fusion welding devices 2 b , 2 d ( the first moving body 80 ) are respectively moved in the vertical direction toward the first and third fusion welding devices 2 a , 2 c . in this manner , a distance between the first fusion welding device 2 a and the third fusion welding device 2 c , and a distance between the second fusion welding device 2 b and the fourth fusion welding device 2 d in the lateral direction are reduced . at the same time , a distance between the first fusion welding device 2 a and the second fusion welding device 2 b , and a distance between the third fusion welding device 2 c and the fourth fusion welding device 2 d in the vertical direction are reduced . in other words , the frame 3 in a rectangular shape is reduced in size keeping similarity , and the end faces 8 a of the adjacent resin frame members 8 are pressed to the heating unit 30 thereby to be fused . because this pressing force acts as a counteraction on the end faces 8 a at the opposite side , the end faces 8 a at the opposite side are also pressed to the heating unit 30 to be fused . thereafter , the first and second holding units 10 , 20 are moved to the third position where they are separated , and the heating unit 30 is moved to the retreating position . then , the first and second holding units 10 , 20 are moved to the first position to bring the contact faces 11 , 21 into contact . in this state , the second body 1 b , and the second and fourth fusion welding devices 2 b , 2 d are moved in the same manner as described above , whereby the end faces 8 a of the resin frame members 8 are pressed to each other thereby to be joined by fusion welding . in the above described first and second embodiments , the second body 1 b moves so as to approach and separate from the third body 1 c . alternatively , it is possible to move the third body 1 c or to move both the second and third bodies . according to an aspect of the present invention , the end portions of the works 8 which have been fused with the heating unit 30 are held by the first and second holding units 10 , 20 , and the first and second holding units 10 , 20 are synchronously moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 are in contact with each other , whereby the end faces 8 a of the works 8 are pressed in the longitudinal directions thereof inside the first and second holding units 10 , 20 to be joined . therefore , occurrence of fins can be reliably prevented , when the end portions of the works 8 are joined by fusion welding . moreover , there is no necessity of moving the works 8 in the longitudinal directions , because the works 8 are joined by moving the first and second holding units 10 , 20 . therefore , when the end portions of a plurality of the works 8 are joined by fusion welding to form the frame , it is possible to join the end portions of the works by fusion welding at the same time in the respective corner parts of the frame . according to an aspect of the present invention , the first and second holding units 10 , 20 are moved by the synchronous moving unit 60 in a state where the contact faces 11 , 21 of the first and second holding units are in contact with the first and second heating faces 31 , 32 of the heating unit 30 , whereby the end faces 8 a of the works 8 are pressed to the first and second heating faces 31 , 32 of the heating unit , and the end portions of the works 8 are fused inside the first and second holding units 10 , 20 . therefore , when the end portions of the works 8 are fused , fins will not occur . according to an aspect of the present invention , the moving body 80 is moved with respect to the base member 81 , whereby the first and second holding units 10 , 20 are synchronously moved , and the heating unit 30 is also moved at the same time . therefore , the synchronous moving unit 60 is simple in structure , and can be easily operated and controlled . according to an aspect of the present invention , the resin frame can be assembled by joining the end portions of the resin frame member by fusion welding , and fins will not occur at a time of joining by fusion welding . moreover , because the end portions of the resin frame members 8 can be joined by fusion welding at the same time in the respective corner parts of the resin frame , it is possible to assemble the resin frame efficiently in a short time . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | 0.25 | d11894e978368b5d965e0996e698771f6a7d6e83e3d0d1d450186620e693e810 | 0.03418 | 0.128906 | 0.011658 | 0.047363 | 0.072754 | 0.123535 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Should this patent be classified under 'Electricity'? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.000668 | 0.016968 | 0.000024 | 0.000246 | 0.000315 | 0.010681 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Is this patent appropriately categorized as 'Electricity'? | Should this patent be classified under 'Performing Operations; Transporting'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.001595 | 0.075684 | 0.00009 | 0.048828 | 0.000938 | 0.047363 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Is this patent appropriately categorized as 'Electricity'? | Should this patent be classified under 'Chemistry; Metallurgy'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.001595 | 0.000012 | 0.00009 | 0.000004 | 0.000938 | 0.000246 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Is 'Electricity' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Textiles; Paper'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.001205 | 0.000504 | 0.000085 | 0.00001 | 0.001137 | 0.007355 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Does the content of this patent fall under the category of 'Electricity'? | Is this patent appropriately categorized as 'Fixed Constructions'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.001244 | 0.006287 | 0.000021 | 0.001137 | 0.002045 | 0.028442 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Should this patent be classified under 'Electricity'? | Does the content of this patent fall under the category of 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.000668 | 0.00014 | 0.000024 | 0.000013 | 0.000315 | 0.000912 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Should this patent be classified under 'Electricity'? | Is this patent appropriately categorized as 'Physics'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.000668 | 0.025513 | 0.000024 | 0.001099 | 0.000315 | 0.024048 |
null | one embodiment of the present invention is a wireless data device system and application that automatically detects the provisioning of a wireless data device on a particular wireless gateway server , and provides for changes to the provisioning . as a result , pushes of data to the wireless data device are optimized . fig1 is a block diagram of the functional elements of a system 110 for detecting and modifying the provisioning of a wireless data device on a particular wireless gateway server in accordance with one embodiment of the present invention . the functional elements shown in fig1 can be implemented with any combination of hardware or software , including software executed by multiple computer systems or servers . system 110 includes a wireless gateway 102 that includes one or more wireless gateway servers 150 - 152 that take electronic information produced by system 110 and makes it compatible for transmission across a wireless network 120 by encoding it in transmission protocols applicable to wireless network 120 . wireless gateway servers 150 - 152 communicate this electronic data to a network operations center 101 across a communications network 121 . network operations center 101 monitors and manages various computer systems which interface to a carrier &# 39 ; s wireless network 120 . the wirelessly transmitted electronic information is received and displayed by a wireless data device 100 . in one embodiment , wireless data device 100 is a blackberry handheld device from rim corporation , and wireless gateway servers 150 - 152 are blackberry enterprise servers executing mobile data service . however , other types of wireless data devices and gateway servers can be used in different embodiments of the present invention . system 110 further includes a web server 103 that in one embodiment includes multiple web servers and one or more load balance servers . web server 103 receives and interprets electronic messages encoded in various internet - compatible protocols , such as hypertext transfer protocol (“ http ”) or file transfer protocol (“ ftp ”). an application server 104 includes one or more application programs running on one or more application servers in a clustered environment . application server 104 contains business rules and program logic , responds to user requests and processes and formats data in a manner consistent with wireless data device 100 . system 110 further includes a push server 107 that optimizes the use of multiple wireless gateway servers 150 - 152 . in one embodiment , the number of wireless data devices 100 in communication with wireless gateway servers 150 - 152 can number in the thousands , and each are provisioned on a particular wireless gateway server from the set of multiple wireless gateway servers 150 - 152 . in one embodiment , the functionality of push server 107 may be provided on the same server as application server 104 , or may exist on servers which are distinct from application server 104 . a data repository 105 provides long - term data storage for system 110 . the storage may take the form of relational or hierarchical databases , sequential flat file storage , or any other method that allows data to be stored and retrieved . a data server 106 allows system 110 to interface with one or more independent external data sources 140 and 141 that provide raw data or processed information , via a communications network 123 . external data source systems 140 and 141 may represent computer data systems such as 3rd party financial or market data systems , news services , or any other source of electronic data that may be transformed and represented in a wireless markup language format or other format for display on wireless data device 100 . in one embodiment , the electronic pushed data is formatted in accordance with the “ push access protocol ” of the “ wireless application protocol ”. a desktop computer browser 130 or remote terminal 131 in one embodiment can be used to dynamically manage various system 110 elements via a communications link 124 . these management functions can include viewing and altering configuration values for system 110 elements or viewing of diagnostic files or real - time data and statistics . communications networks 121 , 122 , 123 , and 124 may be one or more hardwired digital or analog communications links , wireless digital or analog communications links , or any combination thereof , or utilize any other methods for establishing and operating communications links . in one embodiment of system 110 , data can be received by wireless data device 100 in two ways : ( 1 ) “ pull ”, which involves the user explicitly requesting the data by , for example , clicking on a link in a microbrowser ; and ( 2 ) “ push ”, which involves the user registering to receive data to be sent in the future . with push , the data is delivered to wireless data device 100 without further intervention by the user . the data may be automatically gathered and sent on a regularly scheduled or sporadic basis or it may be published by human intervention and sent to registered users on a regular or sporadic basis . in order for wireless data device 100 to receive pushed data , in one embodiment it is provisioned on one of wireless gateway servers 150 - 152 . the wireless gateway server takes data intended for wireless data device 100 ( identified by a unique identifying number or identifier , sometimes called a “ pin ”) from , for example , data server 106 , and forwards the data and pin to network operations center 101 . network operations center 101 then handles transmitting the message over wireless network element 120 to the wireless data device 100 that matches the pin . in an embodiment where wireless data device 100 is provisioned on a single , particular wireless gateway server 150 - 152 , push server 107 has to either know or determine which of wireless gateway servers 150 - 152 to forward a message to for a particular user &# 39 ; s pin . to facilitate this knowledge , push server 107 maintains a pin / wireless gateway server map that maps each pin to its respective gateway server . in operation , a user registers to receive data to be published and delivered in the future . registration can occur by the user submitting a request to application server 104 via wireless data device 100 . application server 104 stores what data the user wishes to receive , as well as the matching pin for wireless data device 100 , in data repository 105 . for multiple reasons , the assignment of a wireless data device to one particular wireless gateway server 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive to service requests , its name is changed by network administrators , it is removed from service , or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues . fig2 is a flow diagram of the functionality performed by system 110 to respond to changes in the mapping of wireless data device pins to the wireless gateway servers 150 - 152 in accordance with one embodiment of the present invention . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 201 : application server 104 initiates a push of data , such as a document in the form of a message , either as a regularly scheduled push or as a one time request , by sending a push request to push server 107 using communication link 122 . 202 : push server 107 determines which wireless gateway server 150 - 152 of wireless gateway 102 to push the message to by querying / searching the pin / wireless gateway server map for the pin and corresponding gateway server mapping of wireless data device 100 . 203 : if a wireless gateway server 150 - 152 is found for the pin , push server 107 sends a message to the mapped wireless gateway server using communication link 122 . 204 : if the wireless data device 100 is provisioned on the mapped wireless gateway server 150 - 152 , then the message is accepted for delivery to the wireless data device 100 and the process is done . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . 205 : if the push of the message is not accepted by the mapped wireless gateway server 150 - 152 , then push server 107 loops through the list of wireless gateway servers 150 - 152 of wireless gateway 102 by sending the message to each of the servers 150 - 152 one at a time , while skipping the server that failed at the beginning of block 205 . 206 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server element 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with an automated recovery from wireless data device 100 provisioning from one wireless gateway server to another in wireless gateway 102 . 207 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . 208 : if a wireless gateway server 150 - 152 in wireless gateway 102 is not found for the pin , push server 107 loops through the list of wireless gateway servers 150 - 152 , sending the message to the wireless gateway servers one at a time . 209 : if the wireless data device 100 is provisioned on a wireless gateway server 150 - 152 , the message is accepted for delivery and push server 107 updates the pin / wireless gateway server map with the correct gateway server for the pin . system 110 determines that the message was successfully accepted in one embodiment by receiving a status code of success on the message submission . this function provides system 110 with automated detection of a new wireless data device 100 being provisioned for the first time on a wireless gateway server 150 - 152 in wireless gateway 102 . 210 : if all wireless gateway servers 150 - 152 reject the message , then push server 107 updates the pin / wireless gateway server map with an “ unknown ” value for the server corresponding to the pin of wireless data device 100 . through the use of the pin / wireless gateway server map , the correct wireless gateway server 150 - 152 for a pin is more likely to be chosen by push server 107 , thereby optimizing pushes of data to wireless data device 100 . further , changes in server assignments are self - correcting by system 110 through the automated updates of the pin / wireless gateway server map . in one embodiment of the invention , at any point before a scheduled or sporadic push of data , a system administrator may dynamically update the list of valid wireless gateway servers 150 - 152 that make up wireless gateway 102 by using desktop browser 130 or remote terminal 131 . the list of valid wireless gateway servers may be stored in computer volatile memory on push server 107 for optimized retrieval , as well as in data repository 105 to span shutdowns of push server 107 . dynamic maintenance of the list of valid wireless gateway servers that make up wireless gateway 102 avoids service disruptions of system 110 due to wireless gateway server name changes , additions and removals . fig3 is a flow diagram of the functionality performed by system 110 to respond to changes in wireless gateway 102 . in one embodiment , the functionality is implemented by software stored in memory and executed by a processor . in other embodiments , the functionality can be performed by hardware , or any combination of hardware and software . 301 : the list of wireless gateway servers 150 - 152 of wireless gateway 102 may change . for example , one of wireless gateway servers 150 - 152 may change because the server becomes non - responsive , the server is removed from service or a new wireless gateway server could be added to wireless gateway 102 due to capacity issues , or the name or port of a wireless gateway server may change . 302 : a system administrator dynamically updates the list of valid servers in wireless gateway 102 by using desktop browser 130 or remote terminal 131 . 303 : update commands issued through desktop browser 130 travel through network communications 124 to web server 103 , and then through network communications 122 , to push server 107 . 304 : update commands issued through remote terminal 131 travel through network communications 124 and 122 to push server 107 . 305 : push server 107 updates its internal memory to reflect the updated wireless gateway servers list . 306 : push server 107 writes the updated wireless gateway servers list to data repository 105 . as described , embodiments of the present invention dynamically maintain a mapping of pin / wireless gateway server so that an application can optimally push data to the correct server for a selected pin . pushes of data are thus more efficient and user intervention is not required to account for changes in mapping . several embodiments of the present invention are specifically illustrated and / or described herein . however , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention . | Does the content of this patent fall under the category of 'Electricity'? | Is this patent appropriately categorized as 'General tagging of new or cross-sectional technology'? | 0.25 | 2d7d78c812f403e19ef34ba88fb9ee3971ec8d3c82290ec6aa4f3206a9429b99 | 0.001167 | 0.070801 | 0.000021 | 0.027954 | 0.002045 | 0.057373 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Is 'Chemistry; Metallurgy' the correct technical category for the patent? | Is this patent appropriately categorized as 'Human Necessities'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.108398 | 0.004211 | 0.121582 | 0.000203 | 0.167969 | 0.004761 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Is 'Chemistry; Metallurgy' the correct technical category for the patent? | Should this patent be classified under 'Performing Operations; Transporting'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.108398 | 0.000553 | 0.121582 | 0.000404 | 0.167969 | 0.0065 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Should this patent be classified under 'Chemistry; Metallurgy'? | Does the content of this patent fall under the category of 'Textiles; Paper'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.098145 | 0.000085 | 0.10498 | 0.000003 | 0.172852 | 0.004211 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | Should this patent be classified under 'Fixed Constructions'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.168945 | 0.007355 | 0.204102 | 0.003082 | 0.241211 | 0.026001 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Is 'Chemistry; Metallurgy' the correct technical category for the patent? | Is 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting' the correct technical category for the patent? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.108398 | 0.001205 | 0.121582 | 0.00008 | 0.167969 | 0.009705 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | Is this patent appropriately categorized as 'Physics'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.181641 | 0.039551 | 0.204102 | 0.039551 | 0.241211 | 0.123535 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Is this patent appropriately categorized as 'Chemistry; Metallurgy'? | Does the content of this patent fall under the category of 'Electricity'? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.185547 | 0.00014 | 0.289063 | 0.000058 | 0.261719 | 0.000828 |
null | hals monomers and some of its derivatives may be prepared by any of the methods that are known in the art including those disclosed in patents no . jp 53015385 28 ( july 1978 ), swiss ch 610898 ( may 15 , 1979 ), swiss ch 605927 ( october 1978 ), brit . gb 1492494 ( november 1977 ) and literature : t . tsuchiya and h . sashida , heterocycles , 14 , 1925 - 8 ( 1980 ). hals namely 2 , 2 , 6 , 6 - tetramethyl piperidine and 2 , 2 , 6 , 6 - tetramethyl - 4 - piperidinol may be prepared by synthetic route disclosed by w . b . lutz , s . lazams and r . i . meltzer , j qrg chem - i 14 , 530 ( 1949 ) where as the hydroxy benzotriazoles can be prepared by any of the above mentioned methods , disclosed in the patents and literature . all these patents and literature are incorporated herein by reference . the present invention relates to a novel photo - stabilizer ; tp - hals a hals coupled to an uv absorber and their derivatives . this class of compounds is added to the polymers in order to improve their photo - stability and in turn their life span they can also be used to obtain photo - stable coatings and paints for out - door applications . hals and benzotriazoles are found to be compatible with polyolefins , polycarbonate , and a variety of diene elastomers . the novel photo - stabilizer synthesized by the process of the invention bears two different active sites in the same molecule , which are known to work in synergism . the hindered amine site acts as a radical scavenger and the bezotriazole site acts as an uv absorber , thus avoiding the addition of two different additives to the polymer . moreover , coupling these two different photo - stabilizers not only increase the active sites but also help in increasing the overall molecular weight of the stabilizer , thus decreasing the possibility of its loss due to evaporation , migration / leaching and extraction . these additives have even found applications in a variety of polymers used for food storage , consumer care products and pharmaceuticals , preserving the packaging content from the detrimental effect of high heat and harmful radiation . moreover , the literature also shows their agricultural applications . the deterioration of polymeric materials is an inevitable phenomenon and it occurs mainly due to their exposure to the uv portion of sunlight reaching the earth &# 39 ; s surface . the net result of degradation is the loss in the molecular weight and macroscopic physical properties . in order to avoid this loss different types of photo - stabilizers have been devised that protect the polymeric substrate from detrimental effect of light . the compatible and mobile light stabilizers usually prove to be the best choice to attain the desired photostability . most of these stabilizers are commercially available and are successfully employed , single and / or in combination with other stabilizers for the polymer stabilization . researchers have even attempted to study the combined effect of screeners , quenchers , ultraviolet absorbers and thermal stabilizers . ample literature on the synthesis and application of these photostabilizers is available . depending upon the type of combination , the effect of the stabilizers can be synergistic and / or antagonistic . the efficacy of the stabilizer depends on many factors viz . type of combination , proportion of additive , compatibility with the polymer and molecular weight of the stabilizer . hindered amine light stabilizer ( hals ) and benzotriazole based uv absorbers are known to work in synergism . moreover , there is hardly any literature on the synthesis of the coupled derivatives of hals and uv absorbers . the uv absorber of the invention overcomes the prior art disadvantages listed above . this invention provides a novel photo - stabilizer : tinuvin p - hindered amine light stabilizer ( tp - hals ) and its derivatives . the derivatives of conventional hals and benzotriazoles have enhanced photo - stabilization effect , and are useful as additives in a variety of polymers used for food storage , consumer care products ( viz . sunscreen / anti - aging lotions ) and pharmaceuticals , preserving the packaging content intact . the process of the present invention is described herein below with reference to the following examples which are illustrative and should not be construed to limit the scope of the present invention in any manner whatsoever . this compound was synthesized strictly under dry and inert reaction conditions . in a 100 ml capacity round bottom . flask ( rb ) 2 -( 2 ′- hydroxy - 5 ′- bromomethyl phenyl ) benzotriazole ( 3 . 0 gms , 0 . 00986m ) was taken along with imidazole ( 2 . 1 gm , 0 . 0295 m ) and an inert atmosphere applied using argon gas . 10 ml of dry pyridine was added and the reaction mixture agitated for 20 - 60 min . the reaction mixture becomes very thick and difficult to stir . to this mixture , tert - butyl dimethyl silyl chloride ( 5 . 2 g , 0 . 0345 m ) was added under inert condition and agitation of reaction mixture was continued for 10 - 14 hrs . after checking the tlc for the completion of the reaction , the pyridine from the rb was evaporated to dryness under vacuum . the contents of the rb were consequently dissolved in 15 ml dichloromethane . the insoluble mass was filtered off and the mother liquor was evaporated under vacuum to give ( a semi crystalline rust coloured compound ) 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole . the crude product weighed 3 . 30 gms to give 80 % yield . this was purified using column chromatography employing a suitable solvent system . the yield of the pure compound was 76 % and its mp . 162 - 164 ° c . this compound was synthesized strictly under dry and inert reaction conditions . the compound 2 -( 2 ′- tert - butyl - di - metylsilyloxy - 5 ′- bromomethylphenyl ) benzotriazole ( 2 . 1 gms , 0 . 00501 m ) was taken in one 25 ml capacity rb and dissolved in 8 ml dry dimethylformamide ( dmf ) under argon atmosphere with stirring . in another two - necked rb , 1 , 2 , 2 , 6 , 6 - pentamethyl - 4 - piperidinol ( 1 . 0356 gm , 0 . 00601 m ) and sodium - hydride ( 0 . 3 gms , 0 . 01252 m ) were taken and dissolved in 6 ml dry dmf with stirring under argon atmosphere . this reaction mixture was agitated for almost 60 min and then cooled to 4 - 8 ° c . to this reaction mixture the contents of the first rb was added gradually over a period of 30 - 60 min . this reaction mixture was further agitated for 2 - 4 hrs followed by refluxing the same for a period of 2 - 4 hrs . the contents of the rb were cooled to room temperature and further agitated for 4 - 6 hrs at room temperature . the solvent in the rb was evaporated under reduced pressure and the solid mass in the rb was dissolved in 15 ml water and repeatedly extracted with dichloromethane ( 4 × 10 ml ). dichloromethane was then evaporated under vacuum at 38 ° c . over a rotavapor to give pale yellow colored crystalline product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole . the tlc showed very little amount of unreacted starting material . the crude yield was 2 . 22 gms ( 87 %). the product was purified by recrystalization technique using an appropriate organic solvent to get ( 83 %) yield of pure product . the compound 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyieneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole ( 2 . 0 g , 0 . 003937 m ) was taken in an rb with a tetrabutyl ammonium fluoride [ 4 . 71 ml , 0 . 004724 m ( 1 . 0 m solution in thf )] and the reaction mixture agitated at room temperature for 1 - 3 hrs under anhydrous conditions , followed by addition of 10 ml water and extraction of the product in dcm ( 4 × 10 ml ). the solvent was dried with anhydrous magnesium sulfate after neutralization with anhydrous potassium carbonate . evaporating the solvent gave the product 2 -[ 2 ′- tert - butyldimetylsilyloxy - 5 ′- methyleneoxy (( 1 ″, 2 ″, 2 ″, 6 ″, 6 ″- pentamethyl - 4 ″- piperidinyl ) phenyl ) benzotriazole with a crude yield of 1 . 39 gms ( 90 %). 2 . the process comprises of commonly available organic reagents and employs mild reaction conditions . 4 . reaction can be , carried out via very facile route with very simple and moderate reaction conditions . | Should this patent be classified under 'Chemistry; Metallurgy'? | Is 'General tagging of new or cross-sectional technology' the correct technical category for the patent? | 0.25 | c3c5eba7f59833addb8c8647315fb1fc6ef52a0b7ca18cc2fb507a506b922552 | 0.098145 | 0.04541 | 0.10498 | 0.316406 | 0.172852 | 0.124023 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Is 'Fixed Constructions' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Human Necessities'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.02478 | 0.005219 | 0.004456 | 0.00103 | 0.038574 | 0.003601 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Is this patent appropriately categorized as 'Fixed Constructions'? | Should this patent be classified under 'Performing Operations; Transporting'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.013611 | 0.019775 | 0.00885 | 0.030273 | 0.012024 | 0.031128 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Is 'Fixed Constructions' the correct technical category for the patent? | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.02478 | 0.00885 | 0.004456 | 0.001282 | 0.038574 | 0.018555 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Does the content of this patent fall under the category of 'Fixed Constructions'? | Is this patent appropriately categorized as 'Textiles; Paper'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.026367 | 0.002121 | 0.017456 | 0.000216 | 0.035156 | 0.007355 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Is this patent appropriately categorized as 'Fixed Constructions'? | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.013611 | 0.106934 | 0.00885 | 0.052734 | 0.012024 | 0.233398 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Should this patent be classified under 'Fixed Constructions'? | Should this patent be classified under 'Physics'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.009705 | 0.166992 | 0.004333 | 0.069336 | 0.008057 | 0.115723 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Should this patent be classified under 'Fixed Constructions'? | Is 'Electricity' the correct technical category for the patent? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.009705 | 0.005737 | 0.004608 | 0.004456 | 0.008057 | 0.006897 |
null | single layers ( 2 ) enclose the aggregate ( 1 ) single layers ( 2 ) with small mesh width as template for the defined position of the aggregate ( 1 ) single layers ( 2 ) ensure the compression tension capacity of the member 3 - dimensional tying or interweaving ( 3 , 4 ) perform as fixation for the single layers ( 2 ) and ensure the shear capacity of the member ( see fig1 ) the thickness of the 3 - dimensional mat system can be defined and adjusted precisely , i . e . for abrasive overlays h mat = 10 to 100 mm 3 - dimensional mat system with integrated aggregate ( 1 ) allow in addition the integration of cable channels , heating systems etc . ( see fig7 ) the type and the strength capacity of the material can be composed arbitrarily ( preferably high strength and normal strength steel ) single layers ( 2 ) in expanded metal single layers ( 2 ) in welded or woven meshes fabrication of a 3 - dimensional mat system by interweaving without additional interconnecting elements general remark : the material stiffness can be adjusted by all different types of aggregate ( 1 ), as different types can be combined . type of aggregate : standard ( coarse , stone chips , sand etc . light - and heavyweight hollow core ( works as displacement core ) spec . gravity : extends from extreme light - weight ( hollow ) to heavy - weight shape : arbitrary ( ball , disc , cubic etc .) size : arbitrary ( regulation of dead load and spacing of the single layers ( 2 )) positioning : arbitrary formation and positioning in the horizontal layer of prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( see . fig4 ). vertical positioning of aggregate ( 1 ) by sieving effect of the 3 - dimensional mat system during slurry infiltration ( see fig2 ) aggregate ( 1 ) as hollow core , light - weight → minimization of member dead - load aggregate ( 1 ) as normal - weight → reduction of the fine particles and the shrinkage of the member , increasing of material stiffness aggregate ( 1 ) as heavy - weight → i . e . steel or lead for maximization of member dead load , radiation protection and sound insulation by the member arbitrary shape round shape will fit into the meshes of the single layers ( 2 )= template ( fig4 ) discs and cubic shapes for impervious structures additional density rings might be added if needed , in order to minimize the soaking of the infiltrating liquid ( see fig8 ) performing as a spacer of the single layers ( 2 ) a ) prefabricated 3 - dimensional mat system with integrated aggregate ( 1 ) ( fig1 . 1 ). = aggregate ( 1 ) is positioned between the single layers ( 2 ) before slurry infiltration precise positioning of aggregate ( 1 ) in the horizontal layer regulates the load dispersion like a beam grid and the dead load of the member variants of positioning in the horizontal layer i ) multiaxial beam grid → maximal load capacity of the member ( fig4 ) ii ) diagonal beam grid → minimization of dead load of the member by using hollow aggregate ( 1 ) ( grains ), maximization of dead load of the member by using lead aggregate ( 1 ) ( see fig4 ) precise positioning of aggregate ( 1 ) in 3 dimensions controls the stiffness of the member as well as the load bearing capacity , the deflection , the energy absorption and the dead load b ) prefabricated 3 - dimensional mat system without integrated aggregate ( 1 ) ( fig2 ) = the aggregate ( 1 ) will be sieved into the defined position during slurry infiltration sieving and positioning of aggregate ( 1 ) by variation of the mesh width of the single layers ( 2 ) a 1 ) concrete beam , consisting of the 3 - dimensional mat system a 2 ) concrete beam , consisting of the 3 - dimensional mat system and additional conventional rebars b ) wall members with staggered arrangement and variation of the size of aggregate ( 1 ) advantage : high material stiffness by positioning coarse aggregate ( 1 ) in the compression zone of the member , high bearing load and abrasion resistance minimization of crack width by positioning fine aggregate ( 1 ) in the tension zone of the member crack propagation adjusted by mesh width of the single layers ( 2 ), cracks develop at each mesh node c ) abrasive resistant overlays with staggered arrangement and variation of the size of aggregate ( 1 ) example : 3 - dimensional mat system for filtration of aggregate ( 1 ), performing as sieve advantage : high material stiffness by positioning coarse aggregate ( 1 ) near the surface of the overlay ( compression zone ), results in a high bearing load capacity and high abrasion resistance low material stiffness by positioning fine aggregate ( 1 ) near the bottom part of the overlay ( compression zone ), results in a minimization of the crack propagation and in an increase of durability = long term behavior advantages of the 3 - dimensional mat system for staggered arrangement , positioning and variation of aggregate technical advantages : • 3 - dimensional control of load bearing and deflection of cement bonded members by precise positioning of the 3 - dimensional mat system and the aggregate ( 1 ) • precise positioning of the aggregate ( 1 ) in the horizontal layer ( beam grid see fig4 ) • precise positioning of the aggregate ( 1 ) in 3 dimensions over the cross section of the member ( see fig1 . 1 ) • system without joints by monolithic splicing of the mats • minimization of the concrete embedment =& gt ; the complete height of the cross section can be taken into account for static analysis , =& gt ; minimization of the member thickness =& gt ; no additional spacer for the single layers ( 2 ) necessary =& gt ; cost reduction • 3 - dimensional load bearing capacity • high effectiveness because of maximum distance of single layers ( 2 ) to the neutral axis • precise alignment of single layers , performing as reinforcement • 3 - dimensional interconnection of the mat system increases the shear load capacity of the member • steel volume fraction can be adjusted precisely between 0 . 5 and 15 . 0 % of volume • installation of the 3 - dimensional mat system in defined parts of the member , i . e . only near the member surface • large variety of mat systems possible i . e . with integrated heating wires , prestress of single layers ( 2 ), confinement of structural members • characteristics extremely ductile , high bearing load capacity , minimization of crack development , minimization of inconsistency in material performance by variation and positioning of aggregate ( 1 ), 3 - dimensional structural performance of the mat system • crack width & lt ;& lt ; 0 . 03 mm during service limit state ( conventional concrete w ≧ 0 . 20 mm ) • multifunctional composite material by multiple layer set - up =& gt ; superimposing of a variety of characteristics by one material ( i . e . sound protection , insulation , electric and thermal conductivity , impact resistance etc .) economic advantages : • cost reduction and optimization by variation of the aggregate ( 1 ) • minimization of the construction work by a simplified placing of the prefabricated 3 - dimensional mat system • monolithic continuous system with high load capacity =& gt ; no cost intensive joints necessary • multifunctional material , which covers a variety of performances =& gt ; no cost intensive additional materials necessary • integration of hollow aggregate ( 1 ) as displacement core =& gt ; minimization of dead weight =& gt ; minimization of cost of transport =& gt ; enlargement of precasted structural members = acceleration of the erection of the structure =& gt ; minimization of duration of the construction • simplified elementation =& gt ; sectional system with quality assurance , no specialists for the execution necessary • no embodiment of the single layers ( 2 ) necessary =& gt ; minimization of thickness =& gt ; minimization of dead weight =& gt ; small transporters and cranes the difference in existing methods is , that defined single layers of the 3 - dimensional mat system can be prestressed especially in extremely thin concrete members . the prestressing allows an increase of the member span and crack - free structure . a ) eccentric prestress by prestressing defined single layers ( 2 ) consisting of high strength or equivalent material ( see fig3 . 1 ) b ) center prestress by prestressing either all single layers ( 2 ) or defined layers by keeping the symmetry to the center axis ( see fig3 . 2 ) restoration , retrofit and damp proofing of existing structures as well the production of new structures with long term behavior are important projects for the future . besides the economic advantages the improved characteristics of the composite material , like high load bearing capacity , durability , energy absorption , impact resistance , electrical thermal conductivity , density against fluids , high plasticity and crack control open a large spectrum of applications . preferred applications of the composite material ( mat system + concrete with positioning and variation of aggregate ) are abrasive and impervious overlays , blast barriers , precast elements , arbitrary profiles and shapes . the utilization of the thermal conductivity of the 3 - dimensional mat system ensures a heatable material . this heating effect can be activated in members or areas , which are supposed to be free of ice and snow . ( see table 1 . 2 ) a special monolithic splicing of the 3 - dimensional mat system has been developed , which allows structures free of joints . in addition , the deformation of the 3 - dimensional mat system in combination with a monolithic splicing of the mats are the foundation for a simplified sectional system ( fig5 ), consisting of standard -, angle - and edge - elements . this simplified system ensures an execution with constant high quality and does not require specialized workers . in addition , precast members will be part of the application . based on the flexibility of the 3 - dimensional mat system the precast members can be produced in arbitrary shapes ( tubes , cylindric tanks and any other typical structural profiles ). the prestressing of high loaded thin members allow slim and crack free structures . in addition structures with high energy absorption such as blast barriers , earthquake resistant structures , safes and bunkers , can be created by defined spatial positioning of the aggregate ( 1 ). the material characteristics open up a wide spread field of applications : table 1 . 2 spectrum of applications of the 3 - dimensional mat system with staggered arrangement and positioning of aggregate ( 1 ) application overlays highway and airport pavements , bridge deck overlays , runways , coastal environment , stilling pools , settlement poinds , gas stations , industry floor slabs , loading areas etc . energy absorption ( blast ) military shelters , safety rooms , safes , refuse bunkers , bullet - proof and blast barriers , plastic hinge connections , retrofit of existing structures etc . precast structures tubes , thin facade plates , sacrifice formwork , structural profiles heatable areas runways , ramps , bridges , car - wash , pipes , housing others precast panels , any profile shapes , containers for liquids , tubes , chimneys , radiation absorber , tunnel shells , thin panels , confinement , prestressed and composite structures , sound insulation members etc . [ lit . 1 ] deutscher ausschuβ für stahlbeton : dafstb - richtlinie für umgang mit wassergefährdenden stoffen , 1996 ( germany ) [ lit . 2 ] hauser , s . : ducon ein innovativer hochleistungsbeton , beton - u . stahlbetonbau , february + march 1999 ( germany ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) high concrete stiffness ( e c & gt ; 50 , 000 n / mm 2 ) small concrete stiffness ( e c & lt ; 30 , 000 n / mm 2 ) | Is 'Fixed Constructions' the correct technical category for the patent? | Does the content of this patent fall under the category of 'General tagging of new or cross-sectional technology'? | 0.25 | 862471d6e17e3cbbc6eb3feffc87e06dce53103968f9ee12ec516a499b250256 | 0.02478 | 0.060059 | 0.004456 | 0.236328 | 0.038574 | 0.135742 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Is this patent appropriately categorized as 'Human Necessities'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.044678 | 0.182617 | 0.024414 | 0.122559 | 0.088867 | 0.287109 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Does the content of this patent fall under the category of 'Chemistry; Metallurgy'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.015442 | 0.000687 | 0.007568 | 0.000024 | 0.046631 | 0.001869 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Should this patent be classified under 'Textiles; Paper'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.044678 | 0.048096 | 0.024414 | 0.001755 | 0.088867 | 0.015869 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Does the content of this patent fall under the category of 'Performing Operations; Transporting'? | Should this patent be classified under 'Fixed Constructions'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.070801 | 0.013611 | 0.02002 | 0.010681 | 0.087402 | 0.016357 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Should this patent be classified under 'Performing Operations; Transporting'? | Is this patent appropriately categorized as 'Mechanical Engineering; Lightning; Heating; Weapons; Blasting'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.015442 | 0.001167 | 0.007568 | 0.000336 | 0.046631 | 0.00592 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Is this patent appropriately categorized as 'Physics'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.027588 | 0.012451 | 0.016357 | 0.000488 | 0.062988 | 0.008057 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Is this patent appropriately categorized as 'Performing Operations; Transporting'? | Should this patent be classified under 'Electricity'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.044678 | 0.000393 | 0.024414 | 0.000014 | 0.088867 | 0.000116 |
null | the following described process is preferably carried out or followed by a child in the company of an adult . fig1 is a schematic diagram showing a system appropriate for carrying out the method of the present invention as well as the primary steps associated with the method . in general the system 10 comprises the use of a home based computer 12 having the typical display monitor 14 and keyboard input device 16 . with the software of the system of the present invention operating on computer 12 , two windows are presented on the monitor 14 . the first window is a storybook scene preview window 18 and the second is an adult prompt question window 20 . other windows , images , and text are displayed to the users during the operation of the system and method of the present invention . initially steps are followed to identify the appropriate size of the images to receive the child &# 39 ; s fingerprints , a process described in more detail below . once this sizing routine has been carried out then the process of the present invention proceeds as shown in fig1 . as the storybook scene previews 18 are presented on the display 14 the users step through each page ( selecting scenes as they go ) and then print each page using printer 22 connected to home computer 12 . this results in the collection of loose ( preferably numbered ) printed pages 24 for the various selected storybook scenes , each leaving space ( appropriately sized for the child &# 39 ; s fingerprint ) to allow the child to “ personalize ” and complete the scenes with their fingerprints . this personalizing step is carried out by having the child ink their finger 26 ( which is the thumb in the preferred embodiment , although this is not required ) using ink stamp pad 28 . after each page 24 has been personalized they are all bound together ( in order ) to create the bound storybook 30 . the binding into book form may be accomplished according to any of a number of know ways of binding ( tight or loose ) pages of paper together . reference is now made to fig2 for a more detailed description of the manner of identifying the size of the child &# 39 ; s fingerprint for the purpose of matching ( adjusting ) the template images created by the software to that child &# 39 ; s specific fingerprint size . using a computer printer , the adult and child print out the finger print measurement page 32 . using an ink pad , the adult and child test the child &# 39 ; s fingerprint size in several of the varied sized oval diagrams 36 on the page . from this process the adult and child are able to determine the correct oval size of the child &# 39 ; s personal fingerprint 38 . the adult and child will then select the corresponding letter ( or other indicator ) 34 to be input as the proper size for the child &# 39 ; s fingerprint when his / her storybook is created . the above described process for determining the size of the child &# 39 ; s fingerprint is also described in a step by step manner in fig4 . as indicated above , fig4 is a flowchart showing the steps in the process of determining the appropriate size for the fingerprint templates to be used in the creation of the specific child &# 39 ; s storybook . fingerprint sizing routine begins at step 102 when initiated by the users on the home computer . step 104 involves printing out the fingerprint measurement page ( as seen in fig2 ). the child &# 39 ; s finger is inked at step 106 followed by imprinting the child &# 39 ; s fingerprint on one or more of the test ovals on the measurement page at step 108 . the adult and child then determine , at step 110 , the oval size appropriate for that particular child &# 39 ; s fingerprint . finally at step 112 , the adult and child use the size reference indication ( a letter in the example shown in fig2 ) in the process of creating the storybook template pages at step 112 . in the process of completing the storybook , the adult and child select a storyline topic from the list of storylines that the child can use to tell a personal experience story about themselves ( i . e . nonfiction ), or that the child can relate to well enough to create a fictitious story . the computer will then bring up the screen for that selected storyline . the adult and child then select appropriate scenes from the scene options on the computer screen that support the creation of the storyline . for example , the storyline from the topic “ my first pet ” may have several scene choices on the page that tell where the child got their pet . the child may choose the scene from the humane society , or the pet store , or the breeder , or the back alley , etc . to match the story they are creating . there may be several scene options as the storyline progresses . the adult and child then place the pages in the correct sequence / order to match the child &# 39 ; s storyline . the adult will describe and discuss the story with the child as the pages are organized . the adult / child descriptions and discussions will be very helpful in “ modeling ” the language ( sentences ) for the child that he / she will soon be speaking to create the storybook . the adult and child , working together , use the scene on each page to facilitate and support the words that the child will speak as they tell the words / sentence ( s ) for that page . the parent / adult will use the “ prompt ” questions and comments provided by the software to assist with eliciting the child &# 39 ; s language for the words / sentences that will be typed on each page . the previous two steps will typically happen simultaneously as each page is created . the adult and child then select graphics using screen “ buttons ” to choose character features such as hair , facial expressions , glasses , and accessories appropriate to the specific characters and the words used in the story - line as each page is created . the characters will eventually have a generic body comprised of a fingerprint image . these generic fingerprint images will be absent once the storybook is printed . the void spaces left where the generic fingerprints were shown on the computer screen are to be filled in with the child &# 39 ; s personal fingerprint when the storybook is printed . the adult or child will use the text box to type the words / sentences spoken by the child for each page . the text will be entered in the child &# 39 ; s simple words / sentences ( or a close approximation , thereof ) so as to promote a cognitive comfort - level that will : ( a ) facilitate the child &# 39 ; s fluency of thought and ( b ) encourage literacy - building skills , once the child reads ( or follows the book to retell ) the story he / she has written . once graphics and text are completed in the storybook , the adult uses the computer printer to print the book . the “ prompt ” questions / comments provided on the screen previously will not appear on the pages of the book . the child then ( with the assistance of the adult ) uses an ink pad to “ ink ” the child &# 39 ; s finger tip and carefully place it within the open / void space inside each character image on the first page . the adult and child then continue through the pages of the storybook , being sure to “ ink ” the child &# 39 ; s finger for each fingerprint character on each page . the finished storybook pages may then be professionally bound , spiral bound at a local print shop , or simply placed in a ringed binder or similar home - binding device . the adult will want to encourage repeated sharing of the storybook by the child to further develop expressive language skills and to build literacy and cognitive skills . the above process is shown structurally by the images presented in fig3 and according to the method steps set forth in the flowchart of fig5 . fig3 shows a before and after image of a typical page from the storybook being created . page 40 a is the story scene template page that has been created according to the choices made by the adult and child working together as described above and page 40 b is the same page after the child has placed his / her fingerprint 38 on the appropriately sized “ body ” of the individual 42 in the scene . although the preferred image uses the child &# 39 ; s fingerprint to complete the “ body ” of the individual in the scene , other objects within the scene may also be constructed to be completed or “ personalized ” by the use of the child &# 39 ; s fingerprint . insertion of the fingerprint 38 substantially completes the image of a figure on a skateboard ( in this example ) comprising the fingerprint - ready image 42 and the fingerprint 38 . this image can be further enhanced by coloring ( after the book pages have been printed ) at least portions of the image , and / or adding additional lines to the image , and / or forming a scene which includes the image . various graphic art software routines may be utilized in some embodiments of the present invention to further embellish the scene although one objective of the present invention is to provide a method that does not require the child or adult to have any specific level of artistic talent or ability to create the scene pages . the overall method described above is shown in step by step manner in fig5 . the storybook creation process is initiated at step 122 . the adult and child review the story line list , at step 124 , and select a topic . the system then displays , at step 126 , a start / instruction screen , primarily for the benefit of the adult . at step 128 , the system then displays various scene option that are story line specific . the adult and child then choose , at step 130 , an individual scene to create . the system displays a skeletal framework for the selected scene at step 132 . the adult reviews and speaks the various prompts to the child at step 134 . the child then speaks a response and the child &# 39 ; s language is then entered as text for the scene at step 136 . the adult and child then select the graphics for the character and the scene features at step 138 . if the adult and child are not creating the final scene in the book ( query step 140 ) then the process returns to step 128 where creation of the next scene is initiated . if the final scene has been created then the process proceeds to step 142 where automated compilation of the storybook by the software of the system of the present invention is carried out . in the preferred embodiment of the present invention , the adult and child are presented with the created storybook pages at step 144 . the adult and child confirm each page ( and may preferably be given the opportunity to edit the works ). in providing this review presentation the system may insert a placeholder image of a darkened oval to allow for a preview of how the completed page will look . after the adult and child have confirmed each scene page at step 144 the process proceeds to step 146 wherein each of the pages is printed out . the child then ( with the help of the adult ) then inks his or her finger , at step 148 and places or stamps his or her fingerprint onto each oval area designated for the same on each of the various storybook scene pages . finally , at step 150 the pages of the storybook are bound and the adult and child ( or the child alone ) re - reads the storybook in its hardcopy form . all of the text is preferably developed by the child , that is , there is no pre - programmed text , thus allowing the child to be the sole author of the book . the child &# 39 ; s original fingerprint is used to finish the scenes , thus allowing for customized artwork of the scenes by the child . written prompts are provided ( on the computer screen ) by the software to the adult throughout the scenes . these prompts effectively elicit the verbalized storyline from the child , thus building expressive language skills and literacy skills as the child repeatedly speaks and reads his / her own familiar words . the adult and child together will select ( from a preprinted page ) the correct size of the fingerprint - ready space to be left open / blank / void for the child &# 39 ; s personal fingerprint , which will then be adjusted and placed on the finished pages of the storybook . the selection of the specific fingerprint measurement will automatically adjust the size of the graphic image surrounding the void fingerprint - ready space , allowing for an accurate fit between the image and the size of the child &# 39 ; s personal fingerprint . one objective is to provide a large enough image that the child will recognize the fingerprint as their own and see its consistency throughout the storybook . alternately , the child &# 39 ; s actual fingerprint can be downloaded from a biometric fingerprint reading device and placed within the storybook scenes prior to being printed . the foregoing describes exemplary embodiments of the invention . various modifications of these embodiments , as well as various alternative embodiments of the invention , will be suggested to those skilled in the art . thus , it is intended that the claims define the scope of the invention , and that the claims cover all structures and methods , and their equivalents , encompassed by the claims . various alternate embodiments may implement the basic processes described above . some of the alternate embodiments may include children &# 39 ; s interactive e - books , designed to advance literacy , expressive language , and creative writing skills using the child &# 39 ; s developmental level of imagination and cognition . the child would author their very own book and use their very own fingerprints to complete the pictures in their unique story . the parent or adult may print their child &# 39 ; s pages for a keepsake and create a treasured learning tool that &# 39 ; s filled with personalized memories for both the parent and child . ( a ) “ skeletal ” template pages which will combine to create a story as a finished children &# 39 ; s book . the book can be printed out from a home computer by the author / creator of the individualized / customized book . ( b ) technology which produces the book electronically ( as with an e - book ) or from software such as with the creation of a pdf file , or similar digital graphic imagery software . ( c ) pages in the book will allow for manipulation of images / graphics and the creation of text so that the finished story line and graphics are customized by the individual author . a selection of graphics “ buttons ” will be available to allow various images ( i . e . furniture , pets , etc .) and image features ( i . e . differing hair , faces , glasses , etc .) to be added to the scenery on each page . ( d ) a selection of pages will be available to fit multiple options to the story line ( for example , the child chooses getting his puppy from the pound rather than a pet store .) ( e ) the application will provide suggested “ prompting questions ” to aid an adult in helping the child to determine what to say on each page of the story . the adult may input on the computer keyboard ( if necessary ) the child &# 39 ; s text for each page . as an example , prompt : “ what did you tell dad ? what did dad say about your wish ?” the adult will say , “ let &# 39 ; s put that in your book . what do you want me to type ?” ( f ) scenery within the printed pages will leave empty spaces to allow for added customized finishing of the images with fingerprint ( s ) and / or graphic images that might be created by the child in a personalized manner . implementation of some of the features of the alternate preferred embodiments described generally above is demonstrated in fig6 - 10 . fig6 is a schematic diagram showing a system appropriate for carrying out a full digital implementation of the method of acquiring the child &# 39 ; s fingerprint and utilizing it in conjunction with the overall method of the invention . this alternate method still preferably uses a desk top computer 212 having the typical display , keyboard , and processor components . computer 212 may , however , comprise anything from a smart phone to a tablet computer to a full - sized home computer , each of which may run a version of the software of the present invention suitable for implementation on that type of device being used . the entire system of the present invention may , for example , be implemented in conjunction with a smart phone utilizing a smart phone app with somewhat limited functionality when compared with the full software system operable in conjunction with a desk top computer . the primary difference between the alternate embodiment shown in fig6 and the preferred embodiment described above , relates to the manner in which the fingerprint is incorporated into the storybook construction , as well as the manner in which the words of the child are incorporated into the process . the fingerprint image may be acquired in a manner similar to that described above by using the child &# 39 ; s finger and an ink pad 202 . the child may ink their finger and deposit their fingerprint on a template card 204 . a photograph , or scanned image , of the template card 204 may then be acquired by using smart phone 206 which creates a digital image file of the fingerprint . this file may then be transferred by known digital file transfer methods to the computer 212 for use in constructing the storybook . alternately , a biometric scanner 208 may be utilized to simply scan the child &# 39 ; s finger and create a digital image of the fingerprint directly . this process also produces an image file which is communicated to computer system 212 for use in the construction of the storybook . in addition to the alternate digital methods of acquiring the fingerprint , the alternate method of the present invention shown in fig6 incorporates speech recognition software that may utilize a microphone 210 connected directly into computer 212 or may upload an audio file created with the use of a smart phone having an audio record feature , or any other digital audio recording device . in any event , an audio file may then be input into the software system used to create the storybook , and by means of speech recognition software transcribe the child &# 39 ; s spoken words ( and / or the words of the assisting adult , as necessary ) into the text intended to be associated with particular scenes being constructed . as all of this information is accumulated digitally into computer 212 , the software associated with the operation of the system of the present invention constructs the storybook as described above ( and in more detail again in fig1 below ) by outputting the results to printer 214 which prints an accumulation of pages 216 which may then be bound into the final storybook 218 . one aspect of the digital image input features of this alternate embodiment of the present invention , is the ability to scale both the fingerprint acquired and the graphic elements in the scene being created . fig7 shows the manner in which the standard sized fingerprint 220 may be scaled down to a smaller image 222 so as to match the graphic design 224 and receive the scaled down image as a design component 226 . in a similar manner , an acquired fingerprint 228 may be retained in its digital image size 234 while the graphic design element 230 of the scene to be created may be scaled up or down to match the size of the fingerprint , as shown with graphic design element 232 . reference is next made to fig9 & amp ; 10 for a description of the modified methods associated with the alternate digital processes of the present invention . fig9 discloses the process for acquiring a digital image of the fingerprint and begins at step 240 where the fingerprint scanning routine is initiated . in one embodiment of the invention , at step 242 , a printout of the fingerprint image template is made . at step 244 , ink is placed on the child &# 39 ; s finger and the fingerprint is placed on the image template at step 246 . the user then photographs or scans the fingerprint at step 248 , thereby saving a digital image file of the fingerprint at step 250 . the resultant digital file of the fingerprint is , of course , scalable for use in conjunction with the construction of the storybook . fig1 generally describes the same process as previously shown in fig5 with the modified and / or additional elements associated with digitally acquiring the fingerprint image , scaling the image and the scene graphics , and recording the child &# 39 ; s voice for speech recognition software . in fig1 the storybook creation is initiated at step 260 . the users ( adult and child ) review the story line list and select a topic at step 262 . step 264 involves displaying the start / instruction screen that continues the process for a selected topic . the scene options are displayed at step 266 and the scene to be created is chosen at step 268 . the system then displays the scene skeletal framework at step 270 and the adult reviews and speaks prompts to the child at step 272 . in the alternate embodiment of the present invention shown in fig1 , at step 274 the child speaks a response and his or her voice is digitally recorded . the system then implements speech recognition software at step 276 to transcribe the child &# 39 ; s response into text . the process then proceeds at step 278 where graphics for character and scene features are selected . the system imports the digital image file of the child &# 39 ; s fingerprint at step 280 ( derived from the fingerprint scanning routine shown in fig9 ) and scales the fingerprint and / or the selected scene graphics to match each other at step 282 . query step 284 asks whether the final scene has just been generated . if not , the process returns to step 266 where additional scene options are presented . if the final scene has been created , then query step 284 proceeds to the automated compilation of the storybook at step 286 . the scene pages are displayed for review and confirmation by the child at step 288 , followed by the printing of the pages of the storybook at step 290 . finally , at step 292 the pages are bound into the storybook which may be read ( repeatedly , as desired ) with the child . although the present invention has been described in terms of the foregoing preferred embodiments , this description has been provided by way of explanation only and is not intended to be construed as a limitation of the invention . those skilled in the art will recognize modifications of various features and structures of the present invention that might accommodate specific computer hardware and software environments . as indicated above , the specific images and text that are utilized are not so important as the ability to personalize the images and text according to the child &# 39 ; s interests and desires . various forms of artwork may be used for the storybook such as public domain web art or clip art . the child should be able to choose from a variety of art , scenes , figures , and the like available on the web . the child may also choose to use a photo that they may have uploaded . a child might , for example , place his or her fingerprint image over the body of an animal in a photo taken while at the zoo . a compilation of these photos could be the scenes used to go with the story the child writes ( speaks ) to tell about the trip to the zoo . these variations and modifications do not necessarily depart from the spirit and scope of the invention . | Is 'Performing Operations; Transporting' the correct technical category for the patent? | Is this patent appropriately categorized as 'General tagging of new or cross-sectional technology'? | 0.25 | 0051a4baac1ee8ba7bee9f5313eb3adb021693b9a12e8091faf19ac923adb58b | 0.027588 | 0.115723 | 0.016357 | 0.098145 | 0.062988 | 0.152344 |
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